On November 9, the 18th China Semiconductor Packaging and Testing Technology and Market Annual Conference was held in Tianshui, Gansu. At the conference, Wei Shaojun, the leader of the overall group of the National Science and Technology Major Project (01) Special Expert Group, mentioned the issue of Sino-US relations when making a keynote report.
Regarding Sino-US relations, Wei Shaojun mentioned that, on the one hand, with the new US President Biden taking office, restarting the economy will be the primary issue he faces due to the impact of the new coronavirus. On the other hand, Sino-US conflict will not occur in the short term, because Biden also needs time to form his own trade policy toward China, so the status quo of Sino-US economic and trade will not change. However, we should be fully prepared, stick to our own views, keep moving forward, and don't pin our hopes on the US approach.
In addition, everyone is more concerned about the problems between China and the United States in the semiconductor industry, especially the issue of what stage China's semiconductor industry will be in in the future. Wei Shaojun believes that the US's goal is to keep China at the bottom of the value chain and create conditions for US industrial dumping. Therefore, we must become an indestructible cockroach and make full use of this time to find ways to grow ourselves.
"What we need now is time to develop, not time to quarrel," said Wei Shaojun.
He added that according to an analysis by the Boston Consulting Group, if the United States completely cuts off ties with China, U.S. semiconductor research and development and investment will probably drop by 30% to 60%, and the United States may not be able to develop leading technology.
Americans have a sense of crisis, and China must also prevent a decline due to isolation. "The U.S. suppression of China has made us feel painful and aggrieved, and has forced us to make domestic substitutions, but at the same time we must remain calm and rely on innovative technology to lead in the future," said Wei Shaojun.
He also mentioned that China still needs to cooperate with the United States in competition. Most domestic markets are already saturated, and Chinese companies must go global, so China must open up, otherwise even its own industries may not be able to develop.
Back to China's development, Wei Shaojun boldly predicted that semiconductors may be the last shortcoming of the information industry. If the shortcoming is made up, the competitiveness of China's information industry may explode on a large scale.
Previous article:Wei Shaojun: The success or failure of China's integrated circuit industry depends on strategic determination
Next article:Semiconductor concept stocks generally rose, and Will shares once again stood firm at the 200 billion yuan market value mark
Recommended ReadingLatest update time:2024-11-16 04:15
- Popular Resources
- Popular amplifiers
- Optimized drivetrain and new semiconductor technologies enable the design of energy-efficient electr
- VLSI Physical Design: From Graph Partitioning to Timing Closure
- Chip Manufacturing: A Practical Tutorial on Semiconductor Process Technology (Sixth Edition)
- Fundamentals of Power Semiconductor Devices (B. Jayant Baliga)
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- Configuration of character overlay chip 90092
- The normalized epidemic situation is still exploited by the virus
- Introduction to ARM SWD Protocol
- Introduction to the mobile station development board: ultra-low power python board
- USB to JTAG
- DSP28335 SCI communication problem summary and problem summary
- Beetle ESP32-C3 test (IV) IDF method to provide AP connection
- Several questions about 7S3P battery pack circuit
- MSP430G2553 clock system configuration
- Award-winning live broadcast: Microchip&avnet series live broadcast third collection