Technical application of power modules

　　The power module combines most of the necessary components to provide a plug-and-play solution, replacing more than 40 different components. This integration simplifies and speeds up the design of the system, and it can also significantly reduce the circuit board area occupied by the power management part. In order to achieve the required voltage accuracy, these power modules are generally placed near the chip circuit that needs to be powered on the circuit board. However, as the complexity of the system increases, layout becomes more important in systems with higher current, lower voltage and higher frequency.

　　The most common isolated power modules are single in-line packages (SIPs) and open-frame structures. They can obviously bring convenience to engineers and simplify system design. However, they are generally only suitable for designs with lower switching frequencies, such as 300kHz or lower. Furthermore, their power density is usually not optimized, especially compared with DC/DC chip-level modules.

　　There are generally two types of isolation for power modules: one is the isolation between input and output; that is, the input and output do not share a common ground; the other is the isolation between outputs; multiple groups of outputs are isolated from each other and do not interfere with each other.

　　With the development of conductor, especially semiconductor technology, packaging technology and the extensive use of high-frequency soft switching, the power module has become more and more dense, the conversion efficiency is getting higher and higher, and the application is becoming simpler. The power supply is becoming lighter, smaller, thinner, lower in noise, and more reliable and anti-interference.