When it comes to VeriSilicon, everyone knows that they are the "WuXi AppTec" of the chip industry. Relying on its leading technology and IP, VeriSilicon provides a variety of services to chip companies around the world. But in fact, in addition to this, VeriSilicon has another side in promoting domestic chips, that is, they held the 11th Songshan Lake China IC Innovation Summit.
Dr. Dai Weimin, Founder, Chairman and President of VeriSilicon
According to Dr. Dai Weimin, founder, chairman and president of VeriSilicon, in the past ten conferences, the summit has introduced 8 to 10 domestic chips every year, 90% of which have been put into mass production. He further pointed out that in the past ten years, the summit has introduced a total of 56 companies, 11 of which went public within a period of time after attending the summit. It can be seen that, to some extent, this summit is a "weather vane".
At this year's conference, they brought ten more chip recommendations. Let's take a look.
Jingwei Qili
HME-P1P60
:
60K
mid-range high-performance domestic
FPGA
In recent years, due to the acquisitions of Altera and Xilinx by Intel and AMD, and the popularity of artificial intelligence, people's attention to FPGA has increased sharply. In particular, the strength of domestic manufacturers in this field has attracted much attention. As one of the important participants in domestic FPGA, Dr. Wang Haili, founder and CEO of Jingwei Qili, has his own unique insights on this.
Dr. Wang Haili, Founder and CEO of Jingwei Qili
He pointed out that to build independent and controllable domestic FPGA core devices, we must focus on four major factors, namely architecture design technology, IC development technology, EDA development technology and IP development technology. Thanks to the company's team's years of hard work in this industry, Jingwei Qili has deep accumulation in many aspects. This also supports them to develop multiple series of products. The 60K mid-range high-performance FPGA HME-P1P60 brought this time is the first product in Jingwei Qili's "Pegasus" series.
According to Wang Haili, this is an FPGA that matches Xilinx 7 series, manufactured using 40nm process, with 6-input lookup table structure, logic capacity of about 60K, support for DDR2/3 memory (speed up to 1333Mbps), IGN supports 6.5G Serdes, PCIeGen2, on-chip ADC, Cortex-M1 soft core, performance of more than 100M. It can be used in industrial control, image acquisition, video transmission and other related fields.
Wang Haili further pointed out that the company has planned a number of chips in the mid-to-high-end Pegasus series, which are expected to be launched in the next three years. From the roadmap he provided, we can see that Jingwei Qili has also planned 7nm FPGA, striving to create higher-end products. He said that in order to help better realize the complete FPGA design, the company began to develop software tools and EDA capabilities in 2015. This also helped the company to obtain rich returns.
As shown in the figure below, Jingwei Qili has achieved leapfrog development in performance in the past four years, especially in 2020, when the company's revenue jumped from 20 million in 2019 to 101 million in 2020, a year-on-year increase of 405%. Wang Haili predicts that the company's revenue this year is expected to reach between 150 million and 200 million, achieving further leaps.
Wang Haili said that the company has now built a sufficiently solid foundation. In the next two years, Jingwei Qili expects that the successful promotion of the company's mid-to-high-end products will become a booster for the company's future business to continue to grow steadily, and the company will then become one of the world's mainstream FPGA suppliers.
Pengkan
VN1110/VN1810
: A new generation of
PonCAN
industrial control network chips
Founded by Li Chunchao, former CTO of Marvell and former CEO of Lingsheng, Pengkan Technology is a company dedicated to the design and development of innovative high-speed industrial control LAN technologies, providing a new generation of data transmission technology and complete semiconductor solutions for industrial control networks for robots, electric vehicles, and Industry 4.0.
Li Chunchao, founder and CEO of Pengkan Technology
"The company's mission is to provide highly secure, scalable and reliable end-to-end industrial connectivity solutions to meet the endless demand for AI processors and advanced sensors," Li Chunchao emphasized. The new generation of PonCAN industrial control network chips VN1110/VN1810 brought to this Songshan Lake Forum is their answer.
Li Chunchao pointed out that with the rise of applications such as AI, autonomous driving and intelligent manufacturing, more and more data need to be transmitted in the system. How to transmit this data safely, reliably and with low latency has become the focus of attention in the industry. Pengkan Technology’s first new industrial control network based on optical transmission technology - PonCAN (Passive Optical Control LAN) is designed to achieve this goal.
