Interpretation of the five largest 12-inch wafer fabs in mainland China

Latest update time：2015-04-26

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China has become the country with the largest semiconductor market demand in the world. According to ICInsights data, China's semiconductor market demand has accounted for about 30% of the global market demand . Judging from the current production capacity, China has a large gap in 12- inch wafer production capacity. According to ICInsights data, Taiwan and South Korea control 56% of the world's 12 -inch wafer production capacity, while mainland Chinese manufacturers only control less than 1% of the world's 12- inch wafer production capacity, and the 12- inch wafer production capacity in mainland China (including wholly foreign-owned enterprises) is 8% . The huge market demand, coupled with the limitations of process technology, has made mainland China a new hot spot for investment in semiconductor manufacturing.

At the end of 2014 , UMC finally saw the dawn of revenue from 28nm process. After the Taiwan Ministry of Economic Affairs confirmed that there was no concern about technology outflow, it decided to land in mainland China and invest in a new 12- inch wafer factory. The project will use 40 and 55nm processes and is expected to produce 50,000 12 -inch wafers per month after it is officially put into production .

" This is China's first 12- inch production line built by a joint venture , " said Mo Dakang, a semiconductor industry research expert. " Although UMC provided 55/40 nanometer technology, it is responsible for operation, so there is no need to worry about technology and orders. Moreover, UMC's overall technology is better than ours, so China can learn from it. From the perspective of both sides, it will also change the situation of cross-strait cooperation in the future. "

TSMC, which is more advanced in technology and market share, currently has only one 8 -inch wafer fab in Shanghai. It is also considering investing in a 12- inch wafer fab in the mainland and using the 28nm process. However, due to the Taiwan government's requirement that semiconductor wafer fabs invested in the mainland must comply with the "N-2" (two generations behind Taiwan's process) regulations, TSMC's plan to build a 12- inch wafer fab is expected to be realized as early as 2016 , and the related production capacity will be less than 10% of TSMC's total production capacity .

Previously, Huali Microelectronics , a pure 12- inch wafer foundry under Huahong Group , had already announced that it would invest about 19.5 billion yuan to build a new 12- inch plant, and it is expected to lock in advanced processes, starting from 28nm process, and according to the plan of three generations of process technology from 28nm to 16/14nm and then to 10nm , the monthly production capacity will reach about 30,000 to 50,000 pieces. Wuhan Xinxin has also officially signed a contract with Spansion, the world's largest flash memory company , to jointly build a 12- inch wafer plant and jointly develop and produce 3D NAND (three-dimensional flash memory chips).

So far, there are 5 local 12- inch wafer fabs built in mainland China.

The following is an introduction to the top five 12-inch wafer fabs in China and their production capacity.

Monthly production capacity: 50,000 pieces

UMC (Xiamen)

United Microelectronics Corporation (UMC) was founded in 1980 as Taiwan's first semiconductor company. A pioneer in the global semiconductor industry, it was the first company to introduce copper process production wafers, produce 12-inch wafers, and produce the industry's first 65-nanometer process chip. It was also the first company to use 28-nanometer process technology to produce chips. UMC's cutting-edge wafer manufacturing technology helps customers produce faster and more powerful chips to meet the needs of today's application products. UMC's cutting-edge technologies include high-k/metal gate, low-k, immersion lithography, and mixed-signal/RFCMOS technologies. UMC is the first company in Taiwan to provide wafer manufacturing services and the first listed semiconductor company in Taiwan (1985).

UMC is a leader in 12-inch wafer manufacturing and currently has two 12-inch wafer fabs in operation. Fab 12A is located in Tainan and has been mass producing customer products since 2002. It currently produces the industry's most advanced 28nm process products with a monthly wafer production capacity of more than 50,000 wafers. UMC's second wafer fab, Fab 12i, is located in Singapore. This second-generation 12-inch wafer fab has also entered mass production with a monthly wafer production capacity of 45,000 wafers. Advanced automation equipment, mature defect density and competitive production cycle, coupled with customer-oriented capacity expansion plans, make UMC the best wafer foundry choice to meet customer needs. In addition to 12-inch fabs, UMC has seven 8-inch fabs and one 6-inch fab, producing products required in every major field of the semiconductor industry.

