According to the WeChat public account "HiSilicon Recruitment", Huawei HiSilicon Kunpeng Solution Team recently launched public recruitment.
The Kunpeng-related talents recruited this time involve multiple aspects, including Kunpeng chip software ecosystem engineers, HPC computing chip optimization engineers, Kunpeng chip OS engineers, Kunpeng chip driver development engineers, 5G cloud game/cloud phone development engineers, Kunpeng chip AE engineers, chip test and verification engineers, etc. The work locations are concentrated in Shenzhen, Chengdu, Beijing and other places.
Huawei said that Huawei Kunpeng solution is committed to building the world's most powerful computing platform and looks forward to talents who are committed to changing the history of world IT development.
It is reported that Huawei Kunpeng Ecosystem is based on Kunpeng + Ascend, and Huawei will invest 10.5 billion yuan (1.5 billion U.S. dollars) in the next five years. Kunpeng is Huawei's self-developed high-performance processor. In January 2019, Huawei officially launched the Kunpeng 920 processor, which is the industry's first 64-core, most integrated 7nm data center processor chip, pushing computing to new heights in terms of high performance, high throughput, high integration, and high energy efficiency.
In addition, Ascend 910 is currently the world's most powerful and fastest training AI processor chip. When combined with the full-scene AI computing framework MindSpore, it can meet the panoramic needs of cloud, edge, and end and accelerate the intelligent transformation of the entire industry.
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