According to reports, PonCAN is a new generation of bus architecture that integrates high-speed data transmission, ultra-low latency and high-reliability control functions. The PonCAN network is highly secure and easy to wire and synchronize across the entire network. Pengkan Technology's first-generation product VS1101/VS1801 can provide high-performance PonCAN networks while supporting high-precision industrial control and edge computing.
"Relying on the company's product advantages, we regard control bus and industrial Ethernet as the two major target replacement markets for PonCAN," said Li Chunchao. He further pointed out that relying on these products and technologies, the company hopes to provide customers with diversified services, which will also become the business model of Pengkan Technology.
Aixin Technology
AX630A
: High-performance, low-power AI vision processor chip
Looking at the global chip industry, if you want to find a hot product in recent years, it must be artificial intelligence chips. Due to the development of technology, the advancement of algorithms, and the popularization of applications, artificial intelligence has been expanding around the world at a lightning speed in the past few years. Aixin Technology, founded in May 2019, is one of the participants.
Qiu Xiaoxin, founder and CEO of Aixin Technology
Dr. Qiu Xiaoxin, founder and CEO of Aixin Technology, pointed out that in the past few decades of development, artificial intelligence has gradually moved from the cloud to the edge. The development of applications has also greatly increased the market demand for edge AI chips. Aixin Technology's goal is to create an edge AI chip with extreme computing power under the condition that cost and power consumption are completely controllable. AX630A is a product they launched with this purpose.
According to Dr. Qiu, the chip was launched in August 2019, and the company successfully taped out the chip in just nine months. By the end of 2020, it was in mass production, which shows the company's technical strength and understanding of the product. "This chip is also based on the company's team's understanding and in-depth integration of ISP, storage, algorithms and VPU," Dr. Qiu Xiaoxin emphasized.
She pointed out that AX630A is a high-performance, low-power AI visual processor chip, built using TSMC's 12nm process, with a power consumption of only about 3W, a computing power of 57.6TOPS@800MHz 2w4f, and an equivalent computing power of 28.8TOPS@800MHz INT4. Relying on the self-developed neural network processor for inference acceleration, it can improve image quality through neural networks and support a variety of AI visual tasks such as object detection and face recognition. It can be widely used in smart cities, smart retail, smart communities, smart homes, and IoT devices.
As shown in the figure above, in the comparison of different network operating speeds under public data sets, the AX630A processes 3116 and 1356 frames per second respectively, far exceeding other similar chip products.
"Based on the vertical integration of algorithms, chips, and products, Aixin Technology provides partners with full-stack solutions to help customers quickly implement the latest technologies. At the same time, Aixin has developed a comprehensive product roadmap that covers the high, medium, and low-end markets to meet customers' product needs in different scenarios." Qiu Xiaoxin finally said.
AT5055
:
RISC-V-
based
smart vision chip
In addition to AI, RISC-V is also a very popular technology in recent years. According to Calista Redmond, CEO of the RISC-V Foundation, at the RISC-V Summit held at the end of last year, throughout 2020, the RISC-V technology community has grown to more than 50 technology and special interest groups, with more than 2,300 developers, a year-on-year increase of 66%.
Mark Himelstein, the foundation's chief technology officer, said in an interview earlier this year that RISC-V is extending from the Internet of Things to more application areas. As a silver member of the RISC-V Global Foundation, Time-Power Technology, founded in May 2018, is building an influential edge-side smart vision chip based on the RISC-V architecture.
Yu Xin, President of TimeQing Technology
According to Yu Xin, president of TimeScrane Technology, as shown in the figure below, the company has created a number of RISC-V processor IPs for different directions. The AT5055 introduced at this year's Songshan Lake Summit is equipped with the company's self-developed RV32IMCF architecture TM800 main control processor and TIMESFORMER intelligent processor.
Yu Xin pointed out that the RISC-V processor equipped with AT5055 is compatible with the tensorflow/pytorch framework and supports CV image processing and speech acoustic pre-processing. AT5055 has an ISP processing capability of 5M@30FPS, supports 3A/3DNR/WDR/LDC and other functions, and can also provide up to 2K@60FPS video encoding and decoding capabilities.