On January 27, UMC announced on behalf of its subsidiary Suzhou wafer foundry Hejian Technology that it will invest RMB 613 million, or approximately NT$3.052 billion, in Xiamen 12-inch foundry Unigroup, with a shareholding ratio of 33.33%.

According to UMC's plan, UMC plans to invest in Unichip within 5 years from 2015, with a total investment amount of up to 1.35 billion US dollars, which will be paid in installments according to the planned progress. In the initial stage, UMC will invest in its mainland subsidiary Hejian. In the future, UMC will have 6 directors of the Xiamen 12-inch plant, which means it has the dominant power in operation. The plant is expected to start construction this year and start production in 2016 with 55nm and 40nm processes. The planned maximum monthly production capacity is 50,000 pieces, and it can also strive for subsidies from the mainland integrated circuit industry fund.

UMC's Xiamen 12-inch plant, Unigroup Integrated Circuit, held a groundbreaking ceremony yesterday, March 26, in Xiamen Torch High-tech Zone.

Semiconductor Manufacturing International Corporation (Beijing, Wuhan)

Semiconductor Manufacturing International Corporation (SMIC) is one of the world's leading integrated circuit foundries and the largest and most technologically advanced integrated circuit foundry in mainland China. SMIC provides 0.35 micron to 28 nanometer foundry and technical services to customers around the world. SMIC is headquartered in Shanghai, with a 300mm wafer fab and a 200mm ultra-large-scale wafer fab in Shanghai; a 300mm ultra-large-scale wafer fab in Beijing, and a controlling 300mm advanced process wafer fab is under development; and a 200mm wafer fab in Tianjin and Shenzhen. SMIC also has marketing offices and customer service in the United States, Europe, Japan and Taiwan, and a representative office in Hong Kong.

Semiconductor Manufacturing International Corporation (SMIC) was established on July 25, 2002. It is a wholly-owned subsidiary of SMIC and currently has about 1,700 employees. It owns my country's first 12-inch integrated circuit production line. It is mainly engaged in logic chip foundry, and its current production capacity is 50,000 pieces per month.

SMIC's Wuhan 12-inch wafer production capacity is 60,000 pieces per month, and it mainly produces coded flash memory.

Monthly production capacity: 52,000 pieces

Intel (Dalian)

Intel Corporation is the world's largest semiconductor company and the first company to launch the x86 architecture processor. It is headquartered in Santa Clara, California, USA. The company was co-founded by Robert Noyce, Gordon Moore, and Andy Grove on July 18, 1968 under the name of "Integrated Electronics", combining advanced chip design capabilities with industry-leading manufacturing capabilities. Intel was developing SRAM and DRAM memory chips in its early days, and these memory chips were Intel's main business before the 1990s. In the 1990s, Intel made considerable investments in new microprocessor designs and cultivated the rapidly emerging PC industry.

Intel established a representative office in Beijing in 1985. Today, Intel has become one of the largest foreign-invested enterprises in China, with more than 7,500 employees. Intel China is also the second largest institution with the most comprehensive deployment in the world, including chip manufacturing, packaging and testing , new technology research, product development and marketing - Intel Dalian chip plant is Intel's first wafer manufacturing plant in Asia, Intel Chengdu plant is a world-class chip packaging and testing plant, Intel China Research Institute in Beijing focuses on forward-looking embedded system research, and Intel Asia Pacific Research Center in Shanghai is Intel's R&D base and innovation center in China.

Intel Dalian Chip Factory is an advanced semiconductor chip manufacturing plant built by Intel Semiconductor (Dalian) Co., Ltd. in Dalian with an investment of US$2.5 billion. It is also the first chip factory established by Intel in Asia. The factory started construction at the end of 2007, was completed and put into use in 2009, and officially started production in October 2010. The total construction area of Dalian Chip Factory is 163,000 square meters, of which the clean workshop area is 15,000 square meters. It uses the industry's mainstream 300 mm silicon wafers and Intel's mature 65 nanometer process technology to produce computer chipset products.

