Find X8’s high-tech chips; international chip manufacturers’ big orders fell through

Latest update time：2024-10-28

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Forehead

Chip Circle

Find X8, a lot of cool tech

On October 24, OPPO released its latest flagship mobile phone Find X8/X8 pro, which completely killed the iPhone 16 series. Not only did it have a big improvement in performance, but it also contained some unexpected black technologies:

X8 also began to use GaN inside the phone, using Innoscience's full-link gallium nitride (AllGaN) technology, that is, from the fast charging on the power side (80W Super Flash Charge and 50W Wireless Charge) to the charging overvoltage protection (OVP) of the phone's internal motherboard, Innoscience GaN is used;
For the first time, OPPO brought chip packaging technology to screen production, achieving a 1.45mm narrow bezel. It took more than three years and an investment of more than 100 million yuan to develop its own chip-level screen production line. The production accuracy is 30 times higher than before, and the process complexity is 10 times higher.

Another chip cooperation failed

Wolfspeed had a "bad" first half of the year, and some institutions even suggested that it be sold. Recently, the company has been even worse. Recently, it was reported that German automotive supplier ZF intends to withdraw from a chip manufacturing project worth $3 billion (about 21.368 billion yuan) with American chip maker Wolfspeed. It is said that due to weaker-than-expected demand for semiconductors, Wolfspeed decided to suspend the project and doubted whether it was worth entering the European market. ZF originally planned to invest $185 million in the Saar plant, which mainly produces electric vehicle chips. (Extended reading: " Silicon carbide is hot, but not profitable? ")

TI adds new 8-inch GaN factory

On October 24, Texas Instruments (TI) announced on its official website that it has begun producing GaN-based power semiconductors at its 8-inch GaN factory in Aizu, Japan. Together with its existing GaN manufacturing plant in Dallas, Texas, TI's internal production of GaN power semiconductors will now increase by four times.

It is reported that TI's Aizu GaN production line in Japan was transformed from an 8-inch silicon-based production line, and its Dallas factory in the United States is also expected to complete the 8-inch transition in 2025. In the future, the two factories will also advance to 12 inches.

Forehead

New Products

Infineon Technologies launches EiceDRIVER 125 V high-side gate driver to protect battery-driven applications in the event of a fault.
Infineon launches CoolSiC Schottky diode 2000 V, with DC bus voltage up to 1500 VDC, higher efficiency and simpler design;
Infineon Technologies launches new PSoC automotive multi-touch controller, providing excellent touch performance for OLED and ultra-large screens;
NXP releases S32J series of secure Ethernet switches to support scalable automotive networks and expand CoreRide platform;
STMicroelectronics launches flexible, space-saving Class-D amplifier for automotive audio;
Toshiba launches the TLX9150M, an automotive photorelay with a 900 V (minimum) output withstand voltage, ideal for 400 V automotive battery applications.
Vishay introduces two new IGBT and MOSFET drivers in compact, high-isolation extended SO-6 packages - the VOFD341A and VOFD343A.
Vishay introduces the industry's most advanced 1 Form A solid-state relay --- VORA1010M4;
Littelfuse launches SMFA Asymmetric Series surface mount TVS diodes, the first asymmetric TVS solution on the market designed to protect silicon carbide (SiC) MOSFET gates from overvoltage events;
Bourns Launches New BVRA Series of Automotive-Grade Low-Voltage Varistors;
Melexis launches a cost-effective solution that simplifies the automotive brake pedal sensing process - MLX90424;
SmartSens launches Star Light (SL) Series 4MP image sensor - SC485SL;
Qualcomm launches the new Snapdragon Cockpit Extreme Edition platform and Snapdragon Ride Extreme Edition platform;
TITAN Haptics launches TITAN Core.

Forehead

Primary Market

Automotive electronics chip company,

Zhixin Semiconductor has completed its B round of financing. It is understood that Zhixin Semiconductor's products have been used in batches in more than 10 automobile OEMs, more than 700 direct customers, and more than 1,200 fixed-point projects. Products include electronic brakes (EPB), lighting control modules, car systems, T-BOX, BMS, shifters (E-SHIFT), etc.

Wire control brake Enterprise, financed

Jiongyi Electronics, a leading domestic EMB company, has completed a Pre-A round of financing of nearly 100 million yuan. This round of financing will be mainly used for the continuous iteration of EMB products and the strengthening of supply chain capabilities, so as to make adequate preparations for the earliest realization of EMB mass production in China. Jiongyi Electronics was established in June 2022 and is one of the earliest companies in China to start the research and development of automotive wire control brakes. Its main products include wire control brake systems EMB, electronic parking systems EPB, and high-performance fixed calipers. The company is located in Suzhou Taicang High-tech Zone.