New knowledge! TC-SAW technology with strong resistance to temperature changes

Latest update time：2024-03-08

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TC-SAW technology

Strong resistance to temperature changes

SAW devices are the product of the organic combination of surface acoustic wave theory, piezoelectric research results and microelectronics technology in modern acoustics.

In order to meet the requirements for miniaturization and multi-functionality of machines, Kyocera uses its unique evaluation technology and micro-processing technology to develop and mass-produce and supply various surface acoustic wave duplexers (SAW duplexers/antenna duplexers), as well as various Surface acoustic wave filter (SAW filter).

This issue will introduce you to TC-SAW technology used in the communications market. This technology is unique to Kyocera and has high power resistance and excellent temperature characteristics.

Unique TC-SAW technology

One of the required properties of the filter is a small frequency temperature coefficient, that is, a small TCF. In order to reduce frequency changes caused by temperature changes, Kyocera uses unique TC*-SAW technology (Temperature Compensated SAW Technology). Kyocera's TC-SAW technology achieves the advantages of high power resistance and excellent temperature characteristics by bonding the piezoelectric body and the support substrate together.

*TC：Temperature Compensated=Temperature characteristic compensation

word explanation

What is TCF?

TCF is the abbreviation of Temperature Coefficient of Frequency (Temperature Coefficient of Frequency), which is also an indicator of how frequency changes with temperature.

(The above data are all obtained from Kyocera's survey)

SAW devices have a wide range of application scenarios

There are so many knowledge points waiting for you to unlock

Want to know more about SAW

You can use the link below

Get a glossary of electronic components

https://ele.kyocera.com.cn/support/glossary/saw-device/

Features·Application

Features

(1) Excellent temperature characteristics: TC-SAW technology uses a structure in which the piezoelectric body and the supporting substrate are bonded together, which can support band advantages that the piezoelectric body alone cannot support.

(2) High power tolerance: TC-SAW technology can achieve high power tolerance by improving heat dissipation.