Advanced Semiconductor Packaging Materials Technology Exchange Conference was successfully held

Publisher:EE小广播Latest update time:2021-11-03 Source: EEWORLDKeywords:Semiconductor Reading articles on mobile phones Scan QR code
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On October 28, the Advanced Semiconductor Packaging Materials Technology Exchange Conference was held at Crowne Plaza Chengdu. The event was co-sponsored by ZESTRON and Heraeus Electronics (Heraeus), and co-organized by Chongqing Xiafeng Technology. ZESTRON North Asia General Manager Shen Jian, Heraeus Electronics China Sales Vice President Shen Fangzhong, Heraeus China R&D Director Dr. Zhang Jing and other leaders attended the meeting, and nearly 100 important customers from East China, South China, West China and other regions were invited to attend the meeting.


At 9:00 a.m., the exchange meeting officially began. The organizer first delivered an opening speech, expressing a warm welcome and sincere gratitude to all guests. Heraeus Electronics Shen Fangzhong then introduced the development history and business situation of Heraeus globally and in Greater China, and shared Heraeus' service concept of "in China, for China". In his speech, ZESTRON General Manager Shen Jian said: If Heraeus' business is described as "hidden champions in multiple aspects", then ZESTRON's expertise in precision cleaning can be said to be "laser-like focus."


Regarding advanced semiconductor packaging material solutions, senior technical solution engineers from ZESTRON and Heraeus Electronics took the stage to give speeches. The content they brought included advanced packaging solutions for efficient SiP, applications of thick film circuits, packaging cleaning processes, power electronics solutions and their advanced engineering service systems, surface and interface failures in packaging, etc. Against the backdrop of the accelerated development of domestic semiconductor packaging, the guests showed great interest in professional technical lectures, and the enthusiasm for participation in the Q&A session far exceeded expectations.


The theme dialogue was a highlight of this exchange meeting. Focusing on "Material Solutions under the Background of Dual Carbon", Shen Jian, General Manager of ZESTRON North Asia, Wang Ketong, Manager of ZESTRON R&S, Shen Fangzhong, Vice President of Sales of Heraeus Electronics China, and Ding Chao, Director of Technical Solutions of Heraeus Electronics attended the discussion. Under the background of global "carbon neutrality", the replacement of traditional energy with clean energy has become an inevitable trend. With the popularization of new energy vehicles and the development of solar and wind energy, basic materials will face more severe challenges. ZESTRON and Heraeus have always been at the forefront of the times. The leaders of both parties shared their unique insights on the current status and future trends of advanced materials development with the guests on site from many aspects such as market, products and technology. As renowned suppliers in their respective fields, both parties bring customers not only innovative materials, but also localized technical support, rigorous and reliable supply chain and a one-step-ahead development concept.


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The exchange meeting came to an end at 5:45 pm, and all participants took a group photo on the podium. "On the eve of the meeting, some customers were unable to attend due to the newly confirmed COVID-19 cases in some local areas. In response to the strict requirements of Sichuan Province for the prevention and control of the epidemic on the holding of gathering activities, we immediately contacted the nearest nucleic acid testing agency and quickly organized all participants to complete nucleic acid testing before the meeting. It is very rare that this event can be held smoothly! Thanks again to all participants! Looking forward to seeing you next year!" ZESTRON North Asia General Manager added.


Keywords:Semiconductor Reference address:Advanced Semiconductor Packaging Materials Technology Exchange Conference was successfully held

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