WPG Group launches low-power Bluetooth audio solution based on Qualcomm products

WPG Group launches low-power Bluetooth audio (LE Audio) solution based on Qualcomm products

On March 10, 2022, WPG Holdings, a leading semiconductor component distributor dedicated to the Asia-Pacific market, announced that its subsidiary Quan Ding launched a low-power Bluetooth audio (LE Audio) solution based on Qualcomm's QCC3056 chip .

Figure 1- A display board of DaWan Daquan Ding's low-power Bluetooth audio (LE Audio) solution based on Qualcomm products

On January 6, 2020, the Bluetooth Special Interest Group (SIG) announced the new Bluetooth core specification CoreSpec5.2, the most eye-catching of which is the release of the next-generation Bluetooth audio LE Audio . LE Audio not only supports stereo in connected and broadcast states, but also enhances Bluetooth audio performance through a series of specification adjustments, including reducing latency and enhancing sound quality through LC3 codec. After achieving short-range connectivity through LE, Bluetooth will be completely reborn and take off in the era of the Internet of Things with the help of LE Audio. The low-power Bluetooth audio (LE Audio) solution based on the Qualcomm QCC3056 chip developed by Dalian Daquanding integrates the functions required for the next-generation Bluetooth products, supports the Bluetooth 5.2 standard, and has the characteristics of low power consumption and low latency.

Figure 2-Application scenario of DaWan DaQuanDing's low-power Bluetooth audio (LE Audio) solution based on Qualcomm products

Qualcomm's QCC3056 is an ultra-low power, single-chip solution that is optimized for true wireless headphones and ear-worn devices, helping manufacturers achieve differentiated designs at a range of levels. QCC3056 integrates a 1x80MHz 32-bit Programmable Apps CPU and a 2x120MHz DSP programmable. While supporting Adaptive ANC, aptX HD, aptX Adaptive, and CVC, it also supports the LE Audio standard, which helps early OEMs develop true wireless earbuds with new audio sharing use cases.

Figure 3 - Block diagram of Wanda's LE Audio solution based on Qualcomm products

LE Audio is the new cornerstone of Bluetooth audio in the future. As the physical interfaces of mobile phones are gradually eliminated, Bluetooth headsets, speakers, and many audio scenarios will become a huge stage for LE Audio. Under this trend, this solution will shorten the R&D cycle for customers and accelerate the time to market.

Core technology advantages:

• Bluetooth 5.2 version, more stable connection, smaller delay and lower power consumption;

• Support for the upcoming LE Audio;

• Dual-channel stereo output, suitable for TWS earphones and sports and headphone products;

• Support Qualcomm TrueWireless Mirroring, seamless switching technology;

• Supports Qualcomm®aptX and aptX HD Audio, as well as Adaptive aptX and aptX Voice;

• Integrated Qualcomm third-generation ANC noise reduction function, better noise reduction effect, including modes: Hybrid, Feedforward, Feedback modes and Adaptive ANC modes;

• Greater transmit power can increase the Bluetooth distance, and the maximum transmit power can reach 13dBm.

Program Specifications:

• Bluetooth v5.2 specification, supports 2M, 3M rates, and LE Audio;

• Qualcomm TrueWireless Mirroring Stereo Earbuds;

• Support for wake-word and button-activated digital assistants, including Amazon Alexa Voice Service and Google Assistant;

• Support Google Fast Pair;

• Dual 120 MHz Kalimba™ audio DSPs;

• High-performance 24-bit audio interface;

• Digital and analog microphone interfaces;

• Flexible PIO controller and LED pins with PWM support;

• Serial interfaces: UART, bit serializer (I²C/SPI), USB 2.0;

• Support for Qualcomm® Active Noise Cancellation (ANC) – feed-forward, feedback and hybrid – and adaptive ANC;

• aptX, aptX Adaptive and aptX HD audio;

• 1 or 2 microphones Qualcomm® cVc™ headset voice processing;

• Qualcomm® aptX™ Voice for exceptional call quality on uplink and downlink;

• Ultra-low power consumption current: <5 mA;

• Ultra-small form factor: 4.38 x 4.26 x 0.4mm.