Nikon launches a new generation of stepper lithography machine "NSR-2205iL1", which will be launched in the summer of 2024

According to news on September 6, Nikon announced the launch of a new generation of i-line stepper lithography machine "NSR-2205iL1" with a 5x reduced projection magnification, which is expected to be launched in the summer of 2024.

It is said that this lithography machine has a reduced projection amplification system, supports a variety of products such as power semiconductors, communication semiconductors and MEMS, and is highly compatible with Nikon's existing i-line exposure equipment; NSR-2205iL1 represents Nikon's 5x step The most significant update to advanced technology in the past twenty-five years will be a direct response to customer demand for these lithography systems that play an important role in chip manufacturing.

Nikon said that compared with existing Nikon i-line exposure systems, the NSR-2205iL1 has excellent economics and can optimize the production of various semiconductor devices regardless of wafer material.

Note from IT Home: This is the first time in 25 years (counting from the time the "NSR-2205i14E2" started receiving orders in 1999) that Nikon has launched a new i-line exposure system that reduces the projection magnification by 5 times.

The main parameters:

Nikon pointed out that with the popularity of electric vehicles, high-speed communications and various IT equipment, the demand for semiconductors that support these applications has increased exponentially. These semiconductors must perform a variety of challenging functions, so device manufacturers require specialized substrates and exposure systems to fabricate these chips.

In addition to expanding various functional options to meet the diverse needs of customers, this newly developed i-line lithography machine will also support long-term equipment production.

According to reports, the NSR-2205iL1 can provide various semiconductor manufacturing solutions based on high-precision wafer measurement through multiple advantages such as multi-point autofocus (AF), advanced wafer table flattening technology, and wide depth of focus range (DOF). The process provides high productivity and optimizes output levels. Additionally, due to its wafer thickness and size compatibility, high wafer warpage tolerance, and flexible features including but not limited to support for SiC (silicon carbide) and GaN (gallium nitride) processing, the NSR-2205iL1 i- line lithography machines are very suitable for various application scenarios. This lithography machine will provide excellent cost performance while meeting the diverse needs of chip manufacturers.