Recently, the 2020 China International Intelligent Industry Expo (CIIE) was held in Chongqing. As an important industry participant in promoting the upgrading of the intelligent industry, Intel shared its insights into the development of the intelligent industry at the conference and demonstrated the latest progress in promoting technological innovation and ecological construction. The 2020 CIIE Intel FPGA Intelligent Innovation International Summit was also held at the same time. At this summit, Intel further shared its FPGA strategic direction, products and solutions, fully demonstrated Intel's innovative ecological concepts and practices, and showcased the latest achievements of Intel's largest FPGA Innovation Center located in Chongqing.
Yang Xu, Global Vice President and President of Intel China, delivered a keynote speech at the opening ceremony of the 2020 Smart Expo
Yang Xu, Intel's global vice president and president of China, delivered a keynote speech at the opening ceremony and summit of the 2020 Smart Expo. He said: "We are entering an intelligent era. The development and application of intelligent technology will release the value of data and bring industrial and economic upgrades to a new turning point. The 'Intelligent X Effect' will occur in a wide range of industries and economic fields. Intel will continue to innovate technology, empower the economy, and practice its grand purpose - 'Creating technology that changes the world and ultimately benefits everyone'. He also said: "Intel has been rooted in China for 35 years and has been tested and has been with local industries through thick and thin. We will continue to deepen ecological construction, work closely with the Chongqing Municipal Government and a wide range of ecological partners, accelerate the development of innovation platforms including the Intel FPGA China Innovation Center, help industrial applications land, and promote intelligent upgrades. "
Facing the future and promoting intelligent innovation
At the 2020 Intel FPGA Smart Innovation International Summit, Intel's senior leaders elaborated on Intel's strategy for FPGA development and ecosystem construction, and invited relevant partners to share their cooperation with Intel to promote the development of the FPGA industry and the implementation of smart innovation applications, and to help the development and breakthroughs of the FPGA and smart industry ecosystem.
David J. Moore, Vice President and General Manager of Intel's Programmable Solutions Group, delivered a keynote speech at the Intel FPGA Smart Innovation Summit
“We are at an exciting time of transformation, with inflection points in transformative technologies such as 5G, AI, intelligent edge and cloud computing reshaping the way we generate, analyze and use data to deliver next-generation capabilities across industries,” said David Moore, vice president and general manager of Intel’s Programmable Solutions Group. “Intel FPGA and eASIC products and our ecosystem partners are an important part of Intel’s strategy, and Intel’s unparalleled product portfolio brings flexible computing acceleration capabilities to drive customer innovation. The Intel FPGA China Innovation Center is a successful example of how we work with Chinese developers and partners to unlock the potential of data using Intel FPGAs.”
Li Desheng, Managing Director of Intel China Strategic Cooperation and Innovation Business Unit and General Manager of Intel Innovation Accelerator, delivered a keynote speech
Intel not only pursues comprehensive technological innovation, but also continues to build a broad and complete ecosystem to accelerate intelligent upgrades. Li Desheng, managing director of Intel China Strategic Cooperation and Innovation Business Department and general manager of Intel Innovation Accelerator, said that Intel is not only an innovative technology company, but also an evolving ecosystem company. "Water benefits all things without competing, which is Intel's ecological way. With Intel's own transformation, Intel is driving the evolution of the ecosystem, building a future-oriented industrial ecosystem, and promoting "fission innovation" based on AI×5G×intelligent edge. Intel will continue to build innovative platforms including Intel FPGA China Innovation Center, artificial intelligence innovation ecosystem, smart future city, etc. with its partners, and work together to build a comprehensive science and technology innovation ecosystem to accelerate the implementation of intelligent applications."
Intel FPGA Smart Innovation Online Forum (from left to right: Zhang Rui, General Manager of Intel FPGA China Innovation Center, Tian Liang, Chief Technology Officer of Chongqing Haiyun Jiexun Technology Co., Ltd., Zhao Weishi, General Manager of Shanghai Jiqing Huishi Technology Co., Ltd., Zhou Xiaopeng, Chief Technology Officer of Lianjie Computing Technology (Shenzhen) Co., Ltd.)
At this summit, Intel also invited a number of industry partners to participate in the Intel FPGA Innovation Forum to discuss new trends in intelligence and showcase cutting-edge technology applications based on industry collaboration. FPGA plays an increasingly important role in the current technology field. Based on the characteristics of FPGA's wide application in data centers, high performance, low power consumption, reconfigurability, and rapid time to market, data-centric FPGAs will play a greater role in the future, and will play an important role in the cloud and edge, network acceleration, and ultra-high-definition image acquisition, developing from 5G+IoT to 5G+AIoT.
