Infineon Technologies Launches Advanced Hybrid ToF (hToF) Technology to Enable a New Generation of Intelligent Robots

[January 31, 2024, Munich, Germany] Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, has collaborated with equipment manufacturer Omeis Microelectronics and ToF (hereinafter referred to as the same) technology expert pmdtechnologies to develop a new high-resolution camera solution that can provide a new generation of smart consumer robots with more powerful depth sensing and three-dimensional scene understanding capabilities. This new hybrid ToF solution combines two depth sensing concepts to help significantly reduce the maintenance workload and cost of smart robots .

New hybrid ToF solution

Infineon's REAL3™ flexible ToF imager technology integrates existing high-resolution iToF flood illumination and dToF long-range point light illumination into a single hybrid ToF camera. For many years, this high-resolution technology has been used to observe and avoid small objects in the robot's path. Now, by adding precise long-range spot data, it is also possible to create an accurate 3D map of the surrounding area, enabling an intelligent path planning experience and empowering a new generation of robot vacuum cleaners.

This new solution replaces the top-mounted laser range finder (LDS), thereby reducing the height of the robot vacuum cleaner by 20%-30%, allowing the robot to clean under furniture with a small ground clearance. The hybrid ToF camera measures only 31x16x8 mm, requiring less space and optimizing mapping and obstacle avoidance. Hybrid ToF replaces multiple sensors and does not require the installation of moving parts that will gradually wear out, thereby reducing system costs and operating costs.

The solution is easy to deploy and provides a user-friendly experience for customers. This compact hybrid ToF solution is versatile and rugged, and is well suited to meet the growing demand for mobile consumer robotic devices in various industries such as robot vacuum cleaners, commercial robots, air purifiers, dimensional measurement, etc.

“Infineon’s collaboration with Paiande Technologies and OMS Microelectronics is a great example of how Infineon is working with its partners to promote technology innovation and digitalization,” said Andreas Kopetz, Vice President of the Environmental Sensing Product Line at Infineon Technologies . “With its wide range of uses, our hybrid ToF solution addresses the fast-growing consumer robotics market, enabling customers to design unique robots and reducing system cost and complexity by replacing multiple cameras with one.”

Xiao Detang, General Manager of Jiangxi OMAX Microelectronics Co., Ltd. said: "The hybrid ToF from Infineon and Paiand Technologies uses an innovative patented architecture with a dual illumination system. For manufacturers like OMAX Microelectronics, this solution has outstanding advantages, such as small size, low power consumption, and reduced overall application costs. This unique optical design can avoid multipath problems and achieve precise positioning combined with obstacle avoidance. We are very happy to use it to further enhance the competitiveness of hybrid ToF camera products."