Inspire your design inspiration and come to CITE2019 to see the comprehensive solutions for innovative application of CEC devices
No matter you are a great programmer!
He is also a master of layout formation!
He is also a hardware tycoon who makes good use of electronic components!
I will be there dressed up...
No matter who you are!
You are the Internet of Things with all-seeing eyes!
You are an artificial intelligence equipped with a brain!
You are a sensor that reads people’s minds!
You are the 5G that replaces the carrier pigeon!
You are the smart home that plays the role of a warm man!
I will treat you with courtesy there...
Who am I?
I am CITE Exhibition Hall 1, booth
1C070, China Electronics Port.
See you at Shenzhen Convention and Exhibition Center from April 9 to 11, 2019!
The opening of the 7th China Information Technology Expo CITE2019 is imminent. It is expected that more than 1,800 exhibitors and 120,000 professional visitors will gather together to display and discuss cutting-edge technologies and innovative applications in the field of electronic information. The electronic component industry application innovation platform, China Electronics Port, will also work with industry partners such as AMD, Maxim, Microchip, NXP, and ON Semiconductor to exhibit a series of application innovation comprehensive service solutions for the fields of automobiles, the Internet of Things, cloud computing, and big data at this exhibition. China Electronics Port's design chain innovation platform Firefly Factory, component e-commerce Ai Siyi, and supplier platform Yi Ancang will also appear together to help more professionals inspire innovation and design inspiration and find comprehensive service solutions that are closer to their needs. In addition, on the afternoon of April 9, China Electronics Port will also host the first China Core Application Innovation Summit Forum and the China Core Application Innovation Design Competition Launch Ceremony, inviting guests from all walks of life related to the China Core Ecosystem Chain, including government, enterprises, academia, research, and users, to share experiences and wisdom and make suggestions for the development and application innovation of China Core.
At the China Power Port booth, you will be able to see the following hot solutions:
in-vehicle surround view ADAS solution;
new energy vehicle functional safety BMS solution;
T-Box safety connection overall solution
etc.
Hot Solution 1: In-Vehicle Surround View ADAS Solution
The 360-degree panoramic view system has four wide-angle cameras installed around the car that can cover the entire field of view around the vehicle. It processes the multiple video images collected at the same time into a 360-degree overhead view of the vehicle's surroundings, which is displayed on the screen of the center console. This allows the driver to clearly check whether there are any obstacles around the vehicle and understand the relative position and distance of the obstacles, helping the driver to park the vehicle easily.
Hot Solution 2: New Energy Vehicle Functional Safety BMS Solution
NXP BMS solution is a product-level solution based on MC33771 (lithium battery management chip AFE) + MC33664 (high-speed transformer isolation driver) + MPC5744/S912XET256 (automotive functional safety PowePC/automotive-grade MCU) + TJA1052I (automotive-grade isolated CAN communication). It realizes the measurement of lithium battery pack voltage, current, temperature, internal resistance, SOC; 35 fault monitoring items such as disconnection, overvoltage, undervoltage, overtemperature, etc.; supports intelligent balancing and 45 system self-tests and other multi-functions.
Hot Solution 3:
T-Box Secure Connection Overall Solution
T-Box generally refers to the intelligent vehicle terminal in the Internet of Vehicles system. It communicates directly with the car CAN bus to obtain the body status and vehicle condition information, and uploads these parameters to the TSP background. It can also receive instructions issued by the background and return the execution results. Based on this, the remote control function can be extended to mobile phone apps, smart keys, etc., and support various external audio and video entertainment systems.
With the continuous rise of China's core power and the continuous changes in the world pattern, everyone from enterprises to governments, from universities to research institutions, has invested great determination and resources in the technological development and innovative applications of China's core. China's core will surely usher in a historic development opportunity, and everyone has more imagination and expectations.
On the afternoon of April 9th, we invite you to gather in the Bougainvillea Hall on the 5th floor of the Shenzhen Convention and Exhibition Center to participate in the China Chip Application Innovation Summit Forum and the launch ceremony of the China Chip Application Innovation Design Competition, and discuss how to promote application innovation and jointly build a Chinese chip ecosystem.
There is still a long way to go for Chinese chips to become the world's chips, but we believe that the rise of Chinese chips will be unstoppable. In this event, we invited guests from the government, enterprises, academia, research, and application sectors related to the Chinese chip ecosystem to share their experiences and wisdom and make suggestions for the development and application innovation of Chinese chips. As our most valued industry partner, we sincerely invite you and your friends to attend this event, listen to the development trends of China's integrated circuit industry and application fields, help local integrated circuit innovation and application, and work together to build a Chinese chip ecosystem!
Long press or scan the QR code below to register now!
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