Last year, the automotive industry was the biggest hot spot in the semiconductor industry. On the one hand, the consumption and industrial situation was poor, and the automotive industry still had room for growth. On the other hand, trends such as smart driving upgrades, automotive computing power upgrades, and electrification architecture upgrades led automotive semiconductor technology. change.
Therefore, many people are very concerned about the performance of automotive semiconductor manufacturers.
Recently, TechInsights released a report disclosing the revenue of the top 10 automotive semiconductor suppliers last year. The results showed that Infineon ranked first and Qualcomm ranked tenth.
Fu Bin|Author
Electronic Engineering World (ID: EEW
orldbbs)|Produced
TOP5 capture 50% of the market share
TechInsights report shows that the total revenue of the global automotive semiconductor market in 2023 will be approximately US$69.2 billion, an increase of 16.5% from US$59.4 billion in 2022.
The TOP5 suppliers are Infineon, NXP, ST, Texas Instruments, and Renasas, accounting for more than 50% of the market share in total. Sixth to tenth are ONsemi, Bosch, Analog Devices, Micron, and Qualcomm.
TechInsights did not list the revenue and proportion of the Top 10 suppliers in detail. Specifically, Infineon's market share is 14%, the combined share of STMicroelectronics, NXP, Texas Instruments, and Renesas is 36%, and the others are 49%.
TechInsights pointed out that Infineon's market share increased by 4 percentage points. Infineon's market share increased in all regions in 2023 and continued to maintain leadership in the Chinese and Korean markets. In addition, Infineon's market share in Japan's automotive semiconductor market has also grown significantly; its market share in Europe ranks second; and its market share in North America ranks among the top three.
Renesas failed to regain the top three positions after falling from third to fifth place in 2022 due to the weakening trend of the yen; STMicroelectronics relies on its market position as a leading power electronics supplier and its understanding of the digitalization trend in the automotive industry. support and continue to maintain strong growth.
How TOP10 lays out automotive semiconductors
At present, TechInsights has not disclosed the specific proportion of devices. However, previous reports show that electrification and ADAS are expected to account for 50% of automotive semiconductor demand by 2028, translating into growing demand for power semiconductors and advanced processor chips.
However, in terms of proportion, MCU, MPU/DSP/SoC and power supply account for half of the entire semiconductor market. So, how do these companies support half of the country?
Infineon: MCU sales surge
Infineon's automotive MCU sales will increase by nearly 44% in 2023 compared with the previous year, accounting for approximately 29% of the global market. The strong sales momentum of automotive MCUs is the main factor driving Infineon's performance growth and helped the company become the world's number one in this market for the first time.
Infineon's AURIX™ MCU series and TRAVEO™ MCU series have promoted the transformation of the automotive industry towards autonomous driving, connected and electric vehicles, and are important contributors to helping the company lead the global automotive MCU market. These two series combine power consumption and performance improvements with the latest trends in virtualization, AI modeling, functional safety, network security and network functions to lay the foundation for new E/E architecture and the next generation of software-defined cars. It is worth mentioning that BYD uses Infineon's MCU and low-voltage power products under the Zonal architecture.
However, Infineon's business does not stop there. Taking new cars from Chinese car companies as an example, it covers more than 40 different applications, including: advanced driver assistance systems (ADAS), inverters, battery management systems (BMS), standard safety and comfort systems, etc. System solutions (P2S) utilize comprehensive solutions that combine the advantages of Infineon products, such as motor control MCU + driver + MOSFETs; signal preprocessing + radar MCU. According to its calculations, Infineon's value in each car exceeds 800 euros.
Recently, Infineon has made many big moves, signing a memorandum of understanding (MoU) with Honda, and reaching cooperation in wide bandgap semiconductors with Wolfspeed, SK Siltron CSS, Resonac Corporation, Shenghong Electric, Omron, etc.
NXP: Focus on software construction
Currently, NXP’s strategy is more focused on solving problems systemically. Nowadays, many computing systems are decentralized. In order to realize software-defined cars, the current architecture is mostly divided into three layers: the top layer is the vehicle's calculator, the middle layer is the local intelligent information system, and the bottom layer is It is a key terminal node, and computing systems in different regions are interconnected. NXP hopes to have appropriate system-level computing solutions to provide computing support for these three levels of requirements, that is, consider how different computing systems are integrated in the vehicle, including the performance, power consumption, and network capabilities of the entire system.
