TSMC's N5 process has been mass-produced, followed by N5P and N4. Liu Deyin said that the company will launch N5P in 2022 and N4 in 2023...
TSMC recently held its annual shareholders meeting in Hsinchu, revealing for the first time that it will develop a 4nm process (N4) between its 5nm (N4) and 3nm processes.
TSMC Chairman Ming-Wen Liu at a news conference in Hsinchu, Taiwan. (Photo: Alan Patterson for EE Times)
"N4 will be the evolution of N5," TSMC Chairman Mark Liu told EE Times, a sister publication of Electronic Business International, at a press conference after the shareholders' meeting: "We are ready to negotiate business with customers for N4." Liu's statement confirmed the news revealed earlier by a TSMC wafer fab insider to EE Times.
TSMC, the world's leading foundry, has gradually widened the gap with Samsung, which is currently TSMC's only competitor in the 7nm process. According to industry sources, Samsung may start mass production of the 3nm process in 2022. The company has invested $116 billion to build a 5nm wafer plant in Pyeongtaek, south of Seoul, and is actively competing with TSMC for market share in the global foundry market.
TSMC's N5 process is already in mass production, followed by N5P and N4. Liu Deyin said the company will launch N5P in 2022 and N4 in 2023. However, TSMC declined to reveal the details of the N4 process, saying that the information was leaked before the company was ready for an official press release.
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