At the same time, this chip can also provide powerful DSP processing capabilities, enabling it to support the complete video channel of binocular vision, including high-performance ISP, H.265 video codec and 1080P display solutions. It can also support 4+2 microphone arrays, and has built-in multi-microphone noise reduction and local voice recognition algorithms.
Yu Xin further pointed out at the meeting that AT5055 provides a rich set of peripheral interfaces and a complete system security solution. Through the vertical integration of core processor IP, SOC architecture, algorithms and other core technologies, it has been deeply optimized for application scenarios such as face detection/recognition, social TV, and smart IPC, and can enable the above-mentioned end-side smart applications with the industry's top energy efficiency and cost-effectiveness.
Yu Xin concluded that AT5055 has the advantages of powerful AI computing efficiency, better user programming experience, high-quality image processing capabilities, flexible and rich multimedia interfaces, and extremely low power consumption design. This makes it more superior in terms of cost performance, energy efficiency, and application applicability in applications such as access control, attendance, cameras, social TV, license plate recognition, and smart home appliances.
Shencong TH2608
: Low-power artificial intelligence human-computer voice interaction chip
After buttons and touch screens, many people regard voice control as the next key technology for human-computer interaction. Because of the huge market capacity, many manufacturers have joined the field, including Shanghai Shencong Semiconductor, which was jointly established by voice algorithm giant AISpeech and well-known institutions such as SMIC.
Wu Gengyuan, Co-founder and CEO of Shencong
Wu Gengyuan, co-founder and CEO of Shencong, said that Shencong Intelligence relies on the intelligent voice technology and resource empowerment of the AIS Group and focuses on creating an integrated "algorithm + chip" solution. The company's first-generation chip TH1520 has completed mass production and shipment, and has been implemented in three major scenarios in the fields of smart home white appliances, black appliances and smart cars. The company also has three core customers: Midea Group, Hisense Group and DDPAI (whose end users are the No. 1 smart terminal brand in China).
At this year's Songshan Lake conference, they brought a new generation of chips - Shencong TH2608. According to reports, Shencong Intelligent's second-generation chip TH2608 has undergone a greater upgrade based on the first-generation chip TH1520:
First of all, the transition from TH1520 as a coprocessor to TH2608 as a main control chip has been realized. With a built-in Cortex-M ARM v8 instruction set-based main control CPU, rich internal SRAM and external XIP Flash resources, as well as abundant and diverse peripheral interface resources, TH2608 can provide customers with main control processor solutions for a variety of application scenarios.
Secondly, the highly flexible and configurable neural network processing unit (NPU) improves energy efficiency by a hundred times. By deploying various general networks such as DNN/TDNN/FSMN/CNN, it fully supports data formats such as INT8/4/1, and uses specially optimized network customization models to achieve high-efficiency and low-energy complex network combination and scheduling.
Third, it provides single-chip system integration solutions with a variety of flexible SIP multi-chip packaging forms. It supports the co-sealing of different types of PSRAM and Flash, and can integrate wireless communication modules such as WIFI and Bluetooth. At the same time, with the help of the embedded power management module (PMU), it has achieved strong support for the most streamlined BOM solution for customers.
Based on this design, Shencong Taihang second-generation chip TH2608 continues to provide solutions with comprehensive functional and performance upgrades for whole-house smart home scenarios (linked control of whole-house devices), smart driving scenarios (vehicle equipment control), and smart office scenarios (far-field/near-field high-fidelity calls for conferences).
When talking about the future development history, Wu Qingyuan pointed out that the company has planned a chip that integrates AI, multi-modality and main control. The company also hopes to move from auxiliary chips to main control chips, and then integrate multi-modality, brain-like and storage chips, so that chips can better empower everything.
Beijing Zhicun
WTM2101
: Ultra-low power storage and computing integrated chip for wearable devices
Li Xiang, vice president of Beijing Zhicun, said at the Songshan Lake Forum that with the development of technology, the "storage wall" problem faced by traditional AI chips is becoming more and more serious, which is mainly caused by the inherent deficiencies of the von Neumann architecture.
