A complete set of RF EDA simulation software developed by the Shanghai Jiaotong University team was unveiled

Recently, the 22nd China International Industry Fair was held in Shanghai. A complete set of RF EDA simulation software independently developed by the research team of Mao Junfa, an academician of the Chinese Academy of Sciences and vice president of Shanghai Jiao Tong University, and Professor Wu Linsheng participated in the exhibition.

The project was jointly conducted by the research team of Academician Mao Junfa and Professor Wu Linsheng, and Xinhe Semiconductor Technology (Shanghai) Co., Ltd., and was supported by the National 973 Project, the National Natural Science Foundation, the National Major Special Project, and the Shanghai Science and Technology Commission's scientific research plan project.

According to China News Service, researchers have proposed efficient electromagnetic and multi-physics simulation modeling algorithms, independently developed simulation software, realized multi-physics and multi-function automated collaborative design of devices, and jointly established an integrated passive device intellectual property (IP) library based on the above results, and developed a number of products, which have been promoted and applied in many fields such as mobile communications, satellite communications and integrated circuits, making important contributions to China's breaking the international blockade in the field of RF EDA software.

In addition, the researchers also proposed an accurate and efficient electromagnetic field analysis algorithm based on generalized transmission matrix and an electromagnetic-thermal-stress coupled multi-physics field simulation algorithm, and jointly developed the first domestically produced RF circuit chip-3D packaging joint electromagnetic field simulation modeling commercial software. This software can solve the cross-scale simulation problem of chip-level packaging, and can efficiently and accurately realize electromagnetic simulation across 7 orders of magnitude from nanometers to centimeters, with a simulation efficiency more than 10 times higher than that of existing simulation tools.

According to Jiefang Daily, the use of self-developed RF EDA software can accurately predict the electromagnetic field and multi-physical field coupling characteristics of devices, circuits, and chips, reveal the changing laws of the physical characteristics of each part of the module, and analyze and design the electromagnetic simulation and electrothermal coordination of chip and package integration.