A semiconductor event not to be missed! 30+ forums, 200+ speakers, 1000+ exhibitors
Latest update time：2024-09-11
Reads：
The 12th China Electronic Special Equipment Industry Association Semiconductor Equipment Annual Conference
and
the 12th Semiconductor Equipment
and
Core Components Exhibition
will
be held from
September 25th to 27th
at
Wuxi Taihu International Expo Center
.
The conference will carry out activities including exhibitions, keynote forums, special forums, roundtable discussions, industry upstream and downstream matchmaking meetings, new product launches, etc.
30+
forums,
200+
speakers,
1000+
exhibitors, and an estimated
80,000+
visitors.
Five exhibition areas
and
six pavilions
are linked, with an exhibition area of
60,000 square meters
.
During the same period, the 2024 Integrated Circuit (Wuxi) Innovation and Development Conference (ICIDC), the 2024 China Integrated Circuit Design Innovation Conference and the 4th IC Application Exhibition (ICDIA-IC Show), the 11th Automotive Electronics Innovation Conference (AEIF) and the 2024 Automotive Electronics Application Exhibition, and the 2024 China Semiconductor Packaging and Testing Technology and Market Annual Conference will be held. Brand exhibitions in the field of integrated circuits will gather together to realize
the exhibition map
of
the entire industry chain
of design, manufacturing, packaging and testing, equipment and components
.
We sincerely invite you to attend the conference to share with us the latest achievements in the semiconductor equipment and core components industry and explore cooperation opportunities.
See you in Wuxi from September 25th to 27th!
Conference Arrangements Overview
September 25
09:00-17:00
2024 Integrated Circuit (Wuxi) Innovation and Development Conference (ICIDC)
China Electronics Equipment Industry Association Semiconductor Equipment Annual Conference (CSEAC)
09:20-17:00
Topic 1: Semiconductor Equipment and Core Components New Development Forum
09:30-12:00
Topic 2: Semiconductor Manufacturing and Core Components Chairman Forum
13:30-17:00
Topic 3: Semiconductor Manufacturing and Materials Chairman Forum
13:30-17:00
Topic 4: Semiconductor Equipment and Instruments Empowering Scientific Research and Teaching Development Forum
13:30-17:00
Topic 5: Semiconductor Manufacturing and Equipment Chairman Forum
09:30-12:00
Special event: New product launch
09:00-12:00
The 11th Automotive Electronics Innovation Conference (AEIF) and 2024 Automotive Electronics Application Exhibition
17:40-21:00
Welcome Dinner
September 26
09:30-12:00
Topic 6: Semiconductor Second-hand Equipment Industry Exchange and Cooperation Forum
13:30-16:30
Topic 7: Power and Compound Semiconductor Industry Development Forum
13:30-17:00
Topic 8: Forum on the Collaborative Development of Advanced Packaging Technology and Equipment Materials
09:30-16:30
Topic 9: Forum on the Joint Development of Manufacturing Process and Semiconductor Equipment Industry Chain
09:30-12:00
Topic 10: Semiconductor Equipment and Core Components Investment and Financing Forum
13:00-18:00
Topic 11: Forum on the innovative development of new materials and equipment driven by new devices and new processes
09:30-12:00
Special event: New product launch
09:00-17:00
2024 China Integrated Circuit Design Innovation Conference and the 4th IC Application Expo (ICDIA)
09:00-12:00
AEIF: Automotive Chip and System Design Seminar
September 27
09:00-12:00
ICDIA: AI big models empower chip design
13:00-17:00
ICDIA: China Communications and RF Technology Forum
09:00-12:00
ICDIA: RISC-V open source chip ecosystem
13:00-17:00
ICDIA: Innovative Chinese Chip Forum
Main Forum
2024 China Electronic Special Equipment Industry Association
Semiconductor Equipment Annual Conference
Time: 09:00-17:00,
September 25
Location: Hall B6, Wuxi Taihu International Expo Center
Swipe up and down to view
09:00-10:25 CSEAC&ICIDC Opening Ceremony
10:25-11:45 Special Reports
Dr. Wang Hui
Chairman of the Semiconductor Equipment Branch of China Electronic Special Equipment Industry Association, Chairman of ACM Semiconductor Equipment (Shanghai) Co., Ltd.
