The 2nm era is coming: ASML releases third-generation EUV lithography machine
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This week, ASML delivered the third-generation extreme ultraviolet (EUV) lithography tool Twinscan NXE:3800E, which has a projection lens with a numerical aperture of 0.33. The system significantly improves performance compared to the existing Twinscan NXE:3600D machine. It is designed for manufacturing chips using leading-edge technologies, including 3nm, 2nm and small nodes in the next few years.
ASML Twinscan NXE:3800E represents a leap forward in performance (wafers processed per hour) and matching process coverage for low numerical aperture EUV lithography. The new system can process more than 195 wafers per hour at a dose of 30 mJ/cm^2, with throughput upgrades expected to further increase performance to 220 wph. In addition, the new tool provides matching machine coverage (wafer alignment accuracy) of less than 1.1 nm.
ASML revealed in a statement published on Delivering leading-edge productivity "We are pushing lithography technology to new limits. "
The increased throughput will improve the economics of the Twinscan NXE:3800E machine when producing chips using 4nm/5nm and 3nm class process technologies for logic manufacturers. The performance improvements of ASML Twinscan NXE:3800E are expected to significantly alleviate one of the main disadvantages of EUV technology, namely its relatively low performance, allowing for more efficient and cost-effective chip production. This will make EUV-reliant process technologies more accessible to chip designers whose budgets are not as large as those of Apple, AMD, Intel, Nvidia and Qualcomm. In addition, the tool is also critical for memory manufacturers such as Micron, Samsung and SK Hynix.
In addition, the enhanced performance of Twinscan NXE:3800E is particularly useful for manufacturing chips using 2nm and subsequent manufacturing technologies that require EUV dual patterning. Improvements in matching machine overlays will benefit sub-3nm production nodes.
(Image source: ASML)
However, the complexity and capabilities of machines like the NXE:3800E come at a high cost, priced at approximately $180 million each. Such high costs mean that the cost of these lithography tools will take time to depreciate. However, for ASML's customers, which include a select group of important logic and memory manufacturing companies, the NXE:3800E provides a path to enhance their cutting-edge chip production capabilities. This is critical for these companies as they strive to meet growing global demand for semiconductors, expand production capabilities and manage the economics of chip manufacturing. The introduction of more advanced, more efficient EUV scanners such as the NXE:3800E is critical to achieving these goals.
Looking to the future, ASML is not content with the status quo and plans further innovation in the form of the Twinscan NXE:4000F, another generation of low numerical aperture EUV scanner expected to be released around 2026. This continued development underscores ASML's commitment to advancing low numerical aperture-NA EUV manufacturing technology despite the impending adoption of high numerical aperture lithography tools.
Original link
https://www.tomshardware.com/tech-industry/manufacturing/asml-delivers-3rd-generation-euv-chipmaking-tool-for-2nm-and-beyond
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