According to reports from Korean media ETNews on December 27, SK Hynix has recently developed reusable CMP polishing pad technology, which can not only reduce costs, but also enhance ESG (environmental, social, governance) management.
SK Hynix said that reusable CMP polishing pads will be deployed first in low-risk processes and then gradually expand their application scope.
IT Home Note: CMP technology is a process in which the surface of the material to be polished reaches the required flatness under the combined action of chemicals and mechanics. The chemical components in the polishing fluid react chemically with the material surface to form a softened layer that is easy to polish. The polishing pad and abrasive particles in the polishing fluid physically and mechanically polish the material surface to remove the softened layer.
Source: Dinglong Shares
In the CMP process, the main functions of the polishing pad are:
The polishing fluid is effectively and evenly distributed to the entire processing area, and newly replenished polishing fluid can be provided for a polishing fluid cycle;
Remove residues generated by the polishing process (such as polishing debris, polishing debris, etc.) from the polished surface of the workpiece;
transfer the mechanical loads required for material removal;
Maintains the mechanical and chemical environment required for the polishing process. In addition to the mechanical properties of the polishing pad, its surface structure characteristics, such as micropore shape, porosity, groove shape, etc., can determine polishing efficiency and flatness indicators by affecting the flow and distribution of the polishing fluid.
SK hynix uses the CMP polishing pad dial texture reconstruction method to ensure that the polishing pad can be reused.
About 70% of South Korea's CMP polishing pads use foreign products and are highly dependent on foreign countries. A breakthrough in this technology can promote further independence in the Korean semiconductor industry.
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