The HV96001-E/NFA LED driver is an option for offline lighting applications requiring wide dimming capabilities. The device is capable of linear dimming and PWM dimming, with PWM dimming capable of flicker-free dimming down to 0.01% and lower. 8V to 60V Wide Input Voltage Range Flyback Converter Uses Timing Capacitor to Set Automatic Retry Delay Fault Recovery Output Short-Circuit Protection with Auto-Retry Delay
Secondary-Side, Micro-Interfaced, Flicker-Free LED Controller
with Enhanced PWM and Analog Dimming
Features
• Wide Input Voltage Range: 8V to 60V
• Linear (analog) Dimming:
- With wide range of amplitude control of the
LED current
• Pulse-Width Modulation (PWM) (digital) Dimming:
- Dims down to 0.01% and lower
- With PWM pulse width lower than 150 ns
- PWM dimming frequency up to 20 kHz
• Flyback Converter:
- With automatic output voltage adjustment for
maintaining high system efficiency
• Boost Converter:
- With near zero output voltage ripple for a
ripple-free LED current
- 100 Hz/120 Hz ripple rejection
- 200 kHz fixed switching frequency
- SEPIC topology compatible
• V
DD
Regulator:
- 60V input voltage/5V output voltage
- 10 mA drive for supplying external loads
• Fault Recovery with Auto-Retry Delay Set Using
Timing Capacitor
• Undervoltage Detection of:
- V
DD
voltage
- Supply voltage (Flyback output voltage)
• Overvoltage Detection of:
- LED load voltage (Boost output voltage)
• Overcurrent Detection of:
- Load switch current
• Stuck-at-Zero Detection of:
- DIM input signal
• Short Circuit Protection of Output with Auto-Retry
Delay
Description
The HV96001 LED driver targets offline lighting
applications requiring wide dimming capability. The
device is capable of linear dimming and PWM
dimming, with the PWM dimming capable of flicker-free
dimming down to 0.01% level and lower.
The HV96001 is specifically adapted to LED driver
designs that accommodate a wide range of the LED
load voltage. The device adjusts the output voltage of
the AC to DC conversion stage for maintaining a high
conversion efficiency over a wide range of the LED
load voltage. It also maintains a precise control over the
LED current amplitude, thereby maintaining the
consistent color temperature.
The adaptability of the device to wide range PWM
dimming allows for a stable control of the LED current
waveform for PWM dimming pulse widths down to
150 ns and lower.
The HV96001 driver IC adjusts the flyback converter
output voltage such that the boost converter (BC)
operates with a small difference between the boost
converter input and output voltage, also referred to as
the headroom voltage. Operating the boost converter
with a small headroom voltage, or, more or less
equivalent, operating with a small voltage step-up ratio
allows the boost converter to be physically small and
operate at a higher efficiency.
The HV96001 includes two feedback regulators, the
flyback regulator for control of the flyback output
voltage and the boost regulator for control of the LED
current amplitude. An optocoupler driver circuit drives
the optocoupler, which in turn provides a control signal
for driving the control input of the flyback converter.
DIM Signal 5V/div
Boost Switch Gate Voltage, BSG pin 5V/div
Applications
• Offline LED lighting applications featuring wide
range for PWM dimming and linear dimming.
Drain M
BST
50V/div
LED Current 1A/div
Packages
• 16L VQFN, 3 mm x 3 mm
• 16L SOIC, Narrow Body
10.0 us/div
Regular Operation, 20 kHz DIM 0.3% Duty.
2020 Microchip Technology Inc.
DS20006291B-page 1
HV96001
Package Types
Typical Applications Circuit
2020 Microchip Technology Inc.
DS20006291B-page 2
HV96001
Block Diagram
2020 Microchip Technology Inc.
DS20006291B-page 3
HV96001
1.0
1.1
ELECTRICAL CHARACTERISTICS
Electrical Specifications
Absolute Maximum Ratings
(†)
V
SUP
............................................................................................................................................................ -0.3V to +65V
V
DD
................................................................................................................................................................ -0.3V to +6V
All other pin voltages...........................................................................................................................-0.3V to V
DD
+0.3V
I
ZHVS
, maximum clamp current at HVS pin...............................................................................................................2 mA
Power Dissipation at +25°C (16L VQFN) ................................................................................................................0.24W
Power Dissipation at +25°C (16L SOIC) .................................................................................................................0.24W
Maximum Junction Temperature ........................................................................................................................... +150°C
Lead Soldering Temperature for 10s..................................................................................................................... +300°C
ESD voltage HBM (LV pin only) ..............................................................................................................................2000V
ESD voltage HBM (HV pin only) (SUP).....................................................................................................................750V
† Notice:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended peri-
ods may affect device reliability.
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
General conditions: T
A
= T
J
= 25°C, V
SUP
= 8V, C
VDD
= 1 µF, C
BSG
= 2 nF, C
LSG
= 500 pF, R
OPT
= 1 MΩ,
I
EXT
= 0 mA, V
DIM
= V
DD
= 5V, unless otherwise mentioned.
Boldface specifications
apply over the recommended ambient temperature (T
A
= T
J
) range of -40 °C to +125°C.