The NXP S32 series is an integrated platform covering software and hardware. NXP launched this platform 7 years ago and has continuously improved it, from high-end 5nm products to 90nm integrated solutions.
NXP attaches great importance to the construction of software. Currently, the number of software engineers in NXP has exceeded that of hardware developers, which also shows the importance NXP attaches to software. The company is integrating more software on the chip basis and will focus on the automotive electronics revolution led by 5nm processing technology in the future.
NXP is gradually evolving into MPU (microprocessor), regional controller and vehicle-mounted processor, and maintains a highly consistent product architecture, forming a complete system with peripheral devices to support customer customized development and optimize system performance and cost.
Italian law: betting on PCM+FD-SOI
STMicroelectronics' focus in the automotive field is to improve vehicle safety performance, enhance environmental performance, and deepen interconnection technology, while continuously optimizing vehicle functions and reducing overall vehicle operating costs. In the two frontier areas of automotive electrification and digitalization, STMicroelectronics has launched a series of industry-leading product portfolios in the past few years targeting emerging automotive architectures and technology standards, which has effectively promoted the steady growth of the company's overall revenue.
Looking forward, STMicroelectronics expects to continue to expand its core businesses, especially its automotive business, which will be an important driver in achieving its revenue target of more than US$20 billion from 2025 to 2027.
STMicroelectronics pays close attention to the intelligent development of automobiles. By investing in FD-SOI technology that integrates embedded PCM non-volatile memory (phase change memory), STMicroelectronics is actively supporting the move towards the era of software-defined vehicles. Today, FD-SOI and ePCM technologies have become the core manufacturing technologies of STMicroelectronics’ Stellar platform. This unified MCU platform not only meets the needs of automobiles for cloud connectivity and software-defined cars, but also meets their urgent requirements for real-time computing capabilities, thus leading the automotive industry towards a smarter future.
Last month, STMicroelectronics announced that the new STM32 will use an 18nm FD-SOI process embedded phase change memory (ePCM) and will begin shipping samples to some customers in the second half of 2024. This means that ST is the first to break through the 20nm barrier for MCUs.
Texas Instruments: The advantage lies in precision and real-time performance
Texas Instruments divides automobiles into four parts: infotainment systems and instrument clusters, hybrid, electric and powertrain systems, body electronics and lighting, and advanced driver assistance systems (ADAS). It also has a total of 2,688 automotive products, of which the most What deserves attention is Texas Instruments Jacinto™ new generation J7 processor TDA4VM processor, Sitara™ newly released AM62A processor, and 4D millimeter wave radar AWR2944.
Texas Instruments' core advantages are accuracy and real-time performance, and its product performance has been verified by customers. Customers will naturally choose Texas Instruments products based on real experience. For example, C2000™️ is already the third generation product of Texas Instruments, the fourth generation is under development, and even the fifth generation is also being planned. This means that Texas Instruments' costs will be lower, its competitiveness will be stronger, its customer needs will be more in-depth, and some special features will be added, such as some analog functions.
Recently, Texas Instruments has also been actively embracing the new trend of Zonal architecture. The "Regional Architecture" sub-page has been added to the automotive application on its official website.
Renesas: R-Car’s Ecosystem
Renesas has launched a series of scalable processors for E/E architecture innovation, including the highly integrated RH850 MCU for the control domain, and the high-performance R-Car SoC, which can support gateways, autonomous driving, cockpit domains, etc. product. For node executors, there are 16-bit MCUs such as RL78. Among them, RH850 and RL78 are Renesas' own cores, and R-Car is an Arm core product. This rich core combination and rich product line combination can allow Renesas to better meet the comprehensive needs of OEMs.
Another change made by Renesas is to strongly promote left-shift software development. By providing a virtual platform, OEMs and Tier 1 can develop software and run it virtually on the hardware. This virtual development process enables customers to focus on system-level requirements without the need for verification on hardware. Additionally, by leveraging virtual platforms, customers can begin software development before silicon is available, which will shorten time to market.
