On April 4, Tsinghua Unigroup's H3C Group signed an agreement with Chengdu Hi-tech Zone to establish H3C Semiconductor Technology Co., Ltd. in Chengdu Hi-tech Zone and invest in operating a chip design and development base.
Image source: H3C
It is reported that the total investment of the project is about 5 billion yuan. According to the signed agreement, H3C's chip design and development base will focus on the world's cutting-edge chip technology to carry out research and development, provide high-performance high-end router products and solutions, and gradually expand to the Internet of Things and artificial intelligence chip development business.
H3C is an industry-leading digital solution provider. It has maintained a leading position in the Chinese enterprise network market for many years and ranks first in the domestic market in many fields such as enterprise-level wireless networks, security hardware, government cloud, network management, and cloud management.
Regarding the strategic planning of H3C Semiconductor Technology Co., Ltd., Yu Yingtao, Co-President of Tsinghua Unigroup and CEO of H3C, said that H3C Semiconductor Technology Co., Ltd. will start chip business from a high starting point and will start independent research and development of chips in other cutting-edge fields such as artificial intelligence and the Internet of Things in due course. In the future market competition, H3C will continue to adopt the solutions of commercial chip partners with leading global technology, while integrating supporting chips for independent innovation solutions as needed.
You Xuejun, co-president and chief technology officer of H3C Group, said that the establishment of H3C Semiconductor Technology Co., Ltd. will help H3C maintain its top two market share in China's high-end router market and enable it to move towards a leading position in the high-end router market for global operators and enterprise networks.
Previous article：Intel's 5G baseband is delayed, so Apple may use its own solution?
Next article：Amazon develops wireless earbuds to challenge Apple AirPods
Recommended ReadingLatest update time:2024-11-15 15:58
- Popular Resources
- Popular amplifiers
-
Optimized drivetrain and new semiconductor technologies enable the design of energy-efficient electr - VLSI Physical Design: From Graph Partitioning to Timing Closure
- Chip Manufacturing: A Practical Tutorial on Semiconductor Process Technology (Sixth Edition)
- Fundamentals of Power Semiconductor Devices (B. Jayant Baliga)
Optimized drivetrain and new semiconductor technologies enable the design of energy-efficient electr
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claimsAccording to foreign media reports, recently, the British consumer rights organization "Which?" filed an antitrust lawsuit against Apple on behalf of approximately 40 million iCloud users, accusing Apple of violating competition laws and seeking up to $30 million in damages. ...
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thickerOn November 11, sources Jukanlosreve and yeux1122 revealed that both Apple and Samsung's ultra-thin high-density battery projects had failed. The two companies had previously tried to develop ultra-thin high-density batteries in their iPhones. ...
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable developmentAt this year's CIIE, Micron shared the latest progress of the Xi'an packaging and testing plant expansion project, and shared with relevant partners on the theme of "Talking about Empowerment: Co-promoting Coexistence of Business and Sustainable Development"....
- Qorvo: Innovative technologies lead the next generation of mobile industryAt the 12th China Hard Technology Industry Chain Innovation Trend Summit held recently, Qorvo China Senior Sales Director Jiang Xiong shared Qorvo's technological innovation and market development in the new generation of 5G applications. ...
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screenBOE (BOE Oriental) exclusively supplies Nubia and Red Magic flagship new products. The new generation of under-screen display technology leads the industry into the era of true full-screen. On November 5, BOE (BOE Oriental) joined hands with Nubia, ...
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Huawei's Strategic Department Director Gai Gang: The cumulative installed base of open source Euler operating system exceeds 10 million sets
- Download from the Internet--ARM Getting Started Notes
- Learn ARM development(22)
- Learn ARM development(21)
- Learn ARM development(20)
- Learn ARM development(19)
- Learn ARM development(14)
- Learn ARM development(15)
- Analysis of the application of several common contact parts in high-voltage connectors of new energy vehicles
- Wiring harness durability test and contact voltage drop test method
- Sensitivity of automotive electronic logos in high and low temperature environments
- When BLE meets MEMS——DIY Bluetooth somatosensory controller (demonstration)
- Should OPC abandon the pit?
- Video signal detection
- Temperature and humidity monitoring system based on ZigBee-WSN
- Ultra-wideband is really popular. Let’s discuss it together.
- 【AD21】How to set the spacing between multiple traces to be consistent
- 【CC1352P review】——by cruelfox
- Do I need to add a pull-down resistor to the GPIO of STM32?
- 5G has been commercially available for more than a year. Have you felt it?
京公网安备 11010802033920号