Parameters
Device Supply (SUP)
Supply Voltage Range
Supply Current, boost converter not switching
Supply Current, boost converter switching
V
DD
Supply (V
DD
)
V
DD
Voltage
V
DD
Undervoltage Lower Threshold
V
DD
Undervoltage Upper Threshold
Output Voltage Drop
External Current Draw Capacity
Supply Voltage Sense (SVS)
Supply Undervoltage Lower Threshold
Supply Undervoltage Upper Threshold
Boost Switch Gate Driver (BSG)
Sourcing Current
Sinking Current
Note 1:
2:
ISRC
BSG
ISNK
BSG
0.14
0.40
—
—
—
—
A
V
BSG
= 0V, V
BCS
= 0V
V
BSG
= 5V, V
BCS
= 2V
VL
SVUV
VU
SVUV
—
0.85
0.7
0.9
—
1
V
V
SUP
falling, (Note
1)
V
SUP
rising
V
DD
VL
VDUV
VU
VDUV
VD
VDD
I
EXT
4.85
5.075
5.30
4.2
—
—
—
4.4
4.6
—
—
4.6
—
20
10
mV
mA
V
V
SUP
= 8V, 60V
V
DD
falling
V
DD
rising, (Note
1)
I
EXT
= 10 mA
V
SUP
I
SUP1
I
SUP2
8
—
—
—
—
3.5
60
1.5
—
V
mA
V
SVS
= 1.1V, V
HVS
= 1.1V,
V
DIM
= 0V
V
SVS
= 1.1V, V
HVS
= 1.1V,
V
DIM
= 5V
Sym.
Min.
Typ.
Max. Units
Conditions
Specification is obtained by characterization and is not 100% production tested.
Specification is for design guidance only.
2020 Microchip Technology Inc.
DS20006291B-page 4
HV96001
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
General conditions: T
A
= T
J
= 25°C, V
SUP
= 8V, C
VDD
= 1 µF, C
BSG
= 2 nF, C
LSG
= 500 pF, R
OPT
= 1 MΩ,
I
EXT
= 0 mA, V
DIM
= V
DD
= 5V, unless otherwise mentioned.
Boldface specifications
apply over the recommended ambient temperature (T
A
= T
J
) range of -40 °C to +125°C.
Parameters
Boost Current Sense (BCS)
Switching Frequency
Maximum Switch Duty
Leading Edge Blanking Time
BCS to BSG Propagation Delay
Attenuation, Divider Input to Divider Output
Peak Current Threshold 1
Peak Current Threshold 2
Headroom Voltage Sense (HVS)
Clamping Voltage
Headroom Undervoltage Lower Threshold
Headroom Undervoltage Upper Threshold
Output Voltage Sense (OVS)
Bias Current
Output Overvoltage Upper Threshold
Output Overvoltage Lower Threshold
Load Switch Gate Driver (LSG)
Output Voltage Rise Time
Output Voltage Fall Time
Load Current Sense (LCS)
Load Overcurrent Threshold
Leading Edge Blanking Time
Boost Regulator Error Amplifier (BRO)
Voltage Gain
Transconductance
Input Offset Voltage
Sourcing Current
Sinking Current
90% Amplifier Rise Time upon DIM enable
Zero Switch Resistance
Flyback Regulator Error Amplifiers (FRO)
Voltage Gain, low gain
Transconductance, low gain
Sourcing Current, low gain
Sinking Current, low gain
Headroom Reference Voltage, low gain
Voltage Gain, high gain
Note 1:
2:
VG
FROL
G
FROL
ISRC
FROL
ISNK
FROL
VH
FROL
VG
FROH
—
160
40
40
0.95
—
65
200
90
60
1
65
—
270
—
—
1.05
—
V
dB
dB
µA/V
µA
V
FRO
= 0V, V
HVS
= 1.2V
V
FRO
= 5V, V
HVS
= 0.5V
VG
BRO
G
BRO
VOS
BRO
ISRC
BRO
ISNK
BRO
T
BRO
RZSW
—
0.8
-10
—
—
—
—
65
1
—
0.4
0.2
50
300
—
1.2
10
—
—
—
—
µs
Ω
dB
mA/V
mV
mA
V
BRO
= 0V, V
LCR
= 0.5V,
V
LCS
= 0V, (Note
1)
V
BRO
= 4V, V
LCR
= 0V,
V
LCS
= 0.5V, (Note
1)
V
LCS
= 0V, V
LCR
= 100 mV,
C
BRO
= 1 nF, (Note
1)
Note 1
VT
LCOC
BT
LCS
590
600
640
750
690
900
mV
ns
V
LCS
rising
DIM rising
TRISE
LSG
TFALL
LSG
—
—
—
—
100
100
ns
10% to 90%
90% to 10%
IOVS
VU
OVOV
VL
OVOV
—
0.97
—
0
1
0.5
—
1.03
—
µA
V
Note 1
V
OVS
rising
V
OVS
falling, (Note
1)
VZ
HVS
VL
HVUV
VU
HVUV
3.70
0.44
—
4.3
0.47
0.92
4.9
0.50
—
V
V
I
HVS
= 2 mA
V
HVS
falling
V
HVS
rising, (Note
1)
F
SW
D
MAX
BT
BCS
T
BPD
K
DIV
V
BCS1
V
BCS2
180
48
30
—
—
90
390
200
—
—
—
10
130
410
220
52
80
110
—
170
430
V/V
mV
mV
V
BRO
= 1.8V
V
BRO
= 4.8V
kHz
%
ns
V
BRO
= 4.8V,
V
BCS
50 mV overdrive
Sym.
Min.
Typ.
Max. Units
Conditions
Specification is obtained by characterization and is not 100% production tested.
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
EEWORLD
