Liexin Semiconductor Launches the World's Smallest 4G/5G MMMB PA at 2.5mmX3.5mm

In November 2021, Liexin Semiconductor officially launched a new generation of 4G/5G MMMB PA product OC8512-10. The package size has once again achieved a major breakthrough, only 2.5mmX3.5mm, once again surpassing the world's smallest size of the ultra-small 4G/5G MMMB PA created by Liexin Semiconductor itself. OC8512-10 is Liexin Semiconductor's second-generation ultra-small 4G/5G multi-mode multi-frequency RF power amplifier chip. Once it was launched on the market, it was popular in the market. It has now been mass-produced and shipped by many leading brand manufacturers of mobile phones, wearables and IoT modules, and has been selected as a reference design by mainstream platform manufacturers.

Figure 1: Actual picture of the OC8512-10 chip of Liexin Semiconductor

According to IDC's forecast, the compound growth rate of China's IoT connections will be about 17.8% from 2020 to 2025, and the total number of connections will reach 10.27 billion by 2025, of which cellular network connections will account for about 3 billion. This data is only an estimate of the number of domestic IoT connections, and the number of global IoT connections is several times that amount. The explosive growth of IoT connections in recent years has led to a booming mobile terminal incremental market, and the demand for PA chips that can meet the application characteristics of this market is becoming increasingly strong. OC8512-10 4G/5G MMMB PA perfectly meets the needs of such applications with its high performance, small size, low cost, superior quality and stability.

Figure 2: China's IoT connection scale and growth rate

Liexin Semiconductor continues to lead the industry in ultra-small size, ultra-high integration and ultra-high performance RF front-end products. In August 2019, Liexin Semiconductor pioneered the world's smallest size, 4mmX4mm OC9743. OC9743 shrinks the mainstream 4mmX6.8mm chip to 4mmX4mm. It is the first time that a domestic chip design manufacturer has defined an RF PA chip with an original size, and has successfully become the industry's 4G/5G MMMB PA chip standard package size. OC9743 provides customers with a smaller size, higher performance and lower cost solution, and has been recognized by the market for its outstanding advantages. In more than two years, more than one hundred customers have adopted Liexin Semiconductor's OC9743 series products. Based on this product, end customers have successfully improved product competitiveness and launched the industry's ultra-small size and ultra-low cost module products.

The 2.5mmX3.5mm second-generation ultra-small 4G MMMB PA launched by Liexin Semiconductor has once again revolutionized the package size of similar mainstream 4mmX6.8mm products by 68%, and is 45% smaller than the first-generation 4mmX4mm OC9743. The huge size reduction further optimizes the product's integration, performance and cost, providing customers with better solutions. Terminal products based on this chip have stronger core competitiveness than similar products.

Figure 3: Comparison of the second-generation ultra-small OC8512, the first-generation ultra-small OC9743, and the regular-sized OC9643 chips from Liexin Semiconductor

The independently created new architecture is the foundation for XinXin Semiconductor to achieve smaller size and higher performance chip design. The research and development of the OC8512-10 PA chip took nearly a year. Under the leadership of Dr. Ren Qiming, the team broke through many technical difficulties and achieved the ultimate in performance, size and cost, becoming another benchmark product in the RF front-end field after OC9743. Dr. Ren Qiming returned to China from the United States in 2021 to join XinXin Semiconductor and is currently the company's CEO. Dr. Ren obtained a doctorate in engineering in Germany and has more than 30 years of experience in RF front-end chip research and development. He has worked for many RF chip giants in the United States such as Skyworks, Qorvo, etc., and has rich domestic entrepreneurial experience. Dr. Ren said: "Technological innovation of products has always been the core competitiveness of the company. Liexin Semiconductor has an advanced R&D system and has made many innovations in architecture and circuits. It has applied for more than 30 inventions, utility models and integrated circuit layout patents. The company insists on technological breakthroughs and innovations as the driving force for development, and will continue to provide customers with RF front-end chip products with more outstanding performance, superior quality and greater value." In addition, Dr. Ren revealed: "Liexin Semiconductor is now continuously developing high-performance RF front-end products in multiple product lines such as 4G, 5G, FEMiD and PAMiD. The company will continue to contribute to the development of the Internet of Things and cellular network markets and contribute to the construction of the semiconductor industry."

While constantly innovating, Liexin Semiconductor also attaches great importance to intellectual property protection. For products of competitors suspected of serious infringement of product design patents, Liexin Semiconductor's legal team has formally resorted to law to safeguard its rights and interests in accordance with the law, and strive to create a positive and healthy business environment in the semiconductor field. As integrated circuits have been identified as a national strategic key industry, the protection of related patents has increased year by year, and case trials have become more complete and professional. Liexin Semiconductor has always believed that only by effectively protecting integrated circuit technology innovation can we stimulate and encourage more competitive original products and promote the healthy development of the country's semiconductor industry.

About Liexin Semiconductor:

Liexin Semiconductor was founded in July 2018. Its core technical team comes from top manufacturers such as Skyworks, RFMD, and Huawei HiSilicon. Since its establishment, Liexin Semiconductor has seized market opportunities and quickly launched a number of independently innovative 4G/5G multi-mode and multi-frequency RF front-end chips, with more than 30 design patents. With the superior performance, ultra-high integration, and ultra-small package size of its products, Liexin Semiconductor has quickly occupied the technical commanding heights of RF front-end PA chips in the field of the Internet of Things, and has achieved large-scale mass production and shipment in nearly 100 communication module, wearable and mobile phone manufacturers, creating great value for customers and gaining high recognition in the industry. Liexin Semiconductor has the qualification of a high-tech enterprise and has passed the ISO9001 quality management system certification; it won the "Investment Institution Recommendation Award" and "Most Investment Value Award" in the 2021 China Core Power Selection. With the release of OC8512-10, Liexin Semiconductor will further consolidate its leading position in RF front-end products such as 4G/5G MMMB PA, and promote technological innovation and development in China's mobile communications market.