Last time, I made a post comparing the performance of headphones with the MP34DT04-C1 microphone integrated with SensorTile. The method used was to use the audio DAC to generate sinusoidal signals fro
Molding compound, epoxy molding compound, packaging material and packaging technology development trend outlook Liu Zhi : 13611616628Shanghai Changxiang Industrial Co., Ltd. ( http://www.cncun.cn )
The new wave of demand for Bluetooth devices, cordless phones and cellular phones is prompting Chinese electronic engineers to pay more and more attention to RF circuit design skills. The design of RF
Web2.0 war spreads to mobile IM, scramble for discourse power before 3G 2006-7-10With the impending arrival of 3G, the demonstration effect of 2G services, and the widespread development of web2.0, ov