Located in the "Silicon Valley of the West" to unleash innovation potential
In 2018, Intel's largest FPGA China Innovation Center in the world and the only one in Asia was established in Chongqing. At this summit, Intel showcased the latest cooperation results with the Chongqing Municipal Government and other industry partners. Since its establishment, the center has focused on five major areas: talent training, innovation incubation, application display, summit competition, and industry aggregation. Intel, the Chongqing Municipal People's Government and industry partners use this center as a base to deeply gather industry resources and accelerate global technological innovation with FPGA as the core. Through the new industry-education integration ecosystem and the FPGA cloud acceleration center, we have deeply explored FPGA cutting-edge applications, jointly built an FPGA industry ecosystem, and incubated AI emerging companies. The construction of the innovation ecosystem has achieved remarkable results.
Wu Cunrong, Executive Vice Mayor of Chongqing, delivered a speech at the 2020 Intel FPGA Innovation and Intelligence International Summit
"At the end of 2018, Intel FPGA China Innovation Center settled in Western (Chongqing) Science City. In more than a year, it has achieved remarkable results in professional talent training, R&D results transformation, and innovative enterprise cultivation. During the 2019 Smart Expo, Intel successfully held the FPGA Smart Innovation International Competition. The FPGA Smart Innovation International Summit held today aims to share forward-looking strategies and R&D results in the FPGA field, showcase FPGA cutting-edge technologies and innovative application directions, and help the development of the FPGA innovation ecosystem! I believe that the holding of this summit is of great significance to the smart innovation industry." Wu Cunrong, Executive Vice Mayor of Chongqing, said.
Zhang Rui, general manager of Intel FPGA China Innovation Center, said: "I am proud of the achievements made by the team and operating partners in the past year. Intel FPGA Cloud Acceleration Center has served more than 80 users including industry leaders, start-ups and universities. In terms of talent training, we have established a talent training system that combines online and offline, and collaborates theory and practice. During the epidemic, we provided more than 5,000 registered students with tens of thousands of online courses. As the situation improves, we gradually launched offline intermediate and advanced training. At the same time, in order to accelerate the transformation of FPGA technology resources into education, we specially launched the "Intel FPGA China Innovation Center Series of Books". The book has a total of 8 volumes, which will all be published this year. We will be down-to-earth and solve the talent shortage problem step by step to accelerate innovation and help the ecosystem!"
We are heading into an era of data floods. Intel is taking data as the center and comprehensively deploying future end-to-end computing innovations to fully unleash the value of data. Based on Intel's comprehensive computing technology, FPGA can better unleash the huge potential of data, give full play to its flexible, efficient, and reprogrammable characteristics, and achieve customized performance and other advantages, accelerating the implementation of applications in artificial intelligence, cloud services, data centers, 5G, and other fields. Intel will persist in technological innovation, build a broad ecosystem with partners, promote the implementation of more intelligent applications, solve more social challenges, and practice its grand purpose: to create technology that changes the world and benefits everyone on the planet.
Previous article:5G connects the world intelligently, building the future with chips, CCIC2020 is about to open
Next article:China International Import Expo, Messe Frankfurt restarts business in China
- Popular Resources
- Popular amplifiers
- e-Network Community and NXP launch Smart Space Building Automation Challenge
- The Internet of Things helps electric vehicle charging facilities move into the future
- Nordic Semiconductor Launches nRF54L15, nRF54L10 and nRF54L05 Next Generation Wireless SoCs
- Face detection based on camera capture video in OPENCV - Mir NXP i.MX93 development board
- The UK tests drones equipped with nervous systems: no need to frequently land for inspection
- The power of ultra-wideband: reshaping the automotive, mobile and industrial IoT experience
- STMicroelectronics launches highly adaptable and easy-to-connect dual-radio IoT module for metering and asset tracking applications
- This year, the number of IoT connections in my country is expected to exceed 3 billion
- Infineon Technologies SECORA™ Pay Bio Enhances Convenience and Trust in Contactless Biometric Payments
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Wi-Fi 8 specification is on the way: 2.4/5/6GHz triple-band operation
- Wi-Fi 8 specification is on the way: 2.4/5/6GHz triple-band operation
- Vietnam's chip packaging and testing business is growing, and supply-side fragmentation is splitting the market
- Vietnam's chip packaging and testing business is growing, and supply-side fragmentation is splitting the market
- Three steps to govern hybrid multicloud environments
- Three steps to govern hybrid multicloud environments
- Microchip Accelerates Real-Time Edge AI Deployment with NVIDIA Holoscan Platform
- Microchip Accelerates Real-Time Edge AI Deployment with NVIDIA Holoscan Platform
- Melexis launches ultra-low power automotive contactless micro-power switch chip
- Melexis launches ultra-low power automotive contactless micro-power switch chip
- Open source Tinygo releases version 0.70
- Find a high quality coulomb counter
- The wide temperature version of RK3399K core board is now online
- First look at TMS320C5410
- [Mill MYB-YT507 development board trial experience] + build QT development environment and test, the most detailed steps to solve all troubles
- [Repost] Advantages and process of dry etching
- Microphone noise problem
- How to ensure IoT security
- ELT8629 chip
- MicroPython driver for non-volatile memory