Industry sources revealed that Taiwan-based packaging and testing manufacturers such as ASE and Powertech Technology are stepping up efforts to expand high-end back-end services for the new iPhone and other Apple devices.
digitimes reported that sources said that ASE is not only busy packaging and testing AiP modules for the new 5G iPhone, but also continues to conduct comprehensive testing of Qualcomm's modem chips and RF modules developed for the iPhone 13 series.
"ASE's EMS business also improved in September as its subsidiary USI started fulfilling orders for new Apple devices," the source added.
In addition, as the new iPhone is equipped with a larger memory storage capacity, storage packaging and testing manufacturer Powertech Technology is expected to achieve considerable revenue growth by completing Apple orders during the peak season. The company's revenue in August reached NT$7.538 billion.
At the same time, TSMC's back-end subsidiaries Xintec and VisEra Technologies are also urgently processing DOE (diffractive optical element) components and wafer-level optical films for the new iPhone's 3D facial recognition module.
The sources added that while the new iPhones will gain market traction in the coming months, sales momentum for Android phones, especially 5G models, may weaken slightly, affecting demand for testing of 5G peripheral chips.
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