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STM32MP151DAC1

Description
ARM® Cortex®-A7 Microprocessor IC, 32-bit 209MHz, 800MHz 361-TFBGA (12x12)
Categorysemiconductor    The embedded processor and controller   
File Size3MB,255 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric View All

STM32MP151DAC1 Overview

STMicroelectronics STM32MP151A is based on high performance ARM A/D device up to A7 800 MHz. It provides an external SDRAM interface, supports up to 8 Gigabit density (1 Gigabit), 16 or 32-bit LPDDR2 or LPDDR3 or DDR3/DDR3L, External memory up to 533MHz. Low power consumption 3 DMA controllers for offloading CPU reset and power management

STM32MP151DAC1 Parametric

Parameter NameAttribute value
categorysemiconductor;The embedded processor and controller
MakerSTMicroelectronics
seriesSTM32MP1
Packagetray
core processorARM® Cortex®-A7
Number of cores/bus width1 core, 32-bit
speed209MHz,800MHz
Coprocessor/DSPARM® Cortex®-M4
RAM controllerDDR3,DDR3L,LPDDR2,LPDDR3
graphics accelerationyes
display and interface controllerHDMI-CEC,LCD
Ethernet10/100Mbps,GbE
SATA-
USBUSB 2.0(2),USB 2.0 OTG+ PHY(3)
Voltage - I/O2.5V,3.3V
Operating temperature-20°C ~ 105°C(TJ)
security featuresARM TZ
Installation typesurface mount type
Package/casing361-TFBGA
Supplier device packaging361-TFBGA(12x12)
Additional interfaceCAN, Ethernet, I²C, MMC/SD/SDIO, SPDIF, SPI, UART, USB
Basic product numberSTM32

STM32MP151DAC1 Preview

Download Datasheet
STM32MP151A/D
Arm
®
Cortex
®
-A7 800 MHz + Cortex
®
-M4 MPU,
TFT, 35 comm. interfaces, 25 timers, adv. analog
Datasheet
-
production data
Features
LFBGA
TFBGA
Includes ST state-of-the-art patented
technology
Core
32-bit Arm
®
Cortex
®
-A7
– L1 32-Kbyte I / 32-Kbyte D
– 256-Kbyte unified level 2 cache
– Arm
®
NEON™ and Arm
®
TrustZone
®
32-bit Arm
®
Cortex
®
-M4 with FPU/MPU
– Up to 209 MHz (Up to 703 CoreMark
®
)
LFBGA448 (18 × 18mm)
LFBGA354 (16 × 16mm)
Pitch 0.8mm
TFBGA361 (12 × 12 mm)
TFBGA257 (10 × 10 mm)
min Pitch 0.5mm
Low-power modes: Sleep, Stop and Standby
DDR memory retention in Standby mode
Controls for PMIC companion chip
Low-power consumption
Total current consumption down to 2 µA
(Standby mode, no RTC, no LSE, no
BKPSRAM, no RETRAM)
Memories
External DDR memory up to 1 Gbyte
– up to LPDDR2/LPDDR3-1066 16/32-bit
– up to DDR3/DDR3L-1066 16/32-bit
708 Kbytes of internal SRAM: 256 Kbytes of
AXI SYSRAM + 384 Kbytes of AHB SRAM +
64 Kbytes of AHB SRAM in Backup domain
and 4 Kbytes of SRAM in Backup domain
Dual mode Quad-SPI memory interface
Flexible external memory controller with up to
16-bit data bus: parallel interface to connect
external ICs and SLC NAND memories with up
to 8-bit ECC
Clock management
Internal oscillators: 64 MHz HSI oscillator,
4 MHz CSI oscillator, 32 kHz LSI oscillator
External oscillators: 8-48 MHz HSE oscillator,
32.768 kHz LSE oscillator
5 × PLLs with fractional mode
General-purpose input/outputs
Up to 176 I/O ports with interrupt capability
– Up to 8 secure I/Os
– Up to 6 Wakeup, 3 tampers, 1 active
tamper
Security/safety
TrustZone
®
®
peripherals, active tamper
Interconnect matrix
2 bus matrices
– 64-bit Arm
®
AMBA
®
AXI interconnect, up to
266 MHz
– 32-bit Arm
®
AMBA
®
AHB interconnect, up
to 209 MHz
Cortex -M4 resources isolation
Reset and power management
1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
POR, PDR, PVD and BOR
On-chip LDOs (RETRAM, BKPSRAM, USB
1.8 V, 1.1 V)
Backup regulator (~0.9 V)
Internal temperature sensors
May 2021
This is information on a product in full production.
3 DMA controllers to unload the CPU
48 physical channels in total
1 × high-speed general-purpose master direct
memory access controller (MDMA)
DS12500 Rev 6
1/255
www.st.com

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