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Infineon Technologies Launches New CoolGaN™ Drive Product Family, Including Integrated Single Switch and Half-Bridge with Integrated Driver

Latest update time:2024-09-05
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Consumer electronics and industrial applications are showing diverse development trends such as portability, electrification, and lightweight. These trends require compact and efficient designs, and also require the use of unconventional PCB designs, which face strict space constraints and thus limit the use of external components. To meet these challenges, Infineon Technologies AG has launched the CoolGaN™ Drive product family, further enriching its gallium nitride (GaN) product portfolio .


The product family includes the CoolGaN™ Drive 650 V G5 single switch, which integrates a transistor and gate driver in PQFN 5x6 and PQFN 6x8 packages, and the CoolGaN™ Drive HB 650 V G5 device, which integrates two transistors and high-side and low-side gate drivers in an LGA 6x8 package. The new product family achieves higher efficiency, smaller system size and lower total cost for long-range e-bikes, portable power tools, and lightweight home appliances such as vacuum cleaners, fans and hair dryers.


CoolGaN™ Drive 650 V G5


For many years, Infineon has been focusing on accelerating innovation in the GaN field and providing targeted solutions to real-world power challenges. The new CoolGaN™ Drive product family once again demonstrates how we can help customers develop compact designs with high power density and high efficiency through GaN.

Johannes Schoiswohl

Senior Vice President and Head of GaN Systems Business Line, Infineon Technologies


The CoolGaN™ Drive product family includes several single switch and half-bridge products with integrated drivers, which are based on the recently released CoolGaN™ transistor 650 V G5. Depending on the product group, the series of components have features such as bootstrap diode, lossless current measurement, adjustable turn-on/off dV/dt, and also provide OCP/OTP/SCP protection functions. As a result, these semiconductor devices enable smaller, more efficient and high power density system solutions with higher switching frequencies. At the same time, the bill of materials (BoM) is also reduced. This not only reduces system weight, but also reduces the carbon footprint.


Availability

The half-bridge solution is available for sampling now.

Single switch samples will be available starting in Q4 2024.


Click here for more product information.


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