According to foreign media reports, TSMC, the world's leading chip foundry, plans to invest US$10.1 billion to build a new chip packaging and testing factory.
According to foreign media reports, TSMC plans to build a new chip packaging and testing factory, and the related buildings are scheduled to be completed in May next year. The first phase will then be put into production, and it plans to employ 1,000 employees in the initial stage.
Like other chip production plants invested by TSMC, the planned chip packaging and testing plant also requires a huge investment. Foreign media reported that TSMC plans to invest NT$303.2 billion, or about US$10.15 billion.
If the foreign media reports are true, this chip packaging and testing factory with an investment of more than US$10 billion is TSMC's second factory with an investment of more than US$10 billion in recent times.
On May 15, TSMC announced on its official website that they plan to build a new 5nm chip factory in Arizona, USA. Construction is scheduled to start in 2021 and production will begin in 2024. From 2021 to 2029, TSMC plans to invest US$12 billion in this factory.
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