Three minutes to see the top ten domestic silicon wafer manufacturers
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导语:众所周知,硅晶圆市场长期被日本垄断。作为半导体产业的基础材料,我国的硅晶圆自给率极低。近来,上海新昇12英寸硅晶圆通过中芯国际的验证,这是国产硅晶圆厂商崛起的重要迹象。除了上海新昇之外,还有哪些国产硅晶圆厂商值得期待?
my country has a huge demand for silicon wafers, but most of them rely on imports. At present, China has only mastered the manufacturing technology of 8-inch and below silicon wafers. Among them, small-size 4-6-inch silicon wafers are basically self-sufficient, while the self-sufficiency rate of 8-inch and 12-inch silicon wafers is still very low.
近日,上海新昇传来捷报,12英寸硅晶圆如期通过中芯国际的验证,继华力微电子验证并采用之后,再度通过中芯国际的验证。虽然出片量仍不高,但官方表示已转亏为盈,这对中国半导体业算是相当大的鼓舞。
作为半导体产业的基础材料,硅晶圆被视为国家安全战略发展的关隘,发展硅晶圆产业迫不及待。作为一家2014年才成立的硅晶圆厂商,上海新昇起到了攻坚克难的排头兵作用。下面就跟随芯师爷,一起走进国产硅晶圆十大厂商(以下排名不分先后)。
1
上海新昇
http://www.zingsemi.com/
上海新昇半导体由中芯国际创始人张汝京博士成立于 2014 年 6 月,座落于临港重装备区内,是中国 02 专项 300mm 大尺寸硅片项目的承担主体,总投资68亿元,占地面积150亩。
新昇半导体第一期目标致力于在我国研究、开发适用于40-28nm节点的300mm硅单晶生长、硅片加工、外延片制备、硅片分析检测等硅片产业化成套量产工艺;建设300毫米半导体硅片的生产基地,实现300毫米半导体硅片的国产化,充分满足我国极大规模集成电路产业对硅衬底基础材料的迫切要求。2018年底月产能达到10万片,2020年底前将实现月产30万片产能目标,最终将达到100万片的产能规模。
新昇半导体的成立翻开了中国大陆300mm半导体硅片产业化的新篇章,将彻底打破我国大尺寸硅材料基本依赖进口的局面,使我国基本形成完整的半导体产业链。带动全行业整体提升产品能级,同时也将带动国内硅材料配套产业的发展。
300mm外延片 (300mm Epitaxial Wafer): 外延生长形成的具有单晶薄膜的衬底晶片通常被称为外延晶片。通过气相外延沉积的方法在衬底上进行长晶,与最下面的衬底结晶面整齐排列进行生长。外延硅晶片广泛使用在二极管,IGBT功率器件,低功 耗数字与模拟集成电路及移动计算通讯芯片等。新昇也按客户的要求提供不同类型的掺杂外延片,N型或P型等。
300mm Polished Wafer: 300mm Polished Wafer is a high-purity silicon wafer. After the single crystal silicon ingot is produced, it is cut into thin slices from the cylindrical single crystal silicon ingot. It is usually widely used in power devices, digital and analog integrated circuits and memory chips. The company also accepts different conditions of customers and manufactures high-quality silicon wafers that meet customer needs.
300mm Test Wafer: Test Wafer is mainly used for experiments and inspections. In the early stage of manufacturing equipment, test wafers were also used in large quantities to improve equipment stability. Since the purpose of use is different from that of commonly used wafer products, recycled wafers are widely used in test wafers.
2
Zhejiang Jinruihong
http://www.zjjrh.com/
Zhejiang Jinruihong Technology Co., Ltd. is a high-tech enterprise dedicated to the research and development and production of semiconductor materials. It was founded in June 2000 and is located in Ningbo Free Trade Zone. In 2010, it took the lead in undertaking the national major science and technology project of "extremely large-scale integrated circuit manufacturing equipment and complete process", and passed the national acceptance in May 2017. It has the large-scale industrialization capacity of producing 120,000 8-inch silicon wafers per month and has mastered the core technology of 12-inch silicon wafers.
