Accelerate the creation of "core" Siemens EDA Technology Summit held in Shanghai

On August 24, Siemens EDA’s annual event, the 2023 Siemens EDA Forum, kicked off in Pudong, Shanghai. This summit is the return of Siemens EDA after a three-year absence offline. The conference has the theme of "Accelerating Core Creation and Leading the Future Intelligently" and focuses on hot topics such as AI applications, automotive chips, SoC, 3D IC and circuit board system technology. Share the latest technological achievements of Siemens EDA, and invite a number of industry experts, technology pioneers, and partners to gather together to discuss the development trends and technological innovation of the global semiconductor and integrated circuit (IC) industry.

As the cornerstone of the semiconductor industry, EDA, which is at the most upstream of the industry chain, supports the large-scale semiconductor market. As the industry continues to move towards digitalization and intelligence, EDA tools also play a key "leverage" role in the digital economy. Despite the global economic downturn, demand adjustments in downstream industries, and continued inventory correction cycles in the past period, the EDA industry has still shown the flexibility and resilience to develop steadily amid fluctuations in the industry cycle.

Ling Lin, global vice president of Siemens EDA and general manager of China, said in the opening speech of the summit : "How to discern market opportunities amid changes and gain first-mover advantages in new business formats is the key for enterprises to strengthen their own adaptability and achieve ultimate success. Since entering China for 34 years, Siemens EDA has always focused on the word "demand", observing the situation with experience, using technology to solve the situation, and working with partners to break the situation. We believe that we can proactively seize cyclical changes and help customers build in advance The design of next-generation electronic systems is the optimal solution to achieve collaborative development.”

In the subsequent keynote speech of the conference, Siemens EDA Global Senior Vice President and Asia Pacific President Peng Qihuang used the historical trends of semiconductors during the economic downturn as a mirror to discuss the reasons for optimism in the new industry development cycle. Peng Qihuang said: "Although the semiconductor industry has shown some uncertainties due to structural changes, the implementation of new technologies, the highlighting of the value of semiconductors, and the increase in investment by enterprises and governments have all released positive signals with optimistic prospects. EDA tools are As a key technology that promotes the development of semiconductors, Siemens EDA will continue to export its technical capabilities and contribute to the high-quality development of the semiconductor industry.”

Talking about the strategic direction of Siemens EDA, Peng Qihuang shared that the decline of Moore's Law and the continuous expansion of chip scale require semiconductor companies to persist in innovation. In order to help customers meet challenges, Siemens EDA is committed to creating complete EDA tools and services to fully empower future-oriented solutions from chips to systems. With the support of artificial intelligence/machine learning (AI/ML) and cloud computing, Siemens EDA actively develops large-scale heterogeneous integrated 3D IC technology to help customers improve the quantity and quality of transistors; at the same time, it gives full play to the advantages of integration to create high-end integrated, Digital circuit implementation process, advanced verification, and end-to-end test solutions; facing the systematic trend of chips, Siemens EDA focuses on SoC system environment verification and digital twin applications to ensure the correct operation of complex systems and quickly achieve innovation goals.

Lincoln Lee, technical general manager of Siemens EDA Asia Pacific, introduced the content of the summit sub-venue to the guests, focusing on the innovative applications of Siemens EDA in the five major fields of AI EDA tools, automotive chips, complex SoC, 3D IC and PCB system technology; at the same time, from Unisoc Experts such as Zhanrui and ZTE Microelectronics also shared the results of their cooperation with Siemens EDA , such as: how the Solido Library IP solution achieves the design goals of high performance and low power consumption of basic IP based on AI technology, and how to use HyperLynx automated simulation technology solutions Solve the problem of high-speed signal simulation coverage, etc., explain in detail the segmented applications in the EDA field, and promote diversified technological innovation