TI uses Matter-enabled wireless MCU software to unify the management of dispersed IoT ecosystems

Engineers can securely and reliably connect devices across all brands of smart home ecosystems over Wi-Fi® and Thread networks 

To achieve smarter connections in real life, Texas Instruments (TI) today launched a new software development kit supporting Matter for Wi-Fi and Thread SimpleLink™ wireless microcontrollers (MCU), which will simplify the application of the Matter protocol in the Internet of Things (IoT). ) adoption in applications. TI built this software through close collaboration with the Connectivity Standards Alliance and innovation in 2.4GHz connectivity. 

Engineers can use this new software, along with wireless MCUs such as the CC3235SF and CC2652R7, to create ultra-low-power, battery-powered, secure smart home and industrial automation IoT applications that can communicate seamlessly with devices in a variety of proprietary ecosystems. seam connection.

“In just a few weeks, we will soon see the innovation that alliance members bring to the ecosystem with new capabilities from Matter, namely a simplified approach to Wi-Fi and Thread-based MCUs and IoT applications,” said Connectivity Standards Alliance "TI's new wireless MCUs for IoT applications will help designers securely and seamlessly connect a variety of interoperable Matter devices," said Chris LaPre, technical director.

TI will demonstrate how the Matter protocol enables smarter electric vehicle charging management in the home at the electronics show in Munich, Germany, from November 15 to 18 in Hall C4, Booth 157.

“As a global leader in advanced pump solutions and water technology, we are delighted to be part of an alliance to drive Matter’s growth in the HVAC business. At Grundfos, we firmly believe that collaboration will be the key to achieving our innovation and sustainability goals is key,” said Anders Johanson, SVP and Head of Technology and Innovation Group at Grundfos Holding A/S. “We are collaborating with TI to bring Matter-enabled low-power radio solutions to the market, which will improve end-user experience and play an important role in reducing energy consumption in HVAC systems, thereby helping to reduce carbon emissions”

What is Matter Agreement?

Matter is a royalty-free connectivity protocol developed by the Connectivity Standards Alliance (formerly the Zigbee Alliance). Matter runs on the Thread and Wi-Fi network layers and uses Bluetooth® low energy for debugging, allowing devices from different ecosystems to communicate (even if they are made by different brands). By providing a unified application layer based on proven technologies, manufacturers can leverage this open source protocol to increase the speed of IoT application development. 

As a board member of the alliance and a participant in the development of the Matter standards, TI can help engineers build a broader and more connected IoT ecosystem to overcome the current compatibility challenges caused by fragmented ecosystems. In addition to working with the alliance, TI is a contributor to the Thread Group and a major contributor to the Wi-Fi Alliance.

Improve system efficiency and security with Matter-enabled SimpleLink wireless MCUs

New TI SimpleLink wireless MCUs can help designers reduce standby power consumption in Thread applications by up to 70% compared to competing devices, extending battery life by up to four years when using five-second polling. For long-distance connection applications, the high-efficiency integrated power amplifiers in these wireless MCUs enable reliable connections with 101mA, +20dBm power consumption (the lowest in the industry), further reducing battery power consumption at higher output powers.

Designers of Matter-enabled Wi-Fi applications take advantage of TI's dual-band, multi-layered security approach to protect device data and defend against cyber threats without the need for additional external components.

Easily integrate Matter with software and hardware resources

To simplify the design of Matter-enabled applications, chat with our applications engineers through the TI E2E™ Wireless Connectivity Design Support Forum, or watch the video "TI Matter Technology Demonstration: A Unified Standard for Connecting Objects" to learn how TI wireless MCUs simplify Matter connectivity. A FAQ guide is also available on the TI E2E™ Design Support Forum to help you get started with the CC2652R7 (Thread) and CC3235SF (Wi-Fi).

Packaging, availability and pricing

Engineers can purchase the LaunchPad™ Development Kit for the Thread LP-CC2652R7 ($39.99) and the Wi-Fi LP-CC3235SF ($54.99) immediately to start prototyping.

The CC2652R7 and CC3235SF are available now from TI and authorized distributors, with prices starting at $3.01 per piece for the CC2652R7 (in quantities of 1,000 pieces) and $4.53 per piece for the CC3235SF (in quantities of 1,000 pieces).

Flexible connectivity solutions tested to meet design needs

Whether designers choose wired or wireless, high bandwidth or signaling rates, short range or long range, or any other option that helps drive innovation in connectivity applications, TI's broad range of connectivity products provides the feature set to match their application needs .