The company is a semiconductor enterprise in mainland China with a complete industrial chain of silicon single crystal ingots, silicon grinding wafers, silicon polishing wafers, silicon epitaxial wafers, and chip manufacturing. It has a complete 4-inch, 5-inch, 6-inch and 8-inch silicon wafer product structure, forming the characteristics of integrated circuits and discrete devices, lightly doped and heavily doped, polished wafers and epitaxial wafers. The annual production capacity of silicon wafers reaches nearly 8 million pieces, and it can produce more than 5,000 technical specifications of silicon wafer products. It is the largest semiconductor silicon wafer production base in China.
Jin Ruihong is a stable supplier of internationally renowned semiconductor companies such as ONSEMI, AOS, TOSHIBA, and NXP. It is also an important supplier of major domestic semiconductor companies such as SMIC, Hua Hong Semiconductor, China Resources Shanghua, AVIC Microelectronics, and Hangzhou Silan Microelectronics.
3
Beijing Youyan Group
http://www.grinm.com/
Beijing Youyan Technology Group Co., Ltd. (Youyan Group for short) was founded in 1952. It is an innovation-driven comprehensive engineering technology research and development and high-tech industry cultivation entity in my country's nonferrous metals industry. It is currently a central enterprise managed by the State-owned Assets Supervision and Administration Commission of the State Council with a registered capital of 3 billion yuan.
The company is mainly engaged in the research and development, service and industrialization of engineering technology in the fields of microelectronics and optoelectronic materials, new energy materials, non-ferrous metal special functional materials, non-ferrous metal structural materials and preparation and processing technology, non-ferrous metal powder and powder metallurgy, non-ferrous metal beneficiation metallurgy technology, special equipment development, non-ferrous metal material analysis and testing, non-ferrous metal science and technology information and soft science, material calculation and simulation. It has 16 national research centers and laboratories in the fields of semiconductor materials, non-ferrous metal composite materials, rare earth materials, biometallurgy, material preparation and processing, analysis and testing, new energy materials, etc., and has undertaken a number of national major scientific and technological special research projects and national strategic emerging industry development projects.
Large diameter single crystal silicon (wafer): The Institute has the largest scale and most advanced technology in the country in the production of silicon single crystals for integrated circuits. It can produce a series of large diameter single crystal silicon rods, heavily doped silicon polished wafers and lightly doped silicon polished wafers with a diameter of 200mm-450mm. The products have been highly praised by important high-end customers such as the United States, Japan and South Korea, and are mainly used in the field of large-scale integrated circuits.
Zone-melting single crystal silicon: The Institute has the ability to produce a series of zone-melting silicon single crystal products, which are used in power electronic devices such as power rectifiers, thyristors, gate turn-off thyristors (GTOs), power field-effect transistors (MOSFETs), insulated gate bipolar transistors (IGBTs), and power integrated circuits (PICs).
4
Luoyang Meisk
http://www.mclwafer.com/
Luoyang Maxik Electronic Materials Co., Ltd. (MCL) was founded in December 1995. Its main products are 4-inch, 5-inch, 6-inch and 8-inch silicon polished wafers of large-scale integrated circuit grade (IC grade).
MCL is one of the global silicon wafer suppliers. Its products are mainly sold all over the world, such as the United States, South Korea, Singapore, Japan, India, Hong Kong, China, etc. At the same time, it guarantees the product supply of well-known domestic and foreign companies.
In order to make MCL the world's leading silicon wafer supplier, MCL established a relatively complete management system in accordance with ISO9002 standards at the beginning of its establishment. It passed the management system certification of SGS YARSHLEY and China CESI Quality Certification Center on January 15, 1998. In May 2001, it passed the ISO9001:2000 certification of these two companies. In December 2004, it passed the TS16949 certification audited by SGS, and in February 2007, it passed the ISO14001 certification.