Whether it is ADAS or cockpit, different operating systems, different algorithms, and different hardware systems are required. For such complex applications, Renesas has joined forces with many R-Car partners to serve customers together to accelerate product realization. Renesas' R-Car ecosystem is an extremely large system, but only a huge system can support complex applications. For example, Renesas' automotive computer platform VC4 is composed of more than 1,000 semiconductor parts and discrete components. In addition to Renesas' R-Car and part of the signal chain and power management, it also includes software and hardware support from many partners.
ON Semiconductor: Betting on Silicon Carbide
For ON Semiconductor, automotive and industrial are the most important large-volume markets. ON Semiconductor's financial report for the third quarter of fiscal year 2023 shows that the automotive business revenue hit a record, reaching $1.2 billion, a year-on-year increase of 33%; the industrial business revenue hit a record, reaching $616 million, a slight year-on-year increase. This shows that ON Semiconductor attaches great importance to the two major markets of automobile and industry.
ON Semiconductor provides tens of thousands of devices for electric vehicles. From the number of uses, we can intuitively feel: the content of electronic components provided by ON Semiconductor in each fuel vehicle is 50 to 100 US dollars, while in electric vehicles , each electric vehicle has more than $2,000 worth of content.
The solutions provided by ON Semiconductor are not one-size-fits-all. Taking automobile electrification as an example, they are divided into levels, including entry-level, mid-range, high-performance and ultra-high-performance platform levels. No matter what level the user chooses, ON Semiconductor can provide the most optimal solutions based on silicon carbide or silicon, allowing end users to expand production of electric vehicles and drive the continuous growth of electric vehicles.
Of course, it is actually silicon carbide (SiC) that is mainly detonating the market. In the future, Ansem will gradually switch to 200mm silicon carbide substrates to meet the future wave of the electric vehicle market.
Analog Devices: Audio and video transmission performance is outstanding
Industrial and automotive are still ADI's two most important markets. Currently, ADI performs well in the field of automotive audio and video data transmission. For example, the A2B automotive audio bus has entered more than 90% of the world's car manufacturers; vehicles deploying GMSL gigabit multimedia serial links have traveled more than 20 trillion kilometers.
ADI's Gigabit Multimedia Serial Link GMSL technology can double the link data transmission rate from 6 Gbps to 12 Gbps after corresponding iterations. When the transmission rate meets the requirements, it can integrate Ethernet and sensor technologies to form an edge intelligent.
In addition, in order to facilitate the transformation of automobiles to Zonal-based E/E architecture, the ADI E2B bus uses the new automotive Ethernet 10BASE-T1S technology to support a variety of sensor/actuator interfaces to implement Ethernet to edge device connections, such as to simplify low-cost Implementing headlight and taillight lighting systems, interior ambient lighting, keyless entry, wiper/window systems, etc., while having excellent EMI/EMC performance, which will help the transition to a Zonal-based architecture, significantly saving cable costs, and significantly Reduce the number of ECUs and enable deployment of new features and enhancements through over-the-air updates.
BMS and automotive power supply are another production line that ADI focuses on. In addition, ADI is also making products similar to silicon carbide drives to cope with the current SiC trend demand.
The same goal:
E/E architecture, software shift left, SiC
To sum up, although the focus of each company is different, the strategy is basically the same. The first is to lay out the third-generation E/E architecture Zonal; the second is to focus on software-defined cars and promote software left-shift development; the third is to continuously lay out carbonization Silicon (SiC).
Nowadays, the electric vehicle industry has entered the era of great integration, and the integration and development trend of all links in the industrial chain has become increasingly obvious. Against this background, we can see more and more cross-field international cooperation. Chip manufacturers have also begun to gradually adapt to the changes of the times, paying more and more attention to system development and increasing investment in software.
In the next year, the automotive field will remain hot, and the semiconductor industry will surely undergo earth-shaking changes.
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https://news.eeworld.com.cn/news/ic655167.html
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https://h5.stcn.com/pages/detail/detail?id=819859&jump_type=reported_info
[4] EEWorld: Dialogue with Renesas Zhao Mingyu: Be a trustworthy partner of China’s automotive industry. 2023.7.28.
https://news.eeworld.com.cn/qcdz/ic647213.html?ipcity__1865=7q0OBKGK7IPfgDBqDTeeu29bYitDObtKeD
[5] EEWorld: Texas Instruments Wang Yunjian: There is huge room for growth in the automotive and robotics markets. 2023.11.21.
https://news.eeworld.com.cn/mndz/ic656078.html