Dai Bowei
Director of the Institute of Microelectronics, Chinese Academy of Sciences
Meng Pu
Chairman of Qualcomm China
12:00-13:30 Buffet lunch
Industry report session host
Host:
Jin Cunzhong
Deputy Secretary General of China Electronic Special Equipment Industry Association
13:15-13:30 Wuxi High-tech Zone Integrated Circuit Industry Promotion
13:30-14:00
Opportunities for localization of integrated circuit pattern generation process equipment
Li Jinxiang
Deputy Secretary-General of China Electronic Special Equipment Industry Association, Expert Committee Member of the Electronic Technology Committee of the Ministry of Industry and Information Technology
14:00-14:20
Medium-term Demand Forecast for the Semiconductor Industry and Manufacturing Equipment in Japan and Worldwide
Tommy Sato
, Deputy Secretary General & GM, SEAJ
14:20-14:40
Leading the way in IC domestic equipment independence
Wang Yanqing
Chairman of Pioneer Holdings Group Co., Ltd./Wuxi Pioneer Group
14:40-15:00
Create key equipment for IC manufacturing and provide customer-oriented solutions
Xu Kaidong
Dr. Chairman and CEO of Jiangsu Leuven Instrument Co., Ltd.
15:00-15:20
Ion implantation equipment enables the manufacturing of next-generation integrated circuits
Nie Xiang
Chairman and General Manager of Qingdao Sifang Sirui Intelligent Technology Co., Ltd.
Industry report session host
Host:
Li Jinxiang
Deputy Secretary-General of China Electronic Special Equipment Industry Association, Expert Member of Electronic Technology Committee of the Ministry of Industry and Information Technology
15:20-15:40
Prospects of the application of atomic layer deposition equipment in advanced processes
Chen Xinyi
Deputy General Manager of Tuojing Technology Co., Ltd.
15:40-16:00
Applications and Challenges of Permanent Bonding Technology in Microelectronic Devices
Zhang Fei
Vice President of Technology, Suzhou Xinrui Technology Co., Ltd.
16:00-16:20
Opportunities to expand overseas markets based on China under the current situation
Li Changzhe,
Executive Director of EXACTA INTEGRATED ENGINEERING SDN BHD, Executive Vice President of Hangling Micro (Taizhou) Technology Co., Ltd.
16:20-16:50
Semiconductor Equipment Industry Review in 2023 and Outlook for 2024
Jin Cunzhong
Executive Vice Secretary General of China Electronic Special Equipment Industry Association
17:30-21:00 Welcome Dinner
*The agenda is constantly being updated, please refer to the actual situation on site
Special Forum 1
2024 Semiconductor Equipment and Core Components Support New Progress Forum
Time: September 25, 09
:20-17:00
Location:
Hall B1, Wuxi Taihu International Expo Center
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Moderator:
Ye Lezhi
Ph.D.
Deputy Secretary General of China Electronic Special Equipment Industry Association
09:20-09:40
Application of Kluber's high-performance special lubricants in semiconductor equipment
Han Yanchen
Kluber Lubrication (Shanghai) Co., Ltd., New Business Development Manager
Nanoimprint Lithography: Solutions for Micro-Nano Optical Structure Processing
Ji Ran
Chairman of Qingdao Tianren Micro-Nano Technology Co., Ltd.
10:20-10:40
Challenges of heterogeneous integration on platform design and wafer transfer
Feng Qiyi
Chief Operating Officer and General Manager of Wafer Transfer Division of Shanghai Guona Semiconductor Technology Co., Ltd.
10:40-11:00
Application of high-precision sensors in wafer thickness detection of semiconductor equipment
Jin Yan
Industry Sales Manager, Miyi (Beijing) Testing Technology Co., Ltd.
11:00-11:20
Coherent Laser and Materials Technologies Enable Semiconductor Manufacturing
Li Shuai
Coherent Semiconductor Industry Strategic Marketing Manager
11:20-11:40
Exploration and innovation of filtration and separation technology in the semiconductor field
Que Qiaoying
Application Technology Manager of Feichao (Shanghai) New Materials Co., Ltd.