5
Shanghai Jingmeng
http://www.waferworks.com/
Shanghai Jingmeng Silicon Materials Co., Ltd. is a subsidiary of Hejing Technology Co., Ltd., which was founded in 1997. The founding team came from Silicon Valley in the United States and the domestic semiconductor industry, and the team members have been deeply involved in the semiconductor industry for a long time. Hejing has now become one of the top ten semiconductor silicon chip material suppliers in the world. The main products are semiconductor-grade polished silicon chips and semiconductor-grade epitaxial wafers.
Polishing wafers: The main polishing wafers of Hejing Technology are 4~8 inch low-defect, high-flatness silicon chips. At the same time, we provide silicon chips with different doping such as boron, phosphorus, arsenic, antimony, etc. to meet the needs of customers for different applications. In response to the current energy-saving trend, we provide low-resistance and ultra-heavy doped silicon chip technology to meet the needs of power components to reduce the open-circuit resistance (RDS(on)).
Epitaxial wafers: In addition to polished wafers, Hejing Technology also provides high-quality 4"~8" epitaxial wafers and buried epitaxial foundry to meet customers' needs for CMOS and power components, so as to achieve one-stop shopping service for customers.
6
Shenhe Thermal Magnetics
http://www.ferrotec.com.cn/shenhe
Shanghai Shenhe Thermomagnetic Electronics Co., Ltd. is a wholly-owned company invested by Japan Magnetic Fluid Technology Co., Ltd. in Shanghai Baoshan City Industrial Park. The company was founded in May 1995, with a total investment of 17.58 billion yen and a registered capital of 9.08 billion yen.
Shanghai Shenhe Thermomagnetic Electronics Co., Ltd. consists of TE Division, New Energy Materials Division, Semiconductor Silicon Wafer Division, Surface Treatment Division, and Cleaning Division. The main products include solar-grade single and multi-crystalline silicon ingots and single and multi-crystalline silicon wafers of various specifications below 8 inches (including 8 inches), 4”-6” MOS, microwave circuits, memory circuits and epitaxial substrates for high-power devices. Heavy-doped semiconductor grinding and polishing sheets, semiconductor thermoelectric materials, copper-clad ceramic substrates, precision parts cleaning, regeneration and electroplating services. The products involve electronics, semiconductors, solar power generation and other industrial fields. The products are recognized and praised by domestic and foreign customers.
Semiconductor silicon wafers: In 2002, Shanghai Shenhe Semiconductor Silicon Wafer Division introduced advanced 4~6 inch silicon wafer production lines from Toshiba Ceramics of Japan, using Japan's advanced production process technology and production management model. It mainly produces 4"-6" MOS, microwave circuits, memory circuits and epitaxial substrate heavily doped semiconductor grinding and polishing wafers used in high-power devices. The annual production capacity reaches 5 million pieces, and the industry scale and product quality level are among the best in China.
7
Central Europe
http://www.hosemicon.com/
Tianjin Huanou Semiconductor Materials Technology Co., Ltd. was established in 2000. It is a state-owned holding enterprise. Its predecessor was Tianjin Semiconductor Materials Factory. It is one of the earliest professional semiconductor material manufacturers in my country, with more than 50 years of semiconductor crystal production history and professional experience. All the products operated by the company are independently developed and produced by the company. It has a number of national authorized invention patents, forming four major product series: CZ single crystal silicon, FZ single crystal silicon, CZ silicon wafers, and FZ silicon wafers. Huanou FZ silicon single crystals/wafers have a domestic market share of more than 75% and a global market share of more than 18%, making it the largest distributor in China and the third largest distributor in the world.
