Core News丨Shekou School in Nanshan District, Shenzhen held the unveiling ceremony of "Youth China Core"
Latest update time：2023-07-10 19:27
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❶The
Shekou School in Nanshan District, Shenzhen City held the unveiling ceremony of "Youth China Core"
On the morning of July 6, Peking University Shenzhen Key Laboratory of System Chip Design, Nanshan District Shekou School, Shenzhen Hongde Charity Foundation and other units held the unveiling ceremony of "Youth China Core Engineering Base School" at Shenzhen Nanshan District Shekou School. The launching ceremony of the "China Chip" special fund and the awarding ceremony of the "Youth China Chip Project" special fund school. This conference was co-sponsored by the Shekou School and Guidance of Nanshan District, Shenzhen City, and the Shenzhen Chip Key Laboratory of Peking University.
❷Advanced
industrial vision sensor company “Xinsuan Technology” completed PreA round of financing
Recently, Xinsuan Technology announced the completion of its PreA round of financing, led by Shunwei Capital, with participation from Huafang Capital and old shareholder Sequoia China. The funds raised in this round will be used to further enhance the mass production capacity of core products such as industrial code readers, and to increase multi-category research and development in the field of advanced industrial vision sensors. Ningbo Xinsuan Technology was established in 2019 and is mainly engaged in the research and development, design and sales of industrial machine vision sensor products. The core R&D team of Xinshuan has been deeply involved in the field of industrial machine vision for 7 years. It has decoding and reading algorithms with completely independent intellectual property rights, and has launched a series of industrial high-performance fixed code reader products such as R275-A.
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华为启动基于昇腾AI的大模型联合创新，并宣布昇腾AI集群升级，推出首个万卡AI集群
昇腾人工智能产业高峰论坛在上海举办。论坛现场，大模型联合创新启动，26家企业、科研院所与华为将共同基于昇腾AI进行基础大模型与行业大模型应用创新。同时，华为携手伙伴联合发布昇腾AI大模型训推一体化解决方案，有23家昇腾AI伙伴推出AI服务器、智能边缘与终端新品。此外，华为宣布昇腾AI集群全面升级，集群规模从最初的4000卡集群扩展至16000卡，是业界首个万卡AI集群，拥有更快的训练速度和30天以上的稳定训练周期，十倍领先业界。
❹Iflytek
Hu Guoping: A general large model was released on October 24th, fully benchmarked against ChatGPT, and fully surpassed the service in Chinese
7月6日，2023世界人工智能大会，科大讯飞高级副总裁、认知智能全国重点实验室主任胡国平在昇腾人工智能产业高峰论坛上透露，10月24日，科大讯飞将发布通用大模型，全面对标ChatGPT ，并且中文上全面超越。
❶Hon
Hai will OEM a new generation of robots for Japanese robotics company TX
Japanese robotics company Telexistence (TX) recently announced the completion of a US$170 million Series B financing and the establishment of a partnership with Hon Hai Group. Hon Hai will manufacture TX's next-generation robot "GHOST". TX said that in addition to the continued participation of Monoful Venture Partners, KDDI Open Innovation Fund and Airbus Ventures, this round of financing also attracted participation from institutions such as SoftBank, Hon Hai Co-GP Fund and Globis Capital Partners.
❷Russian
state-owned enterprise Rostec is preparing to increase germanium production to meet domestic demand
According to Reuters, Russian state-owned enterprise Rostec said on Wednesday that Russia is ready to increase production of germanium for the semiconductor and defense industries to meet domestic demand after China announced restrictions on germanium exports. Rostec said the company's Shvabe Holding can produce up to 20 tons of germanium per year and currently has a capacity utilization rate of 30%. "If foreign supplies are restricted and domestic demand grows, (we) are prepared to increase production to meet the needs of domestic Russian consumers."
❸It
is reported that Google’s independently customized Pixel mobile phone chip will be delayed by one year and will be manufactured by TSMC instead.
Google reportedly independently develops chips for its Pixel smartphones. But so far, things haven't been going well. According to the original plan, Google will use this chip to replace Tensor G3 in 2024. Tensor G3 is co-designed by Google and Samsung. People familiar with the matter said Google's plan has been delayed for at least a year. Next year, Google will continue to cooperate with Samsung and will not launch this completely independent customized chip until 2025, which is internally code-named "Laguna" (Tensor G5). By then, Google will transfer the foundry manufacturing task of this chip to TSMC.
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