• You can log in to your eeworld account to continue watching:
  • 802 11ah MAC 4
  • Login
  • Duration:8 minutes and 47 seconds
  • Date:2017/07/21
  • Uploader:老白菜
Introduction
The architecture of the Internet of Things is mainly divided into three layers:
1. Perception layer (Sensors and Sensor networks),
2. Network layer (3G/4G/5G communication network),
3. Application layer (cloud services for various applications).
Perception layer Mainly discusses various wired or wireless sensors (such as temperature, humidity, brightness, gyroscope, three-axis accelerometer, heartbeat, blood pressure, pulse, etc.) and how to construct sensor networks to transmit the data collected by the sensors It is a very challenging task for sensors to achieve low power consumption (high battery life), low cost, small size, long wireless transmission distance, etc. The network layer mainly discusses how to use existing wireless or wired networks to Effectively transmit the collected data, such as using existing 3G/4G wireless transmission technology, or future 5G wireless transmission technology, etc. The application layer mainly explores how various application fields use the results of big data analysis to provide feedback and Control sensors or controller adjustments, etc. Overall, the Internet of Things is a living ecosystem. Sensors collect data and transmit it back to the cloud processing center through mobile phones or other device networks. After analysis, the control information is It is passed back to the controller for various fine or delicate controls.
Unfold ↓

You Might Like

Recommended Posts

USBHOST issue with STM32F107
I recently developed a program for stm32f107 chip to read USB disk. So far, I have successfully implemented: USB disk insertion detection, USB bus reset, start SOF, enumerate USB disk, and send and ex
filmwind stm32/stm8
How to set up a personal signature?
I have just opened a forum for Electronic Engineering Home, but I don’t know how to set up my personal signature for the forum and blog. Can anyone tell me? Thank you!
samsrmotor Talking
Huawei's protection circuit design specifications
[align=left][size=3]防护电路设计规范[/size][/align][align=left][size=3] [/size][/align][align=left][size=3][color=#a0522d][/color][/size][/align][align=left][size=3][color=#a0522d] [/color][/size][/align][ali
qwqwqw2088 Analogue and Mixed Signal
Problem with BulkUsb in DDK example?
I have just started to develop drivers. Recently, I tested the driver compiled by bulkusb in DDK. The application program also uses the exe in bulkusb of DDK example. However, I found some problems. I
taorufei Embedded System
The measured data does not match the actual data? Is there something wrong with the data transmitted by DMA?
[code]#include "bsp_adc.h" #include "stm32f10x_dma.h" #include "stm32f10x_adc.h"#define ADC1_DR_Address((u32)0x40012400+0x4c)__IO uint16_t ADC_ConvertedValue[2];floatADC_ConvertedValueLocal[2];/*** @b
醉酒的孩子 stm32/stm8

Recommended Content

可能感兴趣器件

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号