"Large flow, small size" Wei'an protects 5G communications

5G base stations are the core equipment of 5G networks, providing high-speed wireless access for 5G terminal devices to connect to the Internet and realizing signal transmission between wired communication networks and wireless terminals. Due to application needs, 5G base stations are required to have smaller size, lighter weight, and higher high-temperature reliability (the temperature of the AAU core processing unit can reach above 120°C) than 3G and 4G base stations. Therefore, the components selected for 5G base station equipment have more stringent requirements on size, power consumption, reliability, etc.

   WAYON TP3 series P-TVS has the characteristics of high current flow, high reliability and miniaturization, and has been supplied in large quantities by 5G equipment suppliers.

   The TP3 series products are suitable for lightning surge protection of 5G base station power ports and can meet the 1.2/50μs-8/20μs 3kA level surge protection requirements. Based on traditional large-current TVS surge protection devices, this series of products has been optimized for 5G base station applications:

   ★The performance degradation is minimal at high temperature (90℃);

   ★The device has high power density and small size, meeting the needs of miniaturization of base stations on towers;

   ★The product has high reliability and meets multiple reliability test standards such as PCT, HTRB, TC, HAST, UHAST, etc.;

   ★TP3 series products have high cost performance after five iterations.

   The first generation is a plug-in product with a powder coating process, with a typical size of 24.1*10.3*14mm3. It is a traditional large-through-current TVS packaging method with mature technology, but the packaging volume is large.

   The second generation is a powder coating process patch product with a typical size of 10.5*9.5*14mm3. It is a product developed to meet the needs of patch automation and reduce volume. The second generation product occupies a smaller area than previous products and can meet the needs of customer patch production.

   第三代产品为模组工艺产品，TPS封装，尺寸典型值为10*8.8*8.8 mm3。本代产品在行业内率先引入模组化封装的概念，使其外观尺寸在上一代基础上明显缩小，且在产品共面度控制、浪涌性能上显著提升，封装应力小、可靠性高。

   第四代产品为塑封工艺产品，SMD封装，尺寸典型值为10.8*8.3*5.75mm3。器件体积较上一代显著缩小，第四代产品通过设计创新，使其具备了低封装应力、高散热、高可靠性等优点。

   The fifth-generation product uses chip-level packaging technology and α-DFN packaging, with a typical size of 8.1*8.1*2.25 mm3. The volume is only 4.3% of the first-generation product. It is the first to use IC packaging technology to package 1.2/50μs-8/20μs combined wave 3kA grade high-current TVS products, which greatly reduces the device size and board area, making it possible to apply high-current surge devices to the front panel of the PCB. This product is currently in the trial production stage and is expected to be in stable mass production in the third quarter of 2021.

   Currently, the third and fourth generation products are mainly promoted, and the series specifications are as follows:

   With the fifth generation update of the TP3 series, a number of patents have been applied for, many of which are domestic firsts and internationally leading technologies.

   WAYON is a provider of circuit protection components and power semiconductors. WAYON always adheres to the core values ​​of "customer-oriented, technology-based, and hard work", is committed to leading the market through technological innovation, and strives to become a leading brand of global circuit protection components and power semiconductors.