Infineon launches SECORA™ Pay product portfolio using 28nm chip technology

Infineon launches SECORA™ Pay product portfolio using 28nm chip technology

Features that combine outstanding trading performance with easy-to-integrate full-system solutions

[Munich, Germany, March 31, 2023] Infineon Technologies AG has expanded the technology process of its SECORA™ Pay solution portfolio to 28nm . Innovative product design enables Infineon to further break through the limits of payment card technology. With this, the product also provides the latest technology with a reliable procurement option for the payment ecosystem in major regional markets. The new product series is the first of its kind on the market to apply leading 28 nm chip technology to embedded non-volatile memory. It aims to alleviate the semiconductor shortage problem encountered by the payment industry at mature technology nodes.

Tolgahan Yildiz, Head of the Payment Solutions Product Line at Infineon Technologies’ Secure Connected Systems Division, said: “In recent years, due to the impact of the COVID-19 epidemic, the use of dual-interface payment cards for contactless payments has become a global standard. The SECORA Pay solution aims to "Enabling the manufacturing and issuance of high-quality dual-interface payment cards, providing extremely high transaction performance and reliable security for trusted and seamless payments", starting from an estimated 2.6 billion cards in 2022 to 2027. The interface payment card market is expected to grow at a CAGR of 6%.

The new plug-and-play solution from Infineon offers payment card manufacturers a convenient new customer onboarding and migration path. They are backward compatible with existing SECORA Pay products in terms of card production, antenna design, personalization and product authentication. Additionally, these devices offer excellent contactless and personalization capabilities, enabling contactless transactions to be completed in 155 milliseconds.

The new product range features a safety controller with certified software integrated into the Coil Module (CoM) chip. The product range also features standardized inlays for easy and fast card production and is compatible with SECORA Pay products in 65 nm, 40 nm and 28 nm technology specifications . These inlays can be used for both existing and next-generation SECORA Pay product. Infineon integrates inductive coupling technology and copper wire card antennas into the CoM system, allowing engineers to design payment cards with extreme flexibility. The system is therefore ideally suited to future market trends, such as eco-friendly payment cards made from recycled materials and ocean plastic or wood, as well as high-performance dual-interface metal or LED payment cards.

In addition to this, the SECORA Pay solution enables stable and extremely high-yield dual-interface payment cards using minimal resources during the payment card production process. This makes contactless payment technology inherently resource efficient. New value-added services based on SECORA Pay's NFC tag functionality can support more usage scenarios, such as initial card activation and identity verification for online banking and loyalty programs.

Availability

Product versions supporting the latest Visa and Mastercard applications are now available and have a very long lifespan. Verification mini-programs from American Express, Discover and others will launch later this year.