Samtec board-to-board connectors "three beauties" in one frame, which one is the most beautiful? Please vote~
Board-to-Board Connectors
In the design of interconnection systems of today's electronic products, board-to-board connectors are widely used due to their miniaturization, high density, economy and multi-functionality. In the product planning of various connector manufacturers, board-to-board connectors also occupy an important position, and similar products are emerging in an endless stream.
For developers, every selection of board-to-board connectors is like a "draft". They need to "select" the products they need from a variety of materials to form the best solution. This is undoubtedly a test of the developer's experience and skills.
Selection considerations
As an experienced "judge" - that is, a developer who participates in material selection - when facing a board-to-board connector, you will have a basic outline of the "ideal choice" in your mind, and will make a comprehensive assessment of the basic capabilities and special "talents" of the product to make the right decision. If you make a list of the key factors to consider when selecting materials, there are roughly the following aspects:
Board-to-Board Connector Selection Factors
# Environmental tolerance: If transmission rate, current carrying capacity and other indicators are the basic skills of board-to-board connectors, environmental tolerance can be said to be a "special talent" of the product. In some harsh and complex environment applications, board-to-board connectors must be able to withstand mechanical vibration and shock, extreme working environment, electrostatic discharge (ESD), plug-in and unplug times, etc. to ensure safe and reliable electrical connections. The strength of this ability is defined by relevant industry standards. Some manufacturers will also implement their own test standards on this basis and provide products that exceed industry standards to demonstrate their strength and provide added value to customers.
Unique technology
In fact, various connector manufacturers have long been aware of the selection factors for the above-mentioned board-to-board connectors. Therefore, they often inject some "unique" technologies into product design and manufacturing. While benchmarking these selection standards, they try to differentiate their own products as much as possible in order to stand out from many competing products.
Samtec has a lot of experience in this regard. For example, in its high-speed, high-density board-to-board connectors, the Edge Rate® terminal system is widely used . This is a terminal designed for high-speed applications that require long life. It is optimized for 50Ω and 100Ω systems. Its surface is polished to create a smooth docking surface area. Compared with stamped terminals docked on the cut edge, it can reduce wear and improve the durability of the terminal, thereby extending the service life of the terminal. This unique design also reduces the insertion force and extraction force, allowing the connector to be plugged and unplugged in a "zipper" manner.
On the other hand, the Edge Rate
®
contact system has an ultra-small parallel surface area, which reduces broadside coupling and
crosstalk
, which is beneficial to improving the signal integrity of the connector.
With this unique technology, Samtec's high-speed board-to-board connectors are even more powerful.
Another noteworthy feature of Samtec's board-to-board connector products is the harsh environment test (SET). SET is an initiative of Samtec to test certain products that exceed typical industry standards and specifications. The test standards performed by SET exceed the prevailing industry standards and specifications. These additional tests can ensure that products that pass SET can adapt to the requirements of industrial, military, automotive and other extreme applications.
SET's testing standards include:
-
Durability test with 250 plug and unplug cycles at 100% relative humidity
-
High Altitude Withstand Voltage (DWV) Test: Simulated altitude 70,000 feet, 300V AC for 60 seconds
-
Electrostatic Discharge (ESD) testing at 5kV, 10kV and 15kV
-
Temperature cycled from -65°C to +125°C 500 times, 30 minutes each cycle
-
Mechanical shock 40G, peak shock duration 11ms, half sine
-
Random vibration 12Grms, 5Hz to 2000Hz, 1 hour per axis
Of course, Edge Rate® terminals and the SET standard are just two typical examples of the many technologies Samtec applies to board-to-board connectors. These technologies are combined to create a number of board-to-board connector products with excellent "comprehensive quality", making them stand out among many board-to-board interconnect solutions.
Three "star" products
01
AcceleRate ® HD Ultra High Density Sandwich Strip
The slim appearance should be the most direct impression people have of this board-to-board connector. AcceleRate ® HD includes ADM6 plugs (pins) and ADF6 sockets, with a 0.635mm pitch, a slim 5mm width, and a stacking height as low as 5mm. In this compact appearance, it adopts a high-density four-row design with 10 to 60 pins per row - products with 70 to 100 pins per row are under development, which means that in the future, the AcceleRate ® HD solution can support up to 400 I/Os, and the so-called "ultra-high density" can be said to be worthy of the name.