11:40-12:00
High-performance active vibration reduction technologies and products for semiconductor equipment
Jiang Wei
Professor of Huazhong University of Science and Technology
12:00-13:30 Buffet lunch
Moderator of the afternoon report session
Host:
Yu Dayang
General Manager of Beijing Novartis Investment Management Co., Ltd.
13:30-13:50
Current status and development of vacuum valves
Song Kaiyu
PhD Director of Vacuum Valve Research Institute, Zhongke Jiuwei Technology Co., Ltd.
13:50-14:10
Application of Ultra-Precision Motion Stage in Front-End Semiconductor Equipment
Lu Hailiang
CTO of Jiangsu Jicui Sucos Technology Co., Ltd.
14:10-14:30
Domestic wafer transfer equipment: exploring opportunities and coping with difficulties on the road ahead
Lin Jian
Executive President and Chief Technology Officer of Honghu (Suzhou) Semiconductor Technology Co., Ltd.
14:30-14:50
Application of core silicon components of domestic high-end semiconductor equipment in heat treatment equipment, thin film deposition equipment, and etching equipment
Zhang Chunchen
Deputy General Manager of Hangzhou Dunyuan Juxin Semiconductor Technology Co., Ltd.
Wu Liwei
Chairman and General Manager of Shanghai Yinguan Semiconductor Technology Co., Ltd.
11:10-12:00 Roundtable Dialogue
Zheng Guangwen
Chairman of Shenyang Fuchuang Precision Equipment Co., Ltd.
Li Changlong
Vice Chairman of Shenyang Scientific Instrument Co., Ltd., Chinese Academy of Sciences
Le Weiping
Chairman of Shenzhen Hengyunchang Vacuum Technology Co., Ltd.
Zhang Yong
Chairman and Party Secretary of Beijing Zhongke Instrument Co., Ltd.
Wu Liwei
Chairman and General Manager of Shanghai Yinguan Semiconductor Technology Co., Ltd.
Fu Xin
Chief Scientist, Zhejiang Qier Electromechanical Technology Co., Ltd.
Ye Ying
Chairman of Shanghai Guona Semiconductor Technology Co., Ltd.
Lu Xubin
Chairman of Ningbo Yunde Semiconductor Materials Co., Ltd.
*The agenda is constantly being updated, please refer to the actual situation on site
Special Forum 3
2024 Semiconductor Manufacturing and Materials Chairman Forum
Time: September 25,
13:30-17:00
Location: Hall B3, Wuxi Taihu International Expo Center
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Host:
Yu Daquan
Chairman of Xiamen Yuntian Semiconductor Technology Co., Ltd.
13:30-13:55
The core component of thin film deposition equipment: ceramic heater
Liu Xianbing
Chairman and General Manager of Suzhou Kema Materials Technology Co., Ltd.
13:55-14:20
Win-win cooperation to create a better future
Li Wei
Executive Vice President and Secretary of the Board of Directors of Shanghai Silicon Industry Group; Chairman of Shanghai Xinsheng, Chairman and President of Simao Technology
14:20-14:45
Development status of epoxy molding compounds and related industry chains
Han Jianglong
Chairman and General Manager of Jiangsu Huahai Chengke New Materials Co., Ltd.
14:45-15:10
Material innovation supports the development of integrated circuit technology
Peng Hongxiu
Deputy General Manager of Anjie Microelectronics Technology (Shanghai) Co., Ltd.
15:10-15:35
Development of domestic production of Damascus copper electroplating solution
Hou Jun
Chairman of Zhejiang Aoshou Materials Technology Co., Ltd.
15:35-16:00
Temporary bonding material system solutions for advanced packaging
Zhang Guoping
Chairman of Shenzhen Huaxun Semiconductor Materials Co., Ltd.
16:00-17:00 Roundtable Dialogue
Moderator:
Yu
Daquan Dr. Chairman of Xiamen Yuntian Semiconductor Technology Co., Ltd.
Shen Qi
Chairman of Jiangsu Yak Technology Co., Ltd.
Hou Jun
Chairman of Zhejiang Aoshou Materials Technology Co., Ltd.
