According to Jiwei.com news, on April 21, the completion and commissioning ceremony of the first phase of the high-end packaging project of Jiangsu Xinde Semiconductor Technology Co., Ltd. (hereinafter referred to as: Xinde Technology) was held in Nanjing Pukou Economic Development Zone.
It is reported that the high-end packaging base project of Jiangsu Xinde Semiconductor Technology Co., Ltd. took 6 months from construction to production, and was jointly invested by high-quality venture capital institutions and professional talent teams in the industry, with a total investment of 950 million yuan. The project's output value will reach 300 million yuan in 2021 and 1 billion yuan in 2022. It is planned to enter the listing stage within three years and reach an output value of 5 billion yuan within five years.
According to the Pukou Economic and Technological Development Zone, with the production of Huatian Technology and Xinde Technology and the signing of the contract to settle in Changjing Pulian, the Pukou Economic and Technological Development Zone has achieved the gathering of the three leading companies in the field of integrated circuit packaging and testing in China, laying a solid foundation for the park to build an integrated circuit industry landmark with global influence during the "14th Five-Year Plan" period.
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