Li Xiang, Vice President of Beijing Zhicun
Data shows that over the past years, computer architecture has been developing in accordance with the von Neumann architecture. In this architecture, the most obvious feature is that its computing and storage are discrete and evolve independently. In the past, the development speed of processors has always been ahead of memory, which has infinitely magnified the accumulated memory shortcomings. According to Li Xiang at the meeting, the storage wall problem is mainly reflected in the two aspects of slow data transfer and high power consumption.
To this end, Zhicun promotes the development of storage and computing integrated chips, striving to help customers solve this problem.
From Li Xiang's introduction, we learned that Beijing Zhicun Technology Co., Ltd. is an internationally leading integrated storage and computing chip company, established on October 23, 2017. The company team has 80 people and has been developing integrated storage and computing chips for 6 years. The founding team completed the world's first analog integrated storage and computing deep learning chip in 2016.
He further pointed out that Zhicun's storage-computing integrated technology innovation uses Flash memory to complete the storage and operation of neural networks, solving the AI storage wall problem, improving computing efficiency and reducing costs. Currently, Zhicun has launched the world's first storage-computing integrated accelerator WTM1001 and the first storage-computing integrated SoC chip WTM2101.
As shown in the figure below, this chip has achieved good performance in terms of package size, computing power, power consumption and efficiency, which enables it to provide strong support for applications such as wearable devices and smart terminal devices that have rigid requirements for low power consumption.
CorePu
XP5127
:
5G n77 1T2R
RF front-end power amplifier chip
The arrival of 5G not only makes Qualcomm, MediaTek and other mobile phone chip manufacturers earn a lot of money. At the same time, related RF suppliers can benefit a lot from it. This is mainly because 5G brings more frequency bands, higher bandwidth, and also needs to be compatible with the previous 4G, 3G and 2G. For this reason, this brings opportunities to the corresponding RF suppliers. Domestic RF industry practitioners have also seen this opportunity and are waiting for the opportunity to rush in. Xinpu Technology is one of the representatives.
Gu Jianzhong, Founder and COO of Xinpu Technology
Gu Jianzhong, COO of Xinpu Technology, said at the meeting that the arrival of 5G not only brings more frequency bands (such as n77), but also requires simultaneous connection to previous networks, which puts higher requirements on the corresponding radio frequency. As a team with rich experience in the radio frequency industry, Xinpu Technology's 5G n77 radio frequency solution has also been continuously upgraded from the first generation to the second generation.
In the first-generation 5G n77 solution, Xinpu Technology equipped it with 2G TxM, 3/4G MMMB PA, 5G MMMB PA, 5G n77 PA and 5G LFEM, supplying and demanding 7 RF modules to realize all RF functions of the main 2/3/4/5G.
Based on the first generation, Xinpu Technology launched the second generation solution XP5127. According to the introduction, the company has realized the most streamlined design, reduced product materials, integrated one transmission and two reception channels, and at the same time, the two n77 receiving channels achieve high isolation to ensure MIMO receiving performance.
Gu Jianzhong said that compared with the first-generation 5G n77 solution, the second-generation 5G n77 solution can achieve the functions required by the original 7 modules with only 4 RF modules, which can greatly reduce the RF materials and design space. He further pointed out that the 5G RF front-end power amplifier chip that debuted at this summit supports HPUE PC2 in all frequency bands and integrates GaAs PA, RF SOI LNA Switch and filter chips with various processes in a volume of 3mm*5mm, providing a fully differential RF solution.
"Compared with single-ended solutions, the heat dissipation performance is better and the performance has been greatly improved. Under various 5G modulation waveforms MPR0/1/3/6.5, the linearity and current indicators are ahead of the first-tier European and American manufacturers." Gu Jianzhong emphasized.
Huajing
ML-2670-3525-DB1
: High signal-to-noise ratio
MEMS
microphone
Founded in 2010, Huajing Sensing Technology Co., Ltd. is another important participant in this year's Songshan Lake Summit. The high signal-to-noise ratio MEMS microphone ML-2670-3525-DB1 is their leading product.
Miao Jianmin, Chairman of Huajing
According to the company's chairman Miao Jianmin, for accurate speech recognition and efficient active noise reduction systems, high signal-to-noise ratio MEMS microphones can provide high-quality sound signal input for the entire system. They can not only provide higher-quality sound signals for noise cancellation algorithms, but also greatly reduce environmental and background noise, making it easier for the system to find recognizable content features. When picking up sound at a long distance, using a microphone with a high signal-to-noise ratio can double the capture distance without reducing signal quality. This is exactly the advantage of their ML-2670-3525-DB1.
