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Daily Core News
Issue
0406
❶With
a registered capital of 1 billion yuan, BYD and XCMG jointly established a battery company
Xuzhou Xugong Fudi Battery Technology Co., Ltd. was established with the legal representative Li Fengzhang and a registered capital of 1 billion yuan. Its business scope includes battery manufacturing, battery sales, new energy vehicle waste power battery recycling and cascade utilization, etc. The equity penetration chart shows that the company is jointly held by Fudi Battery Co., Ltd., a wholly-owned subsidiary of BYD, and Xuzhou Engineering Machinery Group Co., Ltd., an affiliated company of Xugong Group. According to news released by Xuzhou, on November 8, 2022, the Xuzhou Municipal People's Government signed a strategic cooperation agreement with BYD Co., Ltd., and Xugong Group signed a joint venture agreement with Fudi Battery.
❷Helium
Star Optical Network completed a new round of financing to accelerate the construction of laser communication terminal mass production lines
Recently, Helium Star Optical Alliance completed a new round of financing worth tens of millions of yuan. This round was led by Yonghui Capital, and was jointly invested by Zijingang Capital, Chuangxiang Capital, Jiaxing Black Box, and old shareholders Orient Securities Innovation and Hangzhou Aohua. Helium Star Optical Network news shows that this is the fifth round of financing completed by the company. The funds will be mainly used to accelerate the construction of the Helium Star Optical Link laser communication terminal mass production line, the development and innovation of new generation products, and the expansion of commercial partnerships; to improve the speed of transformation of technological achievements and core competitiveness; to provide customers with high-quality space communication payload products and Satellite internet communication solutions.
❸Yiji
Technology signed a contract with Hangzhou Fuxin Semiconductor FMEA digital software
Recently, Shanghai Yiji Technology Co., Ltd. successfully signed a contract with Hangzhou Fuxin Semiconductor FMEA digital software. It is reported that the Hangzhou Fuxin Electronics Factory Project has a construction area of approximately 260,000 square meters and is the first 12-inch wafer production line in Zhejiang Province. Public information shows that the total investment in the project reaches 40 billion yuan, and the project will be carried out in two phases. The investment in the first phase of the project is 18 billion yuan. The project aims to build a dedicated production line for high-end analog integrated circuits, with a planned production capacity of 50,000 pieces per month. The main products are high-performance analog chips for automotive electronics, 5G communications, cloud computing, and artificial intelligence.
❹
The 2.2 billion yuan Yuexiu Nanchang Fund was established, focusing on industries such as intelligent connectivity and new energy vehicles
At the ceremony, Yuexiu Industrial Fund, Yuexiu Industrial Investment, Jiangxi Talent Fund of Funds, and Jiangxi Financial Holdings Group jointly launched the Yuexiu Nanchang Fund with a scale of 2.2 billion yuan. Yuexiu Industrial Fund news shows that the fund adopts the investment strategy of direct equity investment (D), fund second-hand share (S), and sub-fund investment (G), focusing on the new generation of information technology, biomedicine, intelligent network connection and new energy vehicles. , aerospace and robotics and other high-end equipment, new energy and new materials and other strategic emerging industries.
❶Intel
will launch new GPUs in 2024 and 2026
Foreign media sources show that Intel is currently promoting GPU research and development projects as planned. Industry rumors say that it will launch the second-generation Battlemage GPU in the second half of 2024, manufactured using the 4nm process, and the third-generation Celestial GPU in the second half of 2026, manufactured using the 3nm process. . It is reported that TSMC has recently won a very large GPU production order from Intel, including the above-mentioned Battlemage and Celestial. It was reported last year that most members of the Intel GPU development team have transferred to the development of the second-generation product Battlemage, while early driver and software stack work is also underway and even individual members have started working on the third-generation product Celestial. preliminary work.
❷Japan
’s new target is 778 billion!
On April 3, CCTV News quoted Reuters as saying that Japan’s Ministry of Economy, Trade and Industry announced a revised plan for the “Semiconductor Digital Industry Strategy” that day. According to reports, the revised plan sets the goal of Japan’s efforts to increase domestic sales of semiconductor and digital industries to three times the current level and exceed 15 trillion yen (approximately RMB 778.08 billion) by 2030. To achieve this goal, additional official and private investment of approximately 10 trillion yen will be required.
❸Samsung
enters the SiC industry, and the development of South Korea’s third-generation semiconductor industry accelerates
According to Korean media reports, Samsung Electronics is accelerating its entry into the next-generation power semiconductor market. After establishing a power semiconductor TF related to the development of SiC and GaN devices, it is currently actively investing in facilities required for R&D and prototype production. According to reports, Samsung Electronics is trying to introduce more advanced 8-inch silicon carbide process equipment. It is understood that the investment completed so far is approximately 100 billion to 200 billion won (approximately 600-1200 million yuan). The scale of investment is sufficient to enable mass production of prototypes, not just simple process development. Compared with silicon-based semiconductors, SiC semiconductors have superior high-voltage and high-temperature performance and are attracting attention as semiconductor devices for electrical equipment, renewable energy, and industrial applications. The market is currently dominated by semiconductor companies from Germany, the United States and Japan.
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