Changdian Technology provides diversified and highly reliable packaging and testing solutions for autonomous driving chip customers

As a global leading integrated circuit finished product manufacturing and technology service provider, Changdian Technology has been deeply involved in the field of advanced packaging for many years and can provide diversified, high-reliability packaging and testing solutions and supporting production capacity for autonomous driving chip customers. As L3 level and above autonomous driving technology becomes more mature, the automotive intelligent market has fully entered the 2.0 era. Changdian Technology will continue to provide strong technical support and services to customers in the field of intelligent driving and the entire industry.

At present, there are two mainstream solutions for autonomous driving, namely, the multi-sensor fusion solution with LiDAR as the core, and the pure vision solution with camera as the main one. LiDAR has high measurement accuracy, wide range, and high safety. It can accurately perceive surrounding information even in harsh environments, so it is adopted by most car companies. According to statistics, more than 80% of domestic smart car companies currently adopt this solution, but its algorithm iteration speed is relatively long. The pure vision solution mainly collects information through cameras, which has low cost. In model calculations, it also involves fewer sensors and fast algorithm iteration speed, making it another mainstream solution for autonomous driving.

The core of smart cars is achieved through a series of closed-loop steps such as data collection, transmission, storage, processing, simulation, training, verification, and deployment. This process involves a large number of different types of chips, and each type of chip also requires specialized chip packaging technology according to its different functional requirements. The common main modules of automobiles and their corresponding chip packaging forms are shown in the figure below:

After years of development, smart driving has formed a complete ecosystem consisting of multiple participants including vehicle manufacturers, software developers, hardware suppliers, data processing companies, communication service providers, etc. Each participant plays an indispensable role in jointly promoting the development and application of smart driving technology.

Changdian Technology is at the core of the smart driving ecosystem and plays an important role in all links, especially in the fields of smart driving sensors and high-performance computing, where it works closely with mainstream global customers and has many years of rich experience in mass production of automotive chip packaging. In 2023, Changdian Technology's automotive business revenue exceeded RMB 2 billion, leading the industry in terms of revenue scale and technical capabilities. Changdian Technology can provide one-stop automotive-grade chip packaging and testing solutions, including traditional packages such as QFP, QFN, and BGA, and advanced packages such as FCBGA, FCCSP, SiP/AiP, POP, 2.5D/3D, fully supporting the high computing power, high reliability, high integration and high bandwidth requirements of intelligent computing processors. In addition, in response to the high energy consumption problem in the process of training large models in the cloud, Changdian Technology also provides customized packaging solutions for leading power suppliers in the industry, achieving further improvements in power distribution, energy efficiency, package size, cost and heat dissipation.

Through close cooperation with wafer fabs, vehicle manufacturers, Tier 1 suppliers and chip design companies, Changdian Technology has achieved large-scale mass production of various mainstream automotive products. At present, millions of smart cars around the world are equipped with fully autonomous driving chips packaged by Changdian Technology. In order to meet the continued rapid growth in demand for autonomous driving, the company is fully accelerating the construction of the Shanghai Lingang automotive-grade chip finished product manufacturing base, which is scheduled to be completed and put into use in 2025. At the same time, Changdian Technology provides customers with efficient technical support in packaging collaborative design simulation, packaging reliability verification, materials and high-frequency performance testing, and continues to cooperate with leading companies in related products to develop new solutions and achieve rapid mass production.