Intel's Dalian wafer factory currently mainly produces processors, with a monthly production capacity of 52,000 pieces.

Monthly production capacity: 100,000 pieces

Samsung (Xi'an)

Samsung Group was founded in 1938 and is the largest business group in South Korea. Its current businesses include electronics, finance, heavy industry, chemicals, engineering, services, etc., among which electronics is the largest business area of the group. Samsung started its business in China as early as 1992, and currently 22 companies under the group have entered China. There are more than 160 institutions established.

In 1978, Samsung Semiconductor was separated from Samsung Electronics and became an independent entity. Since 1983, with the successful development of 64KDRAM ultra-large-scale integrated circuits , it has developed many new semiconductor products based on a single home appliance semiconductor product and gradually became a leading semiconductor manufacturer in the world. Its semiconductor products mainly include DRAM, SRAM, flash memory, ASIC, CPU and TFF-LCD panels, etc.

Starting from the third quarter of 2014, Samsung's semiconductor division has replaced the IM (Information Technology & Mobile Communications) division, which is responsible for the core smartphone business, for two consecutive quarters and has taken the title of Samsung's profit goose.

Samsung Xi'an Semiconductor was completed on May 9, and high-end flash memory chips officially began mass production. Xi'an Semiconductor held a groundbreaking ceremony in September 2012, and the construction period was about 20 months. The park covers an area of about 1.14 million square meters, with a total construction area of about 230,000 square meters, producing 10-nanometer NAND flash memory chips (V-NAND). Samsung's high-end flash memory chip project officially started on September 12, 2012, and it took only 20 months to complete the project construction, equipment installation and commissioning, and staff move-in.

Xi'an Semiconductor's current production capacity is 100,000 articles per month.

Capacity champion: 130,000 pieces

SK Hynix (Wuxi)

SK Hynix Semiconductor Inc. is a South Korean electronics company and one of the top 20 semiconductor manufacturers in the world. Hynix was founded in 1983 under the name of Hyundai Electronics Industry Co., Ltd. In the 1980s and 1990s, they focused on selling DRAM and later SDRAM. In 2001, they sold their TFT LCD business for $650 million. In the same year, they developed the world's first 128MB graphic DDR SDRAM. In early 2012, SK Group, the third largest chaebol in South Korea, announced that it had acquired 21.05% of Hynix's shares and thus took control of this memory giant.

As of 2014, NAND Flash accounted for 20% of SK Hynix's total revenue, of which SSD accounted for about 10%. SK Hynix plans to increase the proportion of SSD in NAND Flash revenue to double digits in 2015 to enhance the strength of NAND Flash business. In 2014, the company achieved the highest revenue and profit in history since its establishment.

In 2015, SK Hynix decided to adopt a selection and concentration strategy, focusing on its strengths in 20nm micro-process DRAM, triple-level cell (TLC) NAND Flash technology, and solid-state drives (SSDs). In terms of system chips, which are relatively weak, it will focus on the development of CMOS image sensors (CIS).

The main products of Hynix Wuxi Company are 12-inch integrated circuit wafers, which are used in PC, Server, Graphic, Mobile, Graphic and other solid-state memory fields. SK Hynix China Company is the only industrial project in Wuxi City approved by the State Council for construction. The total investment in the first phase is US$2 billion, the second phase is US$1.5 billion, the third phase is US$2.555 billion, and the fourth phase is US$2 billion. The SK Hynix project is the largest and most technologically advanced semiconductor project in China and the largest foreign-invested single project in Jiangsu Province.

SK Hynix's Wuxi plant was hit by a fire on September 4, 2013. Since the fire started inside the wafer fab, the Wuxi plant was shut down for a month, and the global DRAM supply dropped by 10% in that month. After the fire, SK Hynix's Wuxi plant produced 30,000 and 70,000 wafers in October and November respectively. The Wuxi plant is fully loaded with 130,000 wafers.

After the above introduction, we have learned about the main 12-inch wafer fabs in mainland China. Finally, the statistical table of wafer fabs and their production capacity is attached:

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