Since 2008, Huanou Company has successively invested in and established Tianjin Zhonghuan Leading Materials Technology Co., Ltd. (main product: polishing wafers), Inner Mongolia Zhonghuan Photovoltaic Materials Co., Ltd. (main product: solar silicon wafers), Inner Mongolia Oujing Quartz Co., Ltd. (main product: quartz crucibles), Tianjin Huanou International Silicon Materials Co., Ltd. (trading company), and Hohhot Outong Energy Technology Co., Ltd. (main product: regenerated sand). The establishment of various subsidiaries has extended the industrial chain of Huanou Company, expanded the application field of products, and provided a strong guarantee for further expanding domestic and foreign markets.
Intrinsic and ultra-high resistivity FZ-Silicon single crystals: silicon single crystals with low impurity content, low defect density and perfect lattice structure pulled by the zone melting process. No impurities are introduced during the crystal growth process. Its resistivity is usually above 1000Ω•cm. It is mainly used to make high reverse voltage devices and optoelectronic devices.
Neutron irradiated zone molten silicon single crystal (NTDFZ-Silicon): Intrinsic zone molten silicon single crystal can be obtained by neutron irradiation to obtain silicon single crystal with high resistivity uniformity, which ensures the yield and consistency of device manufacturing. It is mainly used to make silicon rectifiers (SR), thyristors (SCR), giant transistors (GTR), thyristors (GRO), static induction thyristors (SITH), insulated gate bipolar transistors (IGBT), ultra-high voltage diodes (PIN), smart power devices (SMART POWER), power integrated devices (POWER IC), etc. It is the main functional material of various inverters, rectifiers, high-power control devices, and new power electronic devices. It is also the main functional material of various detectors, sensors, optoelectronic devices and special power devices.
Gas-phase doped melt zone silicon single crystal (GDFZ-Silicon): By utilizing the diffusion mechanism of impurities, gas-phase impurities are added during the process of pulling silicon single crystals by melt zone process, which fundamentally solves the problem of doping difficulties in melt zone process. Large-diameter, low-cost melt zone gas-doped silicon single crystals with arbitrary conductive types, wide resistivity range, and resistivity uniformity equivalent to neutron irradiation can be obtained. Its resistivity is 0.01-200Ω.cm, minority carrier lifetime is 500-2000s, and radial resistivity non-uniformity is ≤10%. It is suitable for the production of various semiconductor power devices, insulated gate bipolar transistors (IGBT), high-efficiency solar cells, etc.
CZ-Silicon: Silicon single crystals are pulled by combining CZ and FZ processes. The product quality is between CZ single crystals and FZ single crystals. Special elements such as gallium (Ga) and germanium (Ge) can be added. The new generation of CFZ solar silicon wafers prepared by CZ FZ method have various performance indicators far superior to all kinds of silicon wafers currently used in the global photovoltaic industry, and the conversion efficiency of solar cells is as high as 24-26%. The products are mainly used in high-efficiency solar cells made by special structures, back contacts, HIT and other special processes, and are more widely used in many products and fields such as LEDs, power devices, automobiles, satellites, etc.
8
Anhui Yixin Semiconductor
http://www.yisemi.com/
Anhui Yixin Semiconductor Co., Ltd. is invested by Anhui Huaxin Group and the company is located in Xinzhan High-tech Zone, Hefei City, Anhui Province.
The company adheres to the business philosophy of technological innovation and knowledge management, and takes the research and development, production, sales and technical services of large-size (12 inches and above) semiconductor single crystal silicon materials, crystal growth equipment and intelligent control systems as its mission, and aims to be the most innovative and competitive product and technology service provider in China's semiconductor materials and equipment field; through independent innovation, it develops large-size semiconductor single crystal silicon materials and fully automatic semiconductor equipment with core independent intellectual property rights and at the international leading level.
In December 2015, the company's independently developed 12-inch chip-level monocrystalline silicon wafers passed the test of the National Nonferrous Metals and Electronic Materials Analysis and Testing Center. The core parameters of the sampled products all passed the test, and the relevant indicators reached international standards. The successful development of the project products has realized the nationalization process of 12-inch chip-level monocrystalline silicon wafers from single crystal growth to grinding and polishing, filling the domestic gap.
