July 15 news, recently, the School of Computer Science and Technology of Beihang University successfully taped out the Lain and EULA processors based on LoongArch dragon architecture instruction set of Loongson Zhongke.
Both have a complete SoC structure and rich peripheral support. They can not only run the MOS teaching operating system designed independently by the college, but also support Linux 5.19, as well as complex multimedia audio and video application software.
Among them, the Lain processor focuses on verifying modern CPU mainstream microarchitecture technologies such as multi-issue, out-of-order, and multi-core, while the EULA processor focuses on verifying the chip agile development environment and its full-process design support.
Lain Processor
EULA Processor
This achievement comes from the "Beihang-Loongson Hundred Cores Plan", which was officially launched in 2020. It is goal-oriented for undergraduate development and tape-out, led by the School of Computer Science, and jointly with the School of Integrated Circuits and the School of Software, to jointly explore and practice cross-disciplinary talent training models across colleges, disciplines, and majors, and cultivate scarce and outstanding innovative talents for the country with full-process capabilities from CPU, operating system, compiler to chip implementation.
The design team of Lain and EULA processors completed the hardware front-end and back-end design from CPU core and SoC chip to software development tasks such as operating system, compiler and even application program, running through the entire technology stack of processor chip design, demonstrating a very high degree of completion and realizing the full stack connection of domestic independent and controllable processor chip design capabilities.
The "Hundred Cores Project" is an industry-university-research integration project launched by Loongson Technology. It plans to select 100 universities across the country within 5-10 years to jointly build 100 chip joint laboratories through a school-enterprise cooperation model.
Based on the IP provided free of charge by the Loongson University Program, the joint laboratory will work with a third party to jointly develop a practical independent chip, and form industrial applications, forming an ecosystem based on Loongson's independent chip IP, and promoting the integration of industry and education, and science and education.
Schematic diagram of the entire process of Loongson's "Hundred Cores Plan" processor chip
In 2023, the first chip of the Hundred Cores Project, BX100E-HHU, was officially released. It was designed and developed by Hohai University based on the Dragon architecture instruction set. It has passed comprehensive verification and will be used in practical work in embedded, Internet of Things, and intelligent industrial control fields.
In 2024, the first 32-bit MCU chip "Suxin No. 1" for domestic higher vocational education jointly developed by Loongson Technology and Jiangsu Information Vocational and Technical College was successfully taped out, and has broad application prospects in automotive, industrial control and consumer fields.
Previous article:Microchip Expands Processor Product Line with Multi-Core 64-bit Microprocessor Family
Next article:RISC-V shows great promise in Europe
- Popular Resources
- Popular amplifiers
- Red Hat announces definitive agreement to acquire Neural Magic
- 5G network speed is faster than 4G, but the perception is poor! Wu Hequan: 6G standard formulation should focus on user needs
- SEMI report: Global silicon wafer shipments increased by 6% in the third quarter of 2024
- OpenAI calls for a "North American Artificial Intelligence Alliance" to compete with China
- OpenAI is rumored to be launching a new intelligent body that can automatically perform tasks for users
- Arm: Focusing on efficient computing platforms, we work together to build a sustainable future
- AMD to cut 4% of its workforce to gain a stronger position in artificial intelligence chips
- NEC receives new supercomputer orders: Intel CPU + AMD accelerator + Nvidia switch
- RW61X: Wi-Fi 6 tri-band device in a secure i.MX RT MCU
Professor at Beihang University, dedicated to promoting microcontrollers and embedded systems for over 20 years.
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- CGD and Qorvo to jointly revolutionize motor control solutions
- CGD and Qorvo to jointly revolutionize motor control solutions
- Keysight Technologies FieldFox handheld analyzer with VDI spread spectrum module to achieve millimeter wave analysis function
- Infineon's PASCO2V15 XENSIV PAS CO2 5V Sensor Now Available at Mouser for Accurate CO2 Level Measurement
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- Advanced gameplay, Harting takes your PCB board connection to a new level!
- A new chapter in Great Wall Motors R&D: solid-state battery technology leads the future
- Naxin Micro provides full-scenario GaN driver IC solutions
- Interpreting Huawei’s new solid-state battery patent, will it challenge CATL in 2030?
- Are pure electric/plug-in hybrid vehicles going crazy? A Chinese company has launched the world's first -40℃ dischargeable hybrid battery that is not afraid of cold
- Please give me some guidance!
- Free Download | TE White Paper "The Importance of Pressure Sensors in HVAC Refrigeration Systems"
- Things to note when routing high-frequency and high-speed signal lines along the edge of a PCB
- CAN protocol and CAN driver?
- lwip stability issue?
- [Gizwits Gokit3 Review] Gokit3 Hardware Circuit Learning
- AD9 mid-level schematic design
- Download the white paper and answer questions to win prizes | TE "Smart Monitoring Application Connectivity Solution Guide"
- Use of TI DSP Integrated Development Environment CCS
- Shared information: 2019 H Topic Electromagnetic Gun (Laser Version) + 483431Z