Hangzhou Integrated Circuit Industrial Park is launched!

According to Jiwei.com, at the 2019 Global Flash Memory Summit held on August 22, the Hangzhou Integrated Circuit Industrial Park was officially launched!

It is understood that Hangzhou Integrated Circuit Industrial Park was established under the guidance of the Information and Software Department of the Ministry of Industry and Information Technology of China and the Economic and Information Technology Department of Zhejiang Province, and with the strong support of the Hangzhou Municipal People's Government. It is the first integrated circuit cluster park built by Hangzhou. The planned building area of ​​the industrial park is 1 million square meters, with an initial area of ​​150,000 square meters, and it is located in the Information Port Town of Xiaoshan Economic Development Zone.

The park mainly includes three industries: domestic integrated circuit chip design, computer hard disk, and big data disk array. At the same time, it will focus on introducing national, provincial and municipal key enterprise research institutes, laboratories and university industry-university-research research centers. At present, it has gathered leading enterprises in related industries including Hualan Microelectronics, Dinglong Holdings, and Barium Union Semiconductor.

It is revealed that after the successful operation of the park, the annual output value will exceed 10 billion yuan and the tax revenue will exceed 10 billion yuan, which will strongly support the rapid development of Xiaoshan District's economy.

In addition, a signing ceremony for major integrated circuit investment projects in Hangzhou (Xiaoshan) was held at the meeting, during which the Hualan Microcloud storage system high-end control chip project, Dinglong integrated circuit chip project, Balian semiconductor charging pile chip project, Baosong robot R&D center and intelligent flexible workstation project were signed.

Among them, Hualan Micro intends to invest 20 million US dollars in the high-end control chip project of Hualan Micro's cloud storage system to develop high-end control chips and hard disk arrays for big data and cloud storage systems to achieve import substitution. The project has received strong support from IBM and is expected to achieve economic benefits of 2 billion US dollars.

The Dinglong integrated circuit chip project has a total investment of 1.5 billion yuan, covering chip design, semiconductor materials, etc. The Balian semiconductor charging pile chip project has a total investment of 100 million yuan. The Baosong Robotics R&D Center and Intelligent Flexible Workstation project has a total investment of 180 million yuan.