The reason why it can create such a competitive product is mainly due to the company's possession of core silicon microphone chip technologies such as backplane and diaphragm.
First, let's look at the back plate. Miao Jianmin said at the meeting that many silicon microphones currently use acoustic holes of the same size on the back plate, which will reduce their ability to resist blowing and falling, and it is difficult to pass the 0.8MPa strong blowing test. At the same time, uniform hole diameter and hole spacing are not conducive to reducing acoustic noise and it is difficult to improve the signal-to-noise ratio of the microphone.
"The acoustic holes in the back plate of the Huajing Silicon microphone have a large aperture and a small hole pitch in the middle, and a small aperture and a large hole pitch at the edge. The principle is that the maximum stress on the back plate is at the edge when it is under pressure. The small aperture and large hole pitch at the edge are conducive to bearing the high stress of the back plate at the edge, thereby improving the pressure resistance; at the same time, although the pressure in the center is small, the vibration amplitude of the diaphragm is large, so the acoustic pressure is large. The large aperture and small hole pitch in the middle are conducive to the timely release of air molecules to reduce acoustic noise and improve the signal-to-noise ratio of the microphone." Miao Jianmin continued.
Let's look at the diaphragm. From Miao Jianmin's introduction, we know that the diaphragm of many silicon microphones is generally a simple flat plate. This results in the diaphragm being unable to be released during the manufacturing process, greatly affecting the consistency and yield of silicon microphones. This also makes their resistance to blowing and falling poor, and it is generally difficult to pass the 0.8MPa strong blowing test.
However, Huajing's silicon microphone diaphragm design adopts corrugated and fan-blade microstructures. The corrugated microstructure on the edge of the diaphragm can reduce the stress of the diaphragm process, thereby improving sensitivity, consistency and yield. The same eight fan blades automatically open to release airflow, thereby avoiding damage and breakage of the diaphragm.
In addition to good design, Huajing has also established an advanced sensor production line. The company also has hundreds of square meters of Class 100 and Class 1000 clean rooms, which are used for MEMS sensor chip testing and sensor finished product testing respectively. The above hardware level helps them create a leading solution.
"Our silicon microphone products have excellent performance and have been supplied to several well-known domestic companies," said Miao Jianmin.
From the company's information, we learned that in addition to the silicon microphone series (Huajing Technology brand), the company also provides a pressure sensor series (Huajing Sensing brand). The pressure sensor series products include chips and modules, as well as various automotive pressure sensor components, among which automotive sensor component products have entered well-known domestic electric vehicle brands.
In addition, the company will also invest in the research and development of 5G SBAW.
除了华景的高信噪比MEMS麦克风,本届推荐会还带来了另一款MEMS传感器,那就是来自苏州明皜传感科技有限公司的超低功耗三轴加速度传感器——明皜da7xx系列。
苏州明皜传感科技有限公司CEO汪达炜
据该公司CEO汪达炜介绍,成立于2011年的苏州明皜传感科技有限公司是国内MEMS传感器技术的创新者和开拓者。由海内外知名管理和技术团队与苏州固锝电子股份有限公司共同投资创建。明皜传感主要从事MEMS传感器的研发、设计和生产,并提供相关技术服务。主要产品有:加速度传感器、陀螺仪、压力传感器和磁传感器,旨在为消费电子、汽车电子、工业自动化以及航空等领域提供所需的产品和集成方案。
本次推出的超低功耗三轴加速度传感器明皜da7xx系列则是公司的已推出的产品之一。
According to reports, the da7xx series sensors are ultra-low power, high-performance capacitive three-axis linear accelerometers developed through micromachining technology. They have a 2x2x0.98mm land grid array (LGA) and are guaranteed to operate in an extended temperature range of -40°C to +85°C.
Wang Dawei said that the sensor element is made of single crystal silicon using the DRIE process and is protected from environmental influences by a sealed silicon cap; the device also has a user-selectable full-scale range of ±2g/±4g/±8g/±16g measurement range, a data output rate from 1Hz to 1600Hz, and has signal conditioning, temperature compensation, motion detection, step counter and step detection, and embedded significant motion detection.
