Infineon Technologies Launches HybridPACK™ Drive G2 Fusion, Combining Silicon and Silicon Carbide into Advanced Power Modules for Electric Vehicles

Combining affordability with high performance and high efficiency is the key to electric vehicles' move to a wider market. Infineon Technologies AG announced the launch of HybridPACK™ Drive G2 Fusion, which has established a new power module standard for traction inverters in the field of electric vehicles . HybridPACK™ Drive G2 Fusion is the first plug-and-play power module that combines Infineon's silicon (Si) and silicon carbide (SiC) technologies. This advanced solution achieves an ideal balance between performance and cost-effectiveness, providing more options for inverter optimization.

HybridPACK™ Drive G2 Fusion

One of the main differences between silicon and silicon carbide in power modules is that silicon carbide has higher thermal conductivity, breakdown voltage and switching speed, so it is more efficient, but the cost is higher than silicon-based power modules. With the new module, the silicon carbide content per vehicle can be reduced while maintaining vehicle performance and efficiency at a lower system cost. For example, system suppliers can achieve system efficiency close to that of a full silicon carbide solution by using only 30% of silicon carbide and 70% of the silicon area.

“Our new HybridPACK™ Drive G2 Fusion module demonstrates Infineon’s innovative leadership in the automotive semiconductor industry,” said Negar Soufi-Amlashi, Senior Vice President and General Manager of the High Voltage Product Line at Infineon Technologies’ Automotive Electronics Division. “To meet the demand for greater range in electric vehicles, this technological breakthrough cleverly combines SiC and silicon. It is integrated into a complete module package substrate and offers a better price/performance ratio than pure SiC modules without increasing system complexity for automotive system suppliers and car manufacturers.”

Negar Soufi-Amlashi, Senior Vice President and General Manager of High Voltage Product Line, Automotive Electronics Division, Infineon Technologies

The HybridPACK™ Drive G2 Fusion extends Infineon’s HybridPACK™ Drive power module portfolio and can be quickly and easily integrated into automotive components or modules without complex adaptations or configurations. The HybridPACK™ Drive G2 Fusion module delivers up to 220 kW at 750 V class voltage. The module ensures high reliability and improved thermal conductivity over the entire temperature range of -40 °C to +175 °C. The unique properties of Infineon’s CoolSiC™ technology and its silicon IGBT EDT3 technology with extremely fast turn-on speeds enable the use of single or dual gate drivers, which makes it easy to redesign inverters based on all-silicon or all-silicon carbide into fusion inverters. With comprehensive experience in silicon carbide MOSFET and silicon IGBT technology, power module packaging, gate drivers, and sensors, Infineon can provide high-quality products and save costs at the system level. For example, integrating Swoboda or XENSIV™ Hall sensors in the HybridPACK™ Drive package enables more precise and efficient motor control.

Infineon Technologies will be at electronica 2024 in Munich from November 12 to 15.

Showcasing the HybridPACK™ Drive G2 Fusion (Hall C3, Booth 502) .

Infineon Technologies will participate in electronica 2024

At this year's electronica, Infineon will showcase innovative application solutions that meet the challenges of the times. Semiconductors contribute to green and digital transformation in many ways, helping to build an all-electric society. By then, Infineon will bring opportunities to explore sustainable development technologies that will greatly change the transportation and automotive sectors, enable sustainable buildings and smart life, and minimize ecological impact while promoting the development of artificial intelligence. From November 12 to 15, Infineon will showcase smart energy-saving solutions for the future connected world at booth 502 in Hall C3 around the theme of "Digital Low Carbon, Create the Future Together".