TSMC officially confirmed this week that its 3nm process (also known as N3) mass production has been delayed by about 3 to 4 months, and this problem has seriously affected its customers. This means that Apple's 2022 iPhone will miss the N3 node and can only adopt N4.
It was previously reported that Apple has received a 4nm chip order from TSMC, which is expected to start production in the fourth quarter of 2021, and has also placed a 3nm order. According to Seeking Alpha, TSMC plans to mass-produce 3 million chips in the second half of next year, and these chips are likely to be used in the iPhone 14 series.
Like TSMC, Samsung is also facing production difficulties with the 3nm GAA process, so its mainstream products next year will still use 4nm. In addition, if TSMC cannot solve the yield problem in the short term, the A16 Bionic and Qualcomm's Snapdragon 898/Plus may both be manufactured using the 4nm process.
IT Home learned that TSMC also plans to manufacture 2nm chips for the iPhone in 2024, but due to delays in its 3nm technology, subsequent advanced technologies may be further delayed.
Previous article：With so many competitors vying for supremacy, who can replace Huawei?
Next article：After receiving investment from Habo, Yutaiwei also received investment from Xiaomi Industrial Fund
- Popular Resources
- Popular amplifiers
LT6700HDCB-1#TRM
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claimsAccording to foreign media reports, recently, the British consumer rights organization "Which?" filed an antitrust lawsuit against Apple on behalf of approximately 40 million iCloud users, accusing Apple of violating competition laws and seeking up to $30 million in damages. ...
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thickerOn November 11, sources Jukanlosreve and yeux1122 revealed that both Apple and Samsung's ultra-thin high-density battery projects had failed. The two companies had previously tried to develop ultra-thin high-density batteries in their iPhones. ...
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable developmentAt this year's CIIE, Micron shared the latest progress of the Xi'an packaging and testing plant expansion project, and shared with relevant partners on the theme of "Talking about Empowerment: Co-promoting Coexistence of Business and Sustainable Development"....
- Qorvo: Innovative technologies lead the next generation of mobile industryAt the 12th China Hard Technology Industry Chain Innovation Trend Summit held recently, Qorvo China Senior Sales Director Jiang Xiong shared Qorvo's technological innovation and market development in the new generation of 5G applications. ...
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screenBOE (BOE Oriental) exclusively supplies Nubia and Red Magic flagship new products. The new generation of under-screen display technology leads the industry into the era of true full-screen. On November 5, BOE (BOE Oriental) joined hands with Nubia, ...
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Melexis launches ultra-low power automotive contactless micro-power switch chip
- Molex leverages SAP solutions to drive smart supply chain collaboration
- Pickering Launches New Future-Proof PXIe Single-Slot Controller for High-Performance Test and Measurement Applications
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- The US asked TSMC to restrict the export of high-end chips, and the Ministry of Commerce responded
- The US asked TSMC to restrict the export of high-end chips, and the Ministry of Commerce responded
- ASML predicts that its revenue in 2030 will exceed 457 billion yuan! Gross profit margin 56-60%
- Detailed explanation of intelligent car body perception system
- How to solve the problem that the servo drive is not enabled
- Infineon Development Board 618 Promotion: The hot-selling list is revealed, with great gifts!
- Are there any people using Chinese MCU or Huada MCU in the forum?
- In the if else statement in C language, there is only one line of code after if. What is the impact of adding a semicolon after it?
- How to migrate SES project from GNU toolchain to Segger toolchain?
- 【GD32450I-EVAL】+ 09 Ethernet module test
- How to judge whether an operational amplifier is good or bad
- Let’s talk about it: Why is 5G a revolution?
- Crossing your legs has so many harmful effects? Do you still dare to do it after reading this?
- RSL10 Bluetooth SoC Mobile Application Construction 2 - Reading Data
- Automobile coolant temperature sensor signal auto repair oscilloscope measurement
京公网安备 11010802033920号