The United States invested 6.4 billion to develop Chiplet
????If you hope to meet more often, please mark the star ?????? and add it to your collection~
Source: The content is compiled from theregister by Semiconductor Industry Observer (ID: i cb ank), thank you.
The Pentagon's research center DARPA has allocated US$840 million (about RMB 6.4 billion) to develop the next generation of semiconductor microsystems for the US military.
The recipient of the funding is the Texas Institute for Electronics (TIE), an organization founded in 2021 and based at the University of Texas at Austin, which is a consortium of state and local governments, chip companies and academic institutions.
TIE’s research focuses on heterogeneous integration technology, also known as chiplets — individual pieces of silicon packaged together to form complete chips. Processors from AMD and others are known for using this approach: a modern AMD Ryzen or Epyc part, for example, includes a cluster of chips, each housing a CPU core and clusters of IO circuits.
Because of TIE’s experience in semiconductor R&D, DARPA has selected the team to develop 3D heterogeneous integration (3DHI) technology, an approach that involves stacking layers of silicon on top of each other rather than side by side in a chip package. The funding is part of DARPA’s Next Generation Microelectronics Manufacturing (NGMM) program.
The project will take five years to complete and is divided into two parts. The first phase involves building a manufacturing center to create 3DHI microsystem prototypes for the Department of Defense (DoD). TIE's industry partners include AMD, Applied Materials, Global Foundries, Intel, Micron, and others.
As we mentioned, this isn’t entirely new technology; chips and chip stacks are already used in some form in today’s PC and server microprocessors and GPUs. Crucially, NGMM’s goal is to provide the U.S. Department of Defense with “higher performance, lower power, lightweight and compact defense systems” for use in “radar, satellite imaging and drones,” among other things.
That is: applying this consumer and commercial technology to the military field.
The total budget for the project is therefore about $1.4 billion, with $840 million coming from DARPA and $552 million coming from the state of Texas itself.
Reference Links
https://www.theregister.com/2024/07/18/darpa_awards_840m_to_utaustin/
END
*Disclaimer: This article is originally written by the author. The content of the article is the author's personal opinion. Semiconductor Industry Observer reprints it only to convey a different point of view. It does not mean that Semiconductor Industry Observer agrees or supports this point of view. If you have any objections, please contact Semiconductor Industry Observer.
Today is the 3832nd content shared by "Semiconductor Industry Observer" for you, welcome to follow.
Recommended Reading
★ Important report on EUV lithography machine released by the United States
Silicon carbide "surge": catching up, involution, and substitution
★ Chip giants all want to “kill” engineers!
Apple , playing with advanced packaging
★ Continental Group, developing 7nm chips
★
Zhang Zhongmou's latest interview: China will find a way to fight back
"The first vertical media in semiconductor industry"
Real-time professional original depth
Public account ID: icbank
If you like our content, please click "Reading" to share it with your friends.