Han Jianglong
Chairman and General Manager of Jiangsu Huahai Chengke New Materials Co., Ltd.
Liu Xianbing
Chairman and General Manager of Suzhou Kema Materials Technology Co., Ltd.
Jiang Pengfei
Vice President of Shanghai Xinyang Semiconductor Materials Co., Ltd.
*The agenda is constantly being updated, please refer to the actual situation on site
Special Forum 4
2024 Semiconductor Equipment and Instruments Empowering Scientific Research and Teaching Development Forum
Time: September 25,
13:30-17:00
Location: Hall A1, Wuxi Taihu International Expo Center
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Moderator:
Lin Nan
Deputy Director of National Key Laboratory of Ultra-Intensive Laser Science and Technology, Shanghai Institute of Optics and Precision Mechanics, Chinese Academy of Sciences
13:30-13:55
Semiconductor equipment and instrument research and development drives multidisciplinary talent training
Guo Xiaojun
Professor Executive Vice Dean of the School of Integrated Circuits, Shanghai Jiao Tong University
13:55-14:20
Measurement and control technology and equipment for integrated circuit manufacturing
Wang Xinhe
Professor Vice Dean of the School of Integrated Circuit Science and Engineering, Beihang University
14:20-14:45
Low-frequency noise characteristics of oxide thin-film transistors and their reliability applications
Liu Yuan
Professor, Vice Dean of the School of Integrated Circuits, Guangdong University of Technology
14:45-15:10
Advanced Packaging Technology Trends and SMEE Solutions
Zhou Xuchao
Director of Testing Platform, Shanghai Microelectronics Equipment (Group) Co., Ltd.
15:10-15:35
Discussion on the Frontier of EUV Mask Inspection Technology
Kuang Cuifang
Professor of Zhejiang University, Jiangsu Duwei Optical Technology Co., Ltd.
15:35-17:00 Roundtable Dialogue
Moderator:
Lin Nan
Deputy Director of National Key Laboratory of Ultra-Intensive Laser Science and Technology, Shanghai Institute of Optics and Precision Mechanics, Chinese Academy of Sciences
Zhang Wei
Dean of Fudan University School of Microelectronics
Li Jing Qiushi
Distinguished Professor, School of Mechanical Engineering, Zhejiang University
Cao Zizheng
Researcher/Deputy Director of Pengcheng Laboratory
Zhou Xuchao
Director of Testing Platform, Shanghai Microelectronics Equipment (Group) Co., Ltd.
Gu Xiaofeng
Dean of the School of Integrated Circuits, Jiangnan University
Dong Yemin
General Manager of Shanghai Industrial Technology Research Institute
*The agenda is constantly being updated, please refer to the actual situation on site
Special Forum 5
2024 Semiconductor Manufacturing and Equipment Chairman Forum
Time: September 25,
13:30-17:00
Location: Hall A3, Wuxi Taihu International Expo Center
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Host:
Yang Shaohui
Deputy General Manager of Xingqi (Shanghai) Semiconductor Co., Ltd.
13:30-13:35 Leader’s speech
13:35-13:55
To be determined
Yang Feng
General Manager and CEO of Bosch Reilly Scientific Instruments (Shanghai) Co., Ltd.
13:55-14:15
Advanced bonding technology empowers IC innovation
Zhou Jian
Vice President of TuoJing Technology Co., Ltd.
14:15-15:35 Roundtable Discussion 1
Lv Guangquan
Chairman of TuoJing Technology Co., Ltd.
Yang Feng
General Manager and CEO of Bosch Reilly Scientific Instruments (Shanghai) Co., Ltd.
Li Yongjun
Chairman of Shanghai Kaishitong Semiconductor Co., Ltd.
Lin Xing
Chairman of Yanwei (Jiangsu) Semiconductor Technology Co., Ltd.
Hong Feng
General Manager of Shenzhen Axin Semiconductor Technology Co., Ltd.
15:35-15:55
The rise of private enterprises in the process of localization of semiconductor equipment
Zhou Ren
General Manager of Jiangsu Microguide Nanotechnology Co., Ltd.
