STM8S103F3P6 core board schematic design

Publisher:MysticalSoulLatest update time:2019-11-27 Source: eefocusKeywords:STM8S103F3P6 Reading articles on mobile phones Scan QR code
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Encounter problems:


1. Unable to perform DRC check


2. Drawing page cannot be set


Solution:


1. Select the .dsn file, even if you can perform a DRC check


2. Set schematic page properties   

3. Ceramic chip capacitor packaging


RAD is the package of ceramic capacitors. Generally, the package of 104.103.222.33. These are RAD0.1, and RAD0.2 is relatively large. It can be said that the distance between the component pins is 200mil.

The RAD0.1 package is a non-polar capacitor. 0.1 means that the pad spacing of this capacitor on the circuit board is 100 mil (1 mil = 0.0254 mm).


The RB.1/.2 package refers to a polarized capacitor. The .1/.2 at the end means that the spacing between the two pins of this capacitor on the circuit board is 100 mil, and its outer diameter is 200 mil.

Keywords:STM8S103F3P6 Reference address:STM8S103F3P6 core board schematic design

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