GigaDevice (stock code 603986), the industry's leading supplier of semiconductor devices, announced that it is the first to launch SPI NOR Flash - GD25LE128EXH in 3mm×3mm×0.4mm FO-USON8 package. Its maximum thickness is only 0.4mm and its capacity is as high as 128Mb. , is currently the smallest plastic packaging product that can be achieved with this capacity in the industry. It can meet the needs of large-capacity code storage while providing maximum freedom of compact design.
In recent years, with the rapid development of applications such as the Internet of Things, wearables, health monitoring, and Netcom, market demands have varied. It is necessary not only to provide rich functions in exquisite and compact product forms, but also to have extremely low power consumption to ensure that the product long hours of work. As an important code storage unit in these devices, SPI NOR Flash needs to provide smaller, thinner, and lighter product options to meet these changing application requirements.
GD25LE系列SPI NOR Flash是兆易创新旗舰型低功耗产品，此次新推出的3mm×3mm×0.4mm FO-USON8 GD25LE128EXH产品延续了LE系列的优异性能，其最高时钟频率133MHz，数据吞吐量高达532Mbit/s，极大提升了客户的系统访问速度和开机效率，同时在4通道133MHz时，读功耗仅为6mA，与行业同类产品相比，降低了45%的功耗，有效延长设备的续航时间。并且，更为重要的是GD25LE128EXH实现了128Mb容量产品上的超小尺寸，此前，业界128Mb容量产品的主流封装为6mm×5mm×0.8mm WSON8，而GD25LE128EXH采用的3mm×3mm×0.4mm超小尺寸的新型封装，面积缩小达70%，厚度减薄50%，能够显著节省85%的空间体积，并节省材料成本。
除了尺寸优势显著提升之外，3mm×3mm×0.4mm FO-USON8 GD25LE128EXH与64Mb及以下容量的3mm×4mm×0.6mm USON8封装产品引脚兼容，无需调整PCB布局即可快速升级容量至128Mb，对于不同容量需求的方案，进一步简化了其兼容性要求的设计。
Mr. Chen Hui, Executive Director of GigaDevice Innovation Storage Division, said
: "As the industry's leading Fabless chip supplier, GigaDevice is not only an advocate of innovative technology, but also a practitioner of advanced technology. This time we are the first to launch ultra-small size The 128Mb SPI NOR Flash in 3mm×3mm×0.4mm FO-USON8 package perfectly meets the industry’s requirements for miniaturization and high integration, and the low power consumption characteristics of GD25LE128EXH, the first product based on this packaging technology, also makes It is suitable for any battery-powered product design. With the continuous upgrading of smart devices in the future, GigaDevice foresees that large-capacity, small-size, and low-power consumption SPI NOR Flash products will continue to be needed by the industry. The company is planning to develop other capacity and smaller size storage products through advanced packaging and storage technologies to provide customers with more diverse choices."
GD25LE128EXH is now in mass production. The same series of 3mm×2mm×0.4mm FO-USON8 package product GD25LE64E will also provide samples at the end of May.
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