The world's first! Huatian's high-reliability automotive wafer-level advanced packaging production line project officially put into production

On the morning of January 6, the high-reliability automotive wafer-level advanced packaging production line project of Huatian Technology (Kunshan) Electronics Co., Ltd. was officially put into production! This is the world's first intelligent production line that uses a fully automated overhead crane system in the packaging and testing field.

Huatian Technology is the seventh largest integrated circuit manufacturer in the world and the third largest in China. Its products are widely used in various types of projects, providing high-quality integrated circuit products for many key projects.

"The high-reliability automotive wafer-level advanced packaging production line project put into production this time will form a large-scale high-reliability automotive wafer-level packaging testing and R&D base, solving the problem of being "choked" by foreign companies in the field of wafer-level automotive packaging in my country, and realizing the domestic substitution of high-end packaging technology." said Xiao Shengli, chairman of Huatian Group.

After the project reaches full production, the annual output of high-reliability wafer-level integrated circuit advanced packaging for sensors will increase by 360,000 pieces, with an annual output value of 1 billion yuan.

On the same day, Huatian Technology's smart office building was also put into use. In the intelligent control center, staff can remotely control all equipment and system information through the large floor-standing screen by simply touching the keyboard on the operating table, efficiently realizing the rational allocation of production resources, greatly improving production efficiency and reducing labor costs.