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Cadence and TSMC collaborate to accelerate the development of mobile, artificial intelligence and ultra-large-scale computing applications based on N3 and N4 processes

Latest update time:2021-05-31
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Customers from both parties have used certified Cadence digital processes and customized/simulation tool suites to successfully tape out test chips on TSMC's advanced processes.

Shanghai, China, May 31, 2021 - Cadence Electronics (Cadence, Inc., NASDAQ: CDNS) announced today that the company will expand its cooperation with TSMC to provide integrated Cadence® digital process and Customization/simulation tool suite to accelerate mobile, artificial intelligence and hyperscale computing application design.


Mutual customers of Cadence and TSMC have successfully tape-out of test chips using digital and custom/analog tools. As part of the collaboration, Cadence's digital and custom/analog tools have been optimized and process certified for TSMC N3 and N4 process technologies, supporting the latest Design Rule Manual (DRM) certification and SPICE correlation. Corresponding N3 and N4 process process design kits (PDKs) are now available.


This suite of digital and custom tools supports Cadence's Intelligent System Design (Intelligent System Design ) strategy, which is designed to help customers achieve superior system-on-chip design.


To learn more about Cadence's digital and custom advanced process node solutions, visit www.cadence.com/go/advndn34.com.


Digital process certification for N3 and N4 processes


Cadence digital process tools are finely optimized for the TSMC N3 process and have now been certified to provide customers with better power, performance and cost (PPA) and shorten product time to market.


The complete RTL-GDS process includes the Innovus Implementation System design implementation system, Liberate Characterization Solution parameter characterization solution, Quantus Extraction Solution extraction solution, Tempus Timing Signoff Solution timing signoff solution and ECO Option, and for Voltus IC Power Integrity Solution for electromigration and IR drop analysis . In addition, Genus Synthesis Solution and its predictive iSpatial technology also support this process.


The Cadence tool suite enables customers to successfully design mobile, artificial intelligence and hyperscale computing applications, providing multiple powerful features, including: advanced rules support from synthesis to signoff ECO, mixed-height cell rows with full-flow support; including multiple heights Large library of , voltage threshold (VT ) and drive strength cells; ultra-low voltage cell characterization and timing analysis accuracy.


N3 and N4 process

Custom/Simulation Tool Suite Certification


TSMC and Cadence have been continuously collaborating to optimize customized IC design methodologies and meet complex simulation requirements in Cadence's Virtuoso ® and Specter ® environments to improve the overall efficiency of design engineers.


In this collaboration, Cadence also provides an enhanced customized IC design reference flow (CDRF), and the Virtuoso Design Platform design platform and Specter Simulation Platform simulation platform have obtained TSMC N3 and N4 process certification. In addition, the Virtuoso platform is tightly integrated with the Innovus Implementation System design and implementation system, providing an integrated unified design environment for customers using TSMC's advanced processes for mixed-signal design.


Customized IC design flow for TSMC N3 and N4 processes, with enhancements including an enhanced N3 schematic design migration flow and advanced coloring support for N3 and N4 processes.


"Through our deep collaboration with Cadence, we provide the certification process and PDK our customers need to quickly adopt TSMC's advanced N3 and N4 processes. " said Suk Lee, Vice President of Design Infrastructure Management at TSMC. "We We have seen our customers successfully complete test chip design and tape-out on the latest advanced processes and look forward to our continued partnership with Cadence to enable next-generation designs for mobile, automotive, artificial intelligence and hyperscale applications. "


"Thanks to our latest collaboration with TSMC, our joint customers can take advantage of Cadence's digital processes and custom tool flows on TSMC's N3 and N4 processes." Senior Vice President, Digital and Signoff, Cadence Corporation "Our customers have already seen positive results, and we look forward to implementing more amazing innovations - all driven by our relentless pursuit of system-on-chip design excellence," said Dr. Chin-Chi Teng, general manager of the



About Cadence

With more than 30 years of expertise in computing software, Cadence is a key leader in the electronic design industry. Based on the company's intelligent system design strategy, Cadence is committed to providing software, hardware and IP products to help electronic design concepts become reality. Cadence's customers are the most innovative companies around the world, delivering everything from chips and circuit boards to the most dynamic application markets such as consumer electronics, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and medical. Systematic excellence in electronics. Cadence has been ranked among Fortune magazine's 100 Best Companies to Work For for seven consecutive years. For more information, please visit the company's website at cadence.com.



© 2021 Cadence Design Systems, Inc. All rights reserved. All rights reserved worldwide. Cadence, the Cadence logo and other Cadence marks listed at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other marks are the property of their respective owners.



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