He further pointed out that this series of products has an integrated 32-level first-in-first-out (FIFO) buffer that allows users to store data to limit the intervention of the host processor. The two independent and flexible interrupts it provides greatly simplify the algorithms used for various motion state detection. Standard I2C and SPI interfaces are used to communicate with the chip.
“依赖于这样的设计,明皜传感科技能够为VAD语音唤醒辅助功能,精准发声定位,通话降噪辅助和骨声纹识别辅助等应用提供支持”,汪达炜说。
In the process of introducing this series of new products, Wang Dawei also talked about his insights on MEMS sensor products. He pointed out that the MEMS industry must say goodbye to "hard work" and "low prices" and realize its own dreams. To achieve this, the key lies in the ability of technological innovation and industrial chain integration, the execution of large-scale production and the change of business model, not just relying on selling "chips".
AirSmart
AT58MP1T1RS32A
: The world's first
5.8GHz
microwave radar sensor
SoC
that can detect breathing
At this year's Songshan Lake Forum, Gekong Intelligence also brought a sensor chip - the world's first 5.8GHz microwave radar sensor SoC AT58MP1T1RS32A that can detect breathing.
Zhang Zhenwei, Vice President of Sales of Gekong Intelligent
Zhang Zhenwei, vice president of sales at Gekong Intelligent, said that as the world's first 5.8GHz microwave radar sensor SoC chip that can detect breathing, AT58MP1T1RS32A (AT5820 for short) integrates a high-performance radar transceiver and a 32-bit MCU on a single chip. It has rich resources and powerful performance. It can be interconnected with the main control or transmission chip, and can also be used as a main control MCU.
Thanks to the chip's superb radar sensing performance and professional signal processing capabilities, the AT5820 can detect human motion while detecting micro-movements and even breathing signals, thus achieving true human presence sensing. According to Zhang Zhenwei, the AT58MP1T1RS32A chip has many features, including:
1. Fully silicon integrated sensor + 32-bit MCU, a true SoC, breaking the traditional sensor needs an external MCU to realize the sensor function;
2. It can realize mixed real-time monitoring of motion detection, micro-motion detection, and breathing detection to achieve true presence perception;
3. High anti-interference technology to solve interference from fans, air conditioners, etc.;
4. Highly integrated, small size, good consistency;
5. Developed based on 5.8GHz, compared with 24GHz and 77GHz chips;
Zhang Zhenwei further pointed out that this chip can be adapted to scenarios such as smart hotels, smart offices, smart homes, smart security, and health care that require detection of the presence of the human body; and solve the pain point that human motion detection sensors cannot effectively detect static human bodies.
As a world-leading expert in smart sensor chips, Space (Shanghai) Intelligent Technology Co., Ltd. focuses on businesses including high-performance wireless RF, microwave millimeter wave technology, touch interaction technology, ultra-low power MCU technology and ultra-wideband technology. It defines and develops world-leading "Me First" chip products and provides a full set of cost-effective chip, algorithm, software and module solutions.
According to reports, the 5.8GHz, 10.525GHz, 24GHz, 60GHz, and 77GHz series radar sensor chips, UWB positioning chips, and low-power touch and pressure sensors they developed have been widely used in the fields of intelligent Internet of Things (AIoT), smart lighting, smart home appliances, smart homes, and smart city management. In the future, the company will launch the high-precision, cost-effective 77G millimeter-wave radar chip AT77HP3T4R to provide customers with more empowerment.
Wei Shaojun, chairman of the IC Design Branch of the China Semiconductor Industry Association, said at the summit forum that the Songshan Lake Forum has three outstanding features: distinctive, down-to-earth, and close to the market. Especially close to the market, which is very important, because only demand is the driving force for product development.
So what kind of "miracle" will these ten chips create this year? Let's wait and see.
*Disclaimer: This article is originally written by the author. The content of the article is the author's personal opinion. Semiconductor Industry Observer reprints it only to convey a different point of view. It does not mean that Semiconductor Industry Observer agrees or supports this point of view. If you have any objections, please contact Semiconductor Industry Observer.
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