Free Attendance | Zhiji/Yijie/Solidigm/Yicheng/Ansi/AT&S and other 20+ important guests will meet you at Suzhou SiP China on November 27!
On November 27, 2024 , the 8th China System-Level Packaging Conference SiP Conference China2024· Suzhou Station hosted by UBM Creative Exhibition will be held at the Nikko Hotel Suzhou. The conference will focus on the three major themes of "AI/Big Computing Applications", "Storage/High-Speed Interconnect Applications", and "New Processes and Materials"; covering SiP, heterogeneous integration technologies and business trends from OSAT, test/equipment providers, material/IC substrate suppliers, system manufacturers and R&D industries.
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2024 is an important year for the development of AI, which will drive the rapid growth of the global advanced packaging market. According to a report by Yole Group, the global advanced packaging market size will be US$39.2 billion in 2023 and is expected to increase to US$81.1 billion by 2029 , with a CAGR of 12.9% .
In 2025, elexcon Shenzhen International Electronics Exhibition will continue to follow up the development and application of chiplet and SiP technologies in the era of AI computing power, and will showcase advanced process technologies and application solutions in the industry chain such as chiplet and heterogeneous system integration, HBM/storage packaging technology, IC substrate/glass substrate . The 9th China System-Level Packaging Conference SiP Conference China2025 and the 2025 Glass Substrate Industrialization Development Forum (2nd) will also be held at the same time.
elexcon2025 semiconductor exhibition
Display range
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Chiplet Ecosystem
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SiP System in Package
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EDA electronic design automation software and services
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3D IC Design Services
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HBM/Storage Packaging and Testing Process
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IC substrate and glass substrate
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Power packaging and ceramic substrates
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Semiconductor materials and process equipment
Target audience
Process manufacturing, R&D, procurement and senior management of terminal brands/EMS/OEM/ODM, OSAT/wafer fab, Fabless, MEMS sensors, power devices, optoelectronic components and other manufacturers.
The elexcon2025 Shenzhen International Electronics Exhibition, hosted by UBM Creative Exhibitions , will be held at Shenzhen Convention and Exhibition Center (Futian) from August 26 to 28, 2025. The theme is "AII for AI, AIl for GREEN: Providing all-round technical and supply chain support for AI and dual carbon goals". The exhibition will focus on displaying cutting-edge products, technologies and solutions such as AI and computing chips, storage, embedded and AIoT, power and energy electronics, and chiplet heterogeneous integration ecology, covering artificial intelligence, new energy vehicles, industrial automation, rail transportation, Internet of Things, military industry and other hot fields, and promoting technological innovation and industrial development. For more exhibition details, please visit www.elexcon.com.
For booth, sponsor and speaker applications, please contact: 0755-88311535
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