15:55-16:15
Opportunities and challenges of high-end semiconductor deposition equipment in chip manufacturing
Lin Xing
Chairman of Yanwei (Jiangsu) Semiconductor Technology Co., Ltd.
16:15-17:00 Roundtable Dialogue 2
Wang Hui
Dr.
Chairman of the Semiconductor Equipment Branch of China Electronic Special Equipment Industry Association,
Chairman of ACM Semiconductor Equipment (Shanghai) Co., Ltd.
Zhou Ren
General Manager of Jiangsu Microguide Nanotechnology Co., Ltd.
Zheng Jin
Chairman and General Manager of Nanjing Yuanlei Nanomaterials Co., Ltd.
Song Weicong
Chairman of Shanghai Bitong Semiconductor Energy Technology Co., Ltd.
Huang Chongji
Chairman and General Manager of Shanghai Weichong Semiconductor Equipment Co., Ltd.
*The agenda is constantly being updated, please refer to the actual situation on site
Special Forum 6
2024 Semiconductor Second-hand Equipment Industry Exchange and Cooperation Forum
Time: 09:30-12:00,
September 26
Location: Hall A1, Wuxi Taihu International Expo Center
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Moderator:
Wang Zuoyi
Chairman of Shanghai Guangyi Electronic Technology Co., Ltd.
09:30-09:50
Xinxin Leasing, a comprehensive financial service resource integrator - combining investment and leasing to help the development of the national integrated circuit industry
Yuan Yipei
Executive Vice President of Xinxin Financial Leasing Co., Ltd.
09:50-10:10
Exploration from second-hand equipment to domestic new equipment
Gao Qi
Chairman of Yangzhou Jingxin Microelectronics Co., Ltd.
*The agenda is constantly being updated, please refer to the actual situation on site
Special Forum 7
2024 Power and Compound Semiconductor Industry Development Forum
Time:
September 26, 13:30-16:30
Location:
Hall A3, Wuxi Taihu International Expo Center
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Moderator:
Wang Yonggang
President of Gongqingcheng Anxin Investment Partnership
13:30-13:50
SiC power semiconductor technology and its progress
Liu Guoyou
Deputy Director of the National Key Laboratory of Power Semiconductors and Integrated Technology, Vice Dean of the School of Integrated Circuits, Southwest Jiaotong University
13:50-14:10
AMEC's epitaxial equipment solutions help create high-quality compound semiconductors
Hu Jianzheng
Senior Director of AMEC (Shanghai) Co., Ltd.
14:10-14:30
Create key equipment for third-generation semiconductor manufacturing - atomic layer deposition and ion implantation
Chen Xianglong
Deputy General Manager of Qingdao Sifang Sirui Intelligent Technology Co., Ltd.
14:30-14:50
Etch-deposition integration enables large-scale manufacturing of compound semiconductor power devices
Dr. Guo Chunxiang
Process Manager, Jiangsu Leuven Instruments Co., Ltd.
14:50-15:10
The latest technology trends and directions of compound semiconductor chip technology
Ye Guoguang
Deputy General Manager of Wuxi Yiwen Microelectronics Technology Co., Ltd.
15:10-15:30
Opportunities and challenges of localization of advanced process electron beam measurement equipment
Jia Xiwen
Product Director of Beijing Oriental Crystal Microelectronics Technology Co., Ltd.
15:30-15:50
Application and development trend of integrated circuit electroplating technology
Jin Yinuo
Senior Process Director of ACM Semiconductor Equipment (Shanghai) Co., Ltd.
15:50-16:10
Trends of my country's Silicon Carbide Industry
Chen Dongpo
Deputy General Manager of Beijing Sanan Optoelectronics Co., Ltd.
16:10-16:30
Analysis and Prospect of China's Silicon Carbide Industry Situation
Xu Ke
Founder and Chief Analyst of Shanghai Banyan Consulting
*The agenda is constantly being updated, please refer to the actual situation on site
Special Forum 8
Forum on Collaborative Development of Advanced Packaging Technology and Equipment Materials
Time: September 26,
13:30-16:30
Location: Hall A1, Wuxi Taihu International Expo Center
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Host:
Gong Li
General Manager of Seuss China
13:30-13:50
The localization process of Ada wire bonding machine and advanced packaging equipment
He Yunbo
Chairman of Guangdong Ada Semiconductor Equipment Co., Ltd.
13:50-14:10
SUSS Hybrid Bonding Technology
Ben Zhou
, Sales Director, SUSS MicroTec (Shanghai) Ltd.
14:10-14:30
Enable And Extend Processing Capabilities Within The Fab By ProTec´s Unique Electrostatic Fixation Technologies
Sebastian Wagner,
CEO/Managing Director, ProTec Carrier Systems GmbH
14:30-14:50
Advanced Packaging in the AI Era
He Jianxi
Deputy General Manager of Jiangsu Yuanfu Semiconductor Technology Co., Ltd.
14:50-15:10
Semiconductor dicing process and precision dispensing technology sharing
Zhou Yun
Project Director of Shenzhen Tengsheng Precision Equipment Co., Ltd.
15:10-15:30
Plating Process and Equipment
Atanasios Kondomitsos
, CEO, MOT GmbH
15:30-15:50
Double side Copper-Sintering at 170°C for Power Electronics
Olav Birlem
, CEO, NanoWired GmbH NanoWired
15:50-16:10
Application of grinding and polishing in the semiconductor industry and localization solutions
Liu Quanyi
General Manager of Shenzhen Mengqi Semiconductor Equipment Co., Ltd.
16:10-16:30
Heterogeneous Wafer Level Integration
Dr. M.Juergen Wolf
, Ex-Director, Fraunhofer IZM-ASSID
*The agenda is constantly being updated, please refer to the actual situation on site
Special Forum 9
Forum on the Joint Development of Manufacturing Process and Semiconductor Equipment Industry Chain
Time:
09:30-16:30, September 26
Location:
Hall B1, Wuxi Taihu International Expo Center
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Moderator:
Xu Kaidong
Ph.D.
Chairman and CEO of Jiangsu Leuven Instrument Co., Ltd.
09:30-09:50
Electron beam measurement and testing equipment track
Zhao Yan
General Manager of Suzhou Sishi Technology Co., Ltd.
09:50-10:10
New progress in localization of semiconductor manufacturing supply chain
Zhang Ting
Director of Supply Chain Management, Shanghai Jetta Semiconductor Co., Ltd.
10:10-10:30
Thin Film Technology and Integrated Circuit Equipment - Challenges, Opportunities and Solutions
Li Qian
Vice President of Beijing North Huachuang Microelectronics Equipment Co., Ltd.
10:30-10:50
Domestic bright-field nano-pattern wafer defect inspection equipment helps improve the yield of integrated circuit manufacturing
Yan Haibin
Deputy General Manager of Semiconductor Division, Suzhou Tianjue Technology Co., Ltd.
10:50-11:10
Challenges of Wafer Inspection
Park Tae-hoon
Chairman of Wuxi Nakoxin Technology Co., Ltd.
11:10-11:30
Semiconductor and Advanced Packaging Failure Analysis Challenges and Solutions
Huang Chengliang
Zeiss Microscopes Carl Zeiss (Shanghai) Management Co., Ltd. Business Development Manager
11:30-11:50
Exploration of localization of metal materials based on atomic layer deposition
Wang Chuandao
Vice President of Products, Yanwei (Jiangsu) Semiconductor Technology Co., Ltd.
12:00-13
:30 Buffet lunch
Moderator of the afternoon report session
Host:
Jin Cunzhong
Deputy Secretary General of China Electronic Special Equipment Industry Association
13:30-13:50
Introduction of gasification products and design of safe supply of special gases
Ding Shuanggen
Deputy Chief Engineer of Gasification Division, China Electronics System Engineering Second Construction Co., Ltd.
13:50-14:10
Application of high-power RF devices in photovoltaic semiconductors
Zhou Lei
General Manager of Shanghai Huaxiang Computer Communication Engineering Co., Ltd.
14:10-14:30
Sharing of high-quality recycled water reuse technology
Wang Chengyi
Director of Technology Research Institute, Jiangsu Zhongdian Innovation Environmental Technology Co., Ltd.
14:30-14:50
Progress in the industrialization of Kaishitong ion implantation equipment
Zhang Changyong
Deputy General Manager of Shanghai Kaishitong Semiconductor Co., Ltd.
14:50-15:10
Advanced emission reduction technologies help semiconductor ESG
Lu Zhenguo
Director of Products and Applications, Shanghai Xiewei Environmental Technology Co., Ltd.
15:10-15:30
Semiconductor chip manufacturing defect detection technology and equipment
Xu Jingrui
Senior Vice President of Zhongdao Optoelectronics Equipment Co., Ltd.
15:30-15:50
Innovation and Evolution of Advanced Semiconductor Lithography Technology
Junli Guo,
Director of Semiconductor Research, Asia Pacific, IDC Consulting Co., Ltd.
16:10-16:30
AI empowers edge applications, semiconductor investment outlook
Sun Fangfang
Vice President of CITIC Securities Co., Ltd.
*The agenda is constantly being updated, please refer to the actual situation on site
Special Forum 10
2024 Semiconductor Equipment and Core Components Investment and Financing Forum
Time: September 26, 09
:30-12:00
Location:
Hall B3, Wuxi Taihu International Expo Center
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Host:
Ji Zongliang
Founder of Jihua Capital
09:30-09:55
What is the future of new equipment companies
?
Su Hongsen
Chairman of Jiaxin Hongyang Semiconductor Equipment Technology (Zhejiang) Co., Ltd.
09:55-10:20
Key components: Challenges of domestic substitution of instruments and meters
Lin Jingxuan
General Manager of Feizhuo Technology (Shanghai) Co., Ltd.
10:20-10:45
One-stop solution for memory chip die bonder - from Flash to DRAM
Yang Yang
Executive Vice President & CTO of Dongguan Touchpoint Intelligent Equipment Co., Ltd.
10:45-11:10
A breakthrough in domestic substitution of AMHS
Gu Xiaoyong
General Manager of Chengchuan Technology (Suzhou) Co., Ltd.
11:10-12:00 Roundtable Dialogue
Host:
Ji Zongliang
Founder of Jihua Capital
Nie Xiang
Chairman of Qingdao Sifang Sirui Intelligent Technology Co., Ltd.
Chen Shunhua
Managing Partner of New Micro Capital
Chen Yu
Managing Director of Yuanhe Puhua Investment Management Co., Ltd.
Qi Yaoliang
General Manager of Ruijing Semiconductor Co., Ltd.
Zhang Peng
Managing Director of Tianjin TEDA Technology Investment Co., Ltd.
*The agenda is constantly being updated, please refer to the actual situation on site
Special Forum 11
2024 Forum on the Innovation and Development of New Materials and New Equipment Promoted by New Devices and New Processes
Time: September 26,
13:00-18:00
Location:
Hall B3, Wuxi Taihu International Expo Center
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13:00-13:30 Meeting Sign-in
Moderator:
Feng Li
Senior Vice President of Shanghai Institute of Integrated Circuit Materials
13:30-13:50 Leader’s speech
Guo Yiwu
Vice Chairman of China Semiconductor Industry Association, Secretary General of Shanghai Integrated Circuit Industry Association
Yu Xiekang
Executive Vice Chairman of the Integrated Circuit Branch of the China Semiconductor Industry Association, Chief Expert of Jiangsu Province Integrated Circuit Industry Chain Strengthening Team
13:50-14:10
Industry-research collaboration accelerates collaborative innovation of integrated circuit materials
Liu Bing
Senior Vice President of Shanghai Integrated Circuit Materials Research Institute
Benefit 2: Forward the conference article and receive a limited edition "wafer"
Forward the recent promotional article of "CSEAC 2024" to your Moments
(visible to everyone) to receive a customized gift for the conference
- CSEAC
limited edition
"wafer silicon wafer"
.
With the valid page forwarded to your Moments, you can receive it at the on-site
gift collection area
. The quantity is limited, first come first served!
Concurrent exhibitions: 2024 China Integrated Circuit Design Innovation Conference and the 4th IC Application Exhibition (ICDIA-IC Show), the 11th Automotive Electronics Innovation Conference (AEIF 2024) and the Automotive Electronics Application Exhibition,
more than 200
exhibitors will showcase new products, new technologies and new applications.
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