Molex's new multifunctional VaporConnect optical feedthrough module
Adopting innovative thermal management solutions,
Designed to meet the needs of evolving AI-driven data centers
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First to introduce two-phase immersion cooling solution for carrier boxes, significantly reducing the time and cost required to install and upgrade hyperscale data centers
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Plug-and-play, easily connect optical transceivers in troughs to cabling infrastructure via fully upgradeable sealed modules
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Future-proof capabilities include the flexibility to change connector types and organize circuit configurations without impacting the mechanical interface or enclosure design
Lisle, IL – September 24, 2024 – Molex, a global electronics leader and connectivity technology innovator, today announced a new thermal management solution designed to address the growing needs of high-performance data center workloads such as generative AI and machine learning. The solution not only reduces deployment and upgrade time, but also reduces costs. The Molex VaporConnect™ optical feedthrough module for two-phase immersion cooling features a unique modular carrier box design that bolts directly onto the immersion tank. Users can easily replace optical transceivers and network cabling infrastructure without changing the mechanical interface or redesigning the box structure to meet the ever-expanding computing speed and capacity needs of data centers. The reference design of the module is expected to be released in the first quarter of 2025.
“Molex is committed to simplifying data center deployment and upgrades through innovative optical solutions while effectively addressing critical thermal management challenges,” said Trevor Smith, general manager, Molex Optical Connectivity . “With VaporConnect, customers can easily swap out modules, upgrade connectivity, and adjust cooling system designs to ensure data centers evolve with technology. This strategy not only speeds upgrades, but also significantly reduces energy, cooling and technology costs, improving overall efficiency.”
Simplifying two-phase immersion cooling
Molex's VaporConnect optical feedthrough module adopts a sealed design with full upgrade capabilities, which greatly simplifies the connection between the optical transceiver inside the immersion tank and the external wiring infrastructure. With VaporConnect, the sealing and wiring processes are completed inside the module, and users can easily upgrade the connector without changing the immersion tank design or structure. In addition, the design also allows standard wiring infrastructure to be flexibly reused across multiple product generations, effectively reducing the time, cost and complexity required for deployment.
Molex can provide single-mode and multimode fiber solutions that meet various industry standards and meet different fiber connector size requirements. These solutions have a mix-and-match function, supporting system upgrades to higher performance or higher density connectors. Users can customize the module size according to space and application requirements. In addition, Molex's VaporConnect optical feedthrough module uses FlexPlane™ optical path technology to minimize the need for external jumpers and organization, and seamlessly integrates complex fiber management and high-density wiring into the module, simplifying the installation process and achieving plug-and-play operation.
Reliable, versatile, and scalable optical interconnect modules
Each VaporConnect module is equipped with a fully tested sealing gasket, which uses the industry standard helium leak detection method to ensure a reliable seal between the gasket and the box wall. This design also ensures the smooth connection of the server line card from the slot to the external wiring system. Currently, Molex is conducting compliance testing based on the industry standard GR-1435-CORE.
VaporConnect modules are designed to meet customer specifications, with the number of fiber channels depending on the number and type of connectors used. A single module can integrate up to 576 fibers. Molex offers a variety of size options, including MPO, LC and very small form factor (VSFF) options such as MMC, MDC, SN and SN-mt, to fit existing infrastructure and simplify system upgrades. As part of Molex's continued investment in this area, the EBO connector option is currently under development and is expected to be launched in the first half of 2025.
Molex to Demonstrate Commitment to Optical Networking Innovation at ECOC 2024
As the largest manufacturer of two-phase immersion-cooled optical feedthrough modules, Molex has sold more than 350,000 optical channels to date. At the upcoming ECOC'24 event, Molex will demonstrate its stronger commitment to the innovation of optical network infrastructure, including the newly launched VaporConnect optical feedthrough modules. At the same time, it will also showcase its rich optical connection products, advanced optoelectronic solutions and precise wavelength management systems. Molex's booth number is C75. As an active member of OIF, Molex will participate in an interoperability demonstration at booth B83, highlighting its optical network innovations and solutions in data centers, AI/ML technologies and distributed systems.
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