12-inch chip-level monocrystalline silicon wafer
12-inch and above chip-grade monocrystalline silicon rods
In July 2017, the first phase of the "annual production of 1.6 million 12-inch chip-level monocrystalline silicon wafers" project independently developed by Anhui Yixin Semiconductor Co., Ltd. was officially put into production in Hefei Xinzhan High-tech Zone. This is the only 12-inch chip-level monocrystalline silicon material production project in Anhui Province and the fastest-progressing 12-inch large silicon wafer project in China.
At present, the company has started the planning and construction of the second phase of cutting, grinding and polishing processes.
The official production of Yixin Company means the further improvement of Hefei's integrated circuit industry chain. It not only has IC design, wafer manufacturing, packaging and testing projects, but also has chip raw material manufacturing companies. It is bound to provide new support for Hefei to build the "China IC Capital" and provide new impetus and confidence for the development of my country's integrated circuit industry.
9
Zhengzhou Hejing
http://www.waferworks.com
Zhengzhou Hejing belongs to Hejing Technology Co., Ltd., which is one of the top ten semiconductor silicon wafer material suppliers in the world. Its main products are polished silicon wafers and epitaxial silicon wafers. Its polished silicon wafer customers include TSMC, UMC, and World Advanced wafer foundries, while its epitaxial silicon wafer customers are mainly power management and analog IC factories, including Rexroth, Dazhong, and Fuding. Hejing has four to eight-inch silicon wafers, and its production bases are the eight-inch Longtan plant and the six-inch Yangmei plant. The Shanghai Hejing plant is four to six inches, and the Shanghai Jingmeng plant is the largest semiconductor epitaxial plant in Greater China.
Polishing wafers: The main polishing wafers of Hejing Technology are 4~8 inch low-defect, high-flatness silicon chips. At the same time, we provide silicon chips with different doping such as boron, phosphorus, arsenic, antimony, etc. to meet the needs of customers for different applications. In response to the current energy-saving trend, we provide low-resistance and ultra-heavy doped silicon chip technology to meet the needs of power components to reduce the open-circuit resistance (RDS(on)).
Epitaxial wafers: In addition to polished wafers, Hejing Technology also provides high-quality 4"~8" epitaxial wafers and buried epitaxial foundry to meet customers' needs for CMOS and power components, so as to achieve one-stop shopping service for customers.
In June this year, Zhengzhou Hejing Silicon Materials Co., Ltd. completed the drawing of the first 8-inch single crystal silicon rod and successfully took the rod out, which marked the successful trial production of the project and laid a solid foundation for the next step of mass production.
The Zhengzhou Hejing Silicon Single Crystal Polishing Wafer Production Project is located in the southern high-end manufacturing cluster of Zhengzhou Airport Economic Zone. Construction started on July 27, 2017. With the high attention and support of relevant provincial, municipal and district departments, the project construction has been advanced as scheduled. After only 11 months, the first 8-inch crystal rod has been pulled. It is expected to be sent for mass production in the second half of the year, becoming an important production capacity base for domestic silicon wafers.
10
Ningxia Yinhe
https://www.ferrotec.com/
Ningxia Yinhe Semiconductor Technology Co., Ltd. was established in 2015. The company is mainly engaged in the production, sales and import and export of semiconductor ingots and silicon wafers; the production, matching, sales and import and export of semiconductor integrated circuit components; and the research and development and consulting services of semiconductor materials.
In March this year, Ningxia Yinhe Semiconductor Technology Co., Ltd.'s large-size semiconductor silicon wafer project with a total investment of 1.6 billion yuan started construction in Yinchuan Economic and Technological Development Zone. After completion, the project will be able to produce 4.2 million 8-inch semiconductor-grade monocrystalline silicon wafers and 2.4 million 12-inch semiconductor-grade monocrystalline silicon wafers annually.
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