Figure 3: AcceleRate
®
HD ultra-high density sandwich tape (Source: Samtec)
In terms of transmission rate, AcceleRate
®
HD plug and socket connectors are compatible with PCIe
®
Gen 5 and support applications up to 56Gbps PAM4 (28Gbps NRZ). At the same time, due to the use of Edge Rate
®
terminal system, it also performs very well in signal integrity.
Figure 4: AcceleRate ®
HD Ultra-High Density Mezzanine Strip (ADM6/ADF6) has a slim profile
compared to other board-to-board products
(Source: Samtec)
Due to the use of solder ball technology,
the ball grid array termination of
AcceleRate
®
HD can be self-aligned in the reflow process and is compatible with mainstream electronic assembly processes. At the same time, the open pin area design of the connector also facilitates flexible grounding and wiring.
It can be said that our basic requirements for an excellent board-to-board connector are reflected in this interconnect solution and have excellent performance.
02
SEARAY™ SEAF and SEAM Connectors
This is also an important product series of Samtec in the field of high-speed and high-density board-to-board connectors. They are grid array connectors with a 1.27mm pitch, supporting transmission speeds up to 56Gbps, and using 7mm to 17.5mm stacking heights. SEAF and SEAM connectors also use the Edge Rate® contact system, so they have low insertion and extraction forces, as well as excellent durability and signal integrity.
Figure 5: SEARAY™ SEAF and SEAM connectors (Source: Samtec)
SEARAY™ SEAF and SEAM connectors also have an outstanding feature - they use an open terminal array design, which can simultaneously transmit differential signals, single-ended signals and power in the same connector, achieving maximum flexibility in grounding and wiring.
Figure 6: SEARAY™ SEAF and SEAM connectors feature an open pin array design (Source: Samtec)
In terms of environmental tolerance, SEARAY™ SEAF and SEAM connectors have been SET tested and comply with IPC-A-610F and IPC J-STD-001F standards, meeting the requirements of Category 3 acceptance criteria for high-performance, harsh environment electronic products. Therefore, they are ideal for high-density board-to-board interconnect solutions for electronic products in complex application environments such as military/aerospace, automotive, industrial and medical.
Currently, this series of products has formed a complete product portfolio, providing solutions with different matching heights, assembly forms, and connection methods, bringing great convenience to design selection.
03
mPower™ 2mm UMPT/UMPS Ultra-Micro Power Connectors
In addition to the high-speed signal connectors mentioned above, board-to-board power connectors are also an important product line of Samtec, and mPower™ 2mm UMPT/UMPS ultra-low power connectors are representative products.
These power connectors have a 2mm pin pitch and include products from 2 to 5 positions. They are available in stack heights from 5mm to 12mm (20mm height products are under development), and have a current carrying capacity of up to 18A per blade (contact), making them a miniaturized, high-power interconnect solution.
UMPT/UMPS ultra-low power connectors have also passed SET testing, so they can be used safely in harsh environments.
In addition, the UMPT/UMPS connector can be used as a pure power system or in conjunction with Samtec's other high-speed, high-density signal connectors - including the ADM6/ADF6 and SEAF/SEAM connectors mentioned above - to form a two-piece system for dual applications of "power + signal", thereby improving design flexibility. This is also a "benefit" that Samtec board-to-board connectors bring to developers.
Figure 8: UMPT/UMPS connector and other signal connectors form a dual-application two-piece system (Source: Samtec)
Figure 9: Signal connectors that can be used with UMPT/UMPS connectors (Source: Samtec)
Which is the "most beautiful" product in your mind?
Now, these three "beautiful" board-to-board connectors are in front of you at the same time. Which connector is your favorite? Let's do a vote. Please vote for the "most beautiful" product in your mind!
Here, we want to do a prize voting
Among the three Samtec board-to-board connectors introduced in this article,
Which one is your "favorite"?
-
AcceleRate ® HD Ultra High Density Sandwich Strip
-
SEARAY™ SEAF and SEAM Connectors
-
mP ower™ 2mm UMPT/UMPS Connectors
Come and vote now
↓↓↓
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