Qualcomm releases breakthrough Wi-Fi technology at Embedded World 2024 and launches AI-Ready’s new IoT and industrial platform
Latest update time：2024-04-10
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Main points
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• Qualcomm Technologies is at the center of digital transformation across many industries with its leadership in connectivity, high-performance low-power processing and on-device AI.
•
Make intelligent computing ubiquitous by launching new industrial and embedded AI platforms and ultra-low-power Wi-Fi SoCs.
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The company hopes to expand its product portfolio to respond to the needs of industrial-grade solutions for safety, operating environment and mechanical handling. The new products are expected to begin sampling in June 2024.
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More than 35 companies demonstrated Qualcomm's technology or the application development it supports at Embedded World, demonstrating Qualcomm's broad and deep ecosystem in this field.
Today, at the Embedded World Exhibition & Conference, Qualcomm Technologies demonstrated its important position in the embedded and IoT ecosystem and has become the center of digital transformation by continuously accelerating industry innovation. More than 35 companies, including embedded design centers, distributors and independent software vendors, demonstrated deployment in multiple segments such as robotics, manufacturing, asset and fleet
management , AI edge computing boxes and automotive solutions.
Solutions for
Qualcomm®
processors
.
At Embedded World Expo, Qualcomm Technologies introduced a new portfolio of products and solutions designed to empower customers across the embedded ecosystem. The new
Qualcomm®
QCC730 Wi-Fi solution
and
the
second
-generation Qualcomm®
Robot RB3 platform
bring major upgrades, empowering device
-
side AI, high-performance low-power processing and connectivity for the latest IoT products and applications.
Qualcomm QCC730 Wi-Fi Solution
Qualcomm Technologies also launched a disruptive ultra-low-power Wi-Fi system for the Internet of Things connection field - Qualcomm®
QCC730
. This technological breakthrough delivers up to 88% lower power consumption than previous generations, transforming battery-powered industrial, commercial and consumer applications. QCC730 will complement open source IDEs and SDKs and support cloud connection offloading for ease of development. Its versatility even allows developers to use the QCC730 as a high-performance alternative for Bluetooth®
IoT
applications, enabling flexible design and direct cloud connection. Qualcomm Technologies also offers a range of IoT connectivity products, including the triple-core ultra-low energy Bluetooth®
(
Bluetooth Low Energy) SoC QCC711 and the QCC740 all-in-one solution that supports Thread, Zigbee, Wi-Fi and Bluetooth.
Rahul Patel, general manager of Qualcomm Technologies’ Connectivity, Broadband and Networking (CBN) group, said
:
Complementing high-performance, low-latency wireless connectivity solutions, Qualcomm QCC730 SoC is an industry-leading ultra-low-power Wi-Fi solution that provides Wi-Fi connectivity for battery-powered IoT platforms. The QCC730 brings TCP/IP networking capabilities to the device while meeting its requirements for form factor and being completely wireless, while maintaining connectivity to the cloud platform. The new products, along with our portfolio of IoT connectivity, put Qualcomm Technologies at the center of the next generation of battery-powered smart home, medical, gaming and other consumer electronics devices, reflecting our efforts to leverage decades of R&D experience to reach new users. The promise of consumer experience.
Second generation Qualcomm Robot RB3 platform
The new second-generation Qualcomm Robot RB3 platform is a complete set of software and hardware solutions designed for IoT and embedded applications. The second-generation RB3 platform uses Qualcomm®
QCS6490
processor, supports high-performance processing, increases terminal-side AI processing capabilities by 10 times
[1]
, supports four over-8-megapixel camera sensors, computer vision, and integrates Wi-Fi 6E. The second-generation RB3 platform is expected to be widely used in a variety of products, including various types of robots, drones, industrial handheld devices, industrial and networked cameras, AI edge computing boxes, and smart displays. The platform is now available for pre-order through two integrated development kits and supports downloadable software updates to simplify application development, integration, proof-of-concept and prototyping.
The recently released Qualcomm AI Hub also provides support for the second-generation RB3 platform, which contains a continuously updated pre-optimized AI model library to bring excellent terminal-side AI performance, reduce memory usage and improve energy efficiency. The platform supports the deployment of a variety of widely used AI models in IoT and embedded applications, resulting in an optimized experience that is ready to use. Developers can view a series of models for the second-generation RB3 platform and integrate optimized AI models into their applications, shortening product time to market and leveraging the many advantages of on-device AI deployment, such as immediacy, reliability, privacy, Personalization and cost advantages.
The second-generation RB3 platform supports Qualcomm®
Linux®
—
a complete package of operating systems, software, tools and documentation designed
for
Qualcomm Technologies' IoT platform. It provides a unified Linux distribution, adapts to a variety of SoCs since the release of the Qualcomm QCS6490 processor, and supports important components including long-term support (LTS) kernels to achieve a consistent and excellent developer experience. The Qualcomm Linux software stack will extend support for all processor cores, subsystems and components within the platform. Currently, Qualcomm Linux is open for internal preview to some partners and plans to open it to a wider range of developers in the next few months.
To expand the company's open source technology expertise and accelerate product commercialization using Qualcomm Linux, Qualcomm Technologies recently acquired Foundries.io, an open source cloud native platform provider, to create a platform that simplifies the complexity of developing and updating Linux-based IoT and edge terminals. sex.
Ready for industrial scenarios
To further expand the company's broad portfolio of IoT solutions, Qualcomm Technologies will launch an industrial-grade platform focused on functional safety, environmental and mechanical handling needs of industrial applications. The new platform will support system integrity level certification, a wide operating temperature range and industrial module packaging to meet the deployment needs of enterprise and industrial environments. The solution is expected to be available in June 2024, featuring high-performance CPU, GPU and terminal-side AI capabilities, equipped with an advanced security camera ISP that supports multiple concurrent cameras, and meets industrial I/O needs.
Jeff Torrance, senior vice president and general manager of the Industrial and Embedded IoT business at Qualcomm Technologies, said
:
At Embedded World, we look forward to showcasing the latest technologies and working with our ecosystem partners to help them continue to bring exciting new IoT products to the industry. We are pleased to launch the second generation RB3 platform, designed to bring advanced on-device AI capabilities to a wide range of mid-range IoT applications. Soon, we will expand our IoT product portfolio to address the need for high-performance industrial-grade solutions for the most demanding industrial applications, ushering in a new era of intelligence, functional safety, and powerful high-performance computing and I/O capabilities. .
For more information about Qualcomm Technologies at Embedded World in Germany, please visit
[
Read More
]
or visit our booth (Nuremberg Messe, Hall 5, 161).
[1]
Compared with the first generation Qualcomm Robot RB3 platform.
*
Qualcomm products referenced in this release are provided by Qualcomm Technologies Incorporated and/or its subsidiaries.
*
Qualcomm and Snapdragon are registered trademarks of Qualcomm Incorporated.
*
Adreno and Hexagon are trademarks or registered trademarks